Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
3 |
2.7 V |
166 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.7 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3510 mA |
1073741824 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
18.9 mm |
933 MHz |
Not Qualified |
77309411328 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
1.062 Amp |
133.35 mm |
20 ns |
||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2925 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
TIN SILVER COPPER |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
266 MHz |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
.5 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6840 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
166 MHz |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
1.15 Amp |
.7 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1782 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
400 MHz |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.18 Amp |
.4 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.75 ns |
||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
70 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
28.725 mm |
2.99 mm |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
.7 ns |
||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1160 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
30.15 mm |
933 MHz |
3.8 mm |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
.096 Amp |
67.6 mm |
.195 ns |
|||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1460 mA |
8388608 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.012 Amp |
.75 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2885 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
95 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
200 MHz |
Not Qualified |
2415919104 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.522 Amp |
.6 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4294967296 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
4GX72 |
4G |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.25 mm |
4.3 mm |
309237645312 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1320 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
200 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.06 Amp |
.6 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
7140 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
95 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
267 MHz |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
.5 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5940 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4800 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
100 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
.8 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2060 mA |
1073741824 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
533 MHz |
4 mm |
Not Qualified |
77309411328 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
260 |
.46 Amp |
133.35 mm |
.3 ns |
||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2280 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
3.8 mm |
400 MHz |
30 mm |
Not Qualified |
17179869184 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.24 Amp |
67.6 mm |
.4 ns |
|||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2680 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
166 MHz |
Not Qualified |
4294967296 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1665 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
400 MHz |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.18 Amp |
133.35 mm |
.4 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4420 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2920 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
166 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
|||||||||||||||||||
Samsung |
DDR DRAM MODULE |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
256MX72 |
256M |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
|||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1360 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3 |
1.9 V |
400 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.064 Amp |
.4 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1300 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
133 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.012 Amp |
.75 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
7590 mA |
268435456 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
19327352832 bit |
2.3 V |
AUTO/SELF REFRESH |
.63 Amp |
.75 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5430 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
133 MHz |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
.38 Amp |
.75 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2000 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
200 MHz |
Not Qualified |
2415919104 bit |
2.5 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.03 Amp |
.65 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
Not Qualified |
17179869184 bit |
1.283 V |
AUTO/SELF REFRESH |
133.35 mm |
.225 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2 |
2.7 V |
Not Qualified |
2147483648 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
|||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5580 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3060 mA |
536870912 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
18.9 mm |
800 MHz |
Not Qualified |
38654705664 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.846 Amp |
133.35 mm |
20 ns |
||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2800 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
200 MHz |
Not Qualified |
2147483648 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
|||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3785 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
200 MHz |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
230 |
.724 Amp |
.6 ns |
|||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2280 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
400 MHz |
Not Qualified |
17179869184 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.24 Amp |
.4 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6600 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
95 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
TIN SILVER COPPER |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
200 MHz |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.6 ns |
|||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1 |
2.7 V |
133 MHz |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1520 mA |
1073741824 words |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
1GX64 |
1G |
0 Cel |
DUAL |
R-PDMA-N204 |
667 MHz |
Not Qualified |
68719476736 bit |
.255 ns |
||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
128MX64 |
128M |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
.6 ns |
||||||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4395 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3290 mA |
67108864 words |
YES |
COMMON |
2.6 |
2.6 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
200 MHz |
Not Qualified |
4831838208 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2385 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
95 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.575 V |
667 MHz |
Not Qualified |
19327352832 bit |
1.425 V |
AUTO/SELF REFRESH |
.18 Amp |
.255 ns |
|||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1960 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2 |
1.9 V |
200 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
.128 Amp |
.6 ns |
|||||||||||||||||
Samsung |
DDR DRAM MODULE |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
128MX72 |
128M |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
|||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
3.8 mm |
30 mm |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
67.6 mm |
||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6550 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
133 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2720 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
30 mm |
267 MHz |
3.8 mm |
Not Qualified |
34359738368 bit |
1.7 V |
AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM |
260 |
.24 Amp |
67.6 mm |
.5 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.