RAMBUS DRAM DRAM 438

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

TC59R1809HK

Toshiba

RAMBUS DRAM

COMMERCIAL

36

LSSOP

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

GULL WING

SYNCHRONOUS

2097152 words

YES

3.3

9

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

3-STATE

2MX9

2M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G36

3.6 V

1.7 mm

11 mm

Not Qualified

18874368 bit

3 V

SELF REFRESH

e0

25 mm

TC59YM816BKG32C

Toshiba

RAMBUS DRAM

107

TFBGA

16384

SQUARE

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

1.8

1.8

16

MICROELECTRONIC ASSEMBLY

BGA104,11X16,50/32

DRAMs

.8 mm

3-STATE

16MX16

16M

DUAL

1

R-XDMA-N240

1.86 V

1.2 mm

Not Qualified

268435456 bit

1.74 V

AUTO/SELF REFRESH

TC59RM818MB-7

Toshiba

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX18

16M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B92

2.63 V

1.2 mm

711 MHz

9.057 mm

Not Qualified

301989888 bit

2.37 V

SELF CONTAINED REFRESH

e0

17.349 mm

50 ns

TC59RM716MB-6

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

600 MHz

11.66 mm

Not Qualified

134217728 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59YM916BKG32A

Toshiba

RAMBUS DRAM

100

TFBGA

32768

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

1450 mA

33554432 words

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA100,11X16,50/32

DRAMs

.8 mm

3-STATE

32MX16

32M

BOTTOM

1

R-PBGA-B100

1.86 V

1.2 mm

14.56 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

.00005 Amp

15.18 mm

TC59RM818MB-6

Toshiba

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX18

16M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B92

2.63 V

1.2 mm

600 MHz

9.057 mm

Not Qualified

301989888 bit

2.37 V

SELF CONTAINED REFRESH

e0

17.349 mm

53 ns

TC59R0808HK

Toshiba

RAMBUS DRAM

COMMERCIAL

36

LSSOP

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

GULL WING

SYNCHRONOUS

1048576 words

YES

3.3

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G36

3.6 V

1.7 mm

11 mm

Not Qualified

8388608 bit

3 V

SELF REFRESH

e0

25 mm

TC59RM718RB-7

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

711 MHz

11.66 mm

Not Qualified

150994944 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59RM718MB-6

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

600 MHz

11.66 mm

Not Qualified

150994944 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59RM718GB-8

Toshiba

RAMBUS DRAM

54

LBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

18

GRID ARRAY, LOW PROFILE

1.27 mm

8MX18

8M

BOTTOM

1

R-PBGA-B54

2.63 V

1.3 mm

11.66 mm

Not Qualified

150994944 bit

2.37 V

SELF CONTAINED REFRESH

12.92 mm

TC59RM716RB-7

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

711 MHz

11.66 mm

Not Qualified

134217728 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59RM816MB-8

Toshiba

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX16

16M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B92

2.63 V

1.2 mm

800 MHz

9.057 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

e0

17.349 mm

45 ns

TC59YM916BKG24A

Toshiba

RAMBUS DRAM

100

TFBGA

32768

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA100,11X16,50/32

DRAMs

.8 mm

3-STATE

32MX16

32M

BOTTOM

1

R-PBGA-B100

1.86 V

1.2 mm

14.56 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

15.18 mm

TC59YM916BKG32B

Toshiba

RAMBUS DRAM

100

TFBGA

32768

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

1450 mA

33554432 words

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA100,11X16,50/32

DRAMs

.8 mm

3-STATE

32MX16

32M

BOTTOM

1

R-PBGA-B100

1.86 V

1.2 mm

14.56 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

.00005 Amp

15.18 mm

TC59RM716GB-8

Toshiba

RAMBUS DRAM

54

LBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, LOW PROFILE

BGA54,7X9,50

DRAMs

1.27 mm

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B54

2.63 V

1.3 mm

800 MHz

11.66 mm

Not Qualified

134217728 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59RM716RB-6

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

600 MHz

11.66 mm

Not Qualified

134217728 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59RM718MB-7

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

711 MHz

11.66 mm

Not Qualified

150994944 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59RM716RB-8

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

800 MHz

11.66 mm

Not Qualified

134217728 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59R0409VK

Toshiba

RAMBUS DRAM

1

CMOS

524288 words

5

9

512KX9

512K

1

5.5 V

Not Qualified

4718592 bit

4.5 V

TC59RM718RB-6

Toshiba

RAMBUS DRAM

62

TFBGA

16384

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

COMMON

2.5

1.8/2.5,2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA62,12X9,40/32

DRAMs

.8 mm

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B62

2.63 V

1.2 mm

600 MHz

11.66 mm

Not Qualified

150994944 bit

2.37 V

SELF CONTAINED REFRESH

e0

12.92 mm

TC59YM916BKG40C

Toshiba

RAMBUS DRAM

100

TFBGA

32768

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA100,11X16,50/32

DRAMs

.8 mm

3-STATE

32MX16

32M

BOTTOM

1

R-PBGA-B100

1.86 V

1.2 mm

14.56 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

15.18 mm

TC59YM816BKG24A

Toshiba

RAMBUS DRAM

107

TFBGA

16384

SQUARE

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

1.8

1.8

16

MICROELECTRONIC ASSEMBLY

BGA104,11X16,50/32

DRAMs

.8 mm

3-STATE

16MX16

16M

DUAL

1

R-XDMA-N240

1.86 V

1.2 mm

Not Qualified

268435456 bit

1.74 V

AUTO/SELF REFRESH

TC59YM816BKG40C

Toshiba

RAMBUS DRAM

107

TFBGA

16384

SQUARE

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

1.8

1.8

16

MICROELECTRONIC ASSEMBLY

BGA104,11X16,50/32

DRAMs

.8 mm

3-STATE

16MX16

16M

DUAL

1

R-XDMA-N240

1.86 V

1.2 mm

Not Qualified

268435456 bit

1.74 V

AUTO/SELF REFRESH

TC59RM718GB-6

Toshiba

RAMBUS DRAM

54

LBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

18

GRID ARRAY, LOW PROFILE

1.27 mm

8MX18

8M

BOTTOM

1

R-PBGA-B54

2.63 V

1.3 mm

11.66 mm

Not Qualified

150994944 bit

2.37 V

SELF CONTAINED REFRESH

12.92 mm

TC59RM816MB-6

Toshiba

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX16

16M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B92

2.63 V

1.2 mm

600 MHz

9.057 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

e0

17.349 mm

53 ns

TC59R0409SVP

Toshiba

RAMBUS DRAM

OTHER

32

SIP

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

THROUGH-HOLE

SYNCHRONOUS

524288 words

YES

5

9

IN-LINE

.65 mm

100 Cel

3-STATE

512KX9

512K

0 Cel

SINGLE

1

R-PSIP-T32

5.5 V

11.5 mm

1.2 mm

Not Qualified

4718592 bit

4.5 V

SELF CONTAINED REFRESH; RAMBUS SIGNALING LOGIC INTERFACE; OPTEMP SPECIFIED AS TJ

25 mm

TC59RM816MB-7

Toshiba

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX16

16M

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B92

2.63 V

1.2 mm

711 MHz

9.057 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

e0

17.349 mm

50 ns

TC59YM816BKG32B

Toshiba

RAMBUS DRAM

107

TFBGA

16384

SQUARE

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

1.8

1.8

16

MICROELECTRONIC ASSEMBLY

BGA104,11X16,50/32

DRAMs

.8 mm

3-STATE

16MX16

16M

DUAL

1

R-XDMA-N240

1.86 V

1.2 mm

Not Qualified

268435456 bit

1.74 V

AUTO/SELF REFRESH

TC59YM916AMG24A

Toshiba

RAMBUS DRAM

108

TBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE

1.27 mm

32MX16

32M

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B108

1.86 V

1.2 mm

Not Qualified

536870912 bit

1.74 V

SELF CONTAINED REFRESH

e1

UPD48830LG6-A50

Renesas Electronics

RAMBUS DRAM

COMMERCIAL

72

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

480 mA

1048576 words

COMMON

3.3

3.3

8

SMALL OUTLINE, SHRINK PITCH

SSOP72,.5

DRAMs

.635 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G72

250 MHz

Not Qualified

8388608 bit

e0

.0002 Amp

UPD488448FB-C60-53-DQ2

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

16

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

600 MHz

Not Qualified

134217728 bit

e0

UPD488488FB-C71-45-DP1

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

18

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

711 MHz

Not Qualified

150994944 bit

e0

UPD48830LG6-A45

Renesas Electronics

RAMBUS DRAM

COMMERCIAL

72

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

440 mA

1048576 words

COMMON

3.3

3.3

8

SMALL OUTLINE, SHRINK PITCH

SSOP72,.5

DRAMs

.635 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G72

225 MHz

Not Qualified

8388608 bit

e0

.0002 Amp

UPD488448FF-C60-53-DQ2

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

16

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

600 MHz

Not Qualified

134217728 bit

e0

UPD488488FB-C80-45-DP2

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

18

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

800 MHz

Not Qualified

150994944 bit

e0

UPD488170LVN-A50

Renesas Electronics

RAMBUS DRAM

COMMERCIAL

32

1024

PLASTIC/EPOXY

YES

CMOS

480 mA

2097152 words

COMMON

3.3

3.3

9

SMSIP32,25

DRAMs

2.54 mm

70 Cel

3-STATE

2MX9

2M

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

250 MHz

Not Qualified

18874368 bit

e0

.35 Amp

UPD488170LVN-A45-9

Renesas Electronics

RAMBUS DRAM

COMMERCIAL

32

1024

PLASTIC/EPOXY

YES

CMOS

440 mA

2097152 words

COMMON

3.3

3.3

9

SMSIP32,25

DRAMs

2.54 mm

70 Cel

3-STATE

2MX9

2M

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

225 MHz

Not Qualified

18874368 bit

e0

.125 Amp

UPD488488FB-C60-53-DP2

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

18

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX18

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

600 MHz

Not Qualified

150994944 bit

e0

UPD488385FB-C60-53BF1

Renesas Electronics

RAMBUS DRAM

74

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

570 mA

4194304 words

COMMON

1.8/2.5,2.5

18

GRID ARRAY, FINE PITCH

BGA74,7X16,30

DRAMs

.75 mm

3-STATE

4MX18

4M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B74

600 MHz

Not Qualified

75497472 bit

e0

.006 Amp

UPD488385-C80-45BF1

Renesas Electronics

RAMBUS DRAM

74

BGA

PLASTIC/EPOXY

YES

CMOS

BALL

4194304 words

COMMON

1.8/2.5,2.5

18

GRID ARRAY

BGA74(UNSPEC)

DRAMs

3-STATE

4MX18

4M

Tin/Lead (Sn/Pb)

BOTTOM

800 MHz

Not Qualified

75497472 bit

e0

UPD488448FF-C80-45-DQ2

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

16

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

800 MHz

Not Qualified

134217728 bit

e0

UPD488448FF-C71-45-DQ2

Renesas Electronics

RAMBUS DRAM

62

BGA

16384

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

COMMON

1.8/2.5,2.5

16

GRID ARRAY

BGA62,12X9,40/32

DRAMs

.8 mm

YES

3-STATE

8MX16

8M

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B62

711 MHz

Not Qualified

134217728 bit

e0

UPD488130LG6-A45

Renesas Electronics

RAMBUS DRAM

72

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

440 mA

2097152 words

COMMON

3.3

3.3

8

SMALL OUTLINE, SHRINK PITCH

SSOP72,.5

DRAMs

.635 mm

3-STATE

2MX8

2M

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G72

225 MHz

Not Qualified

16777216 bit

e0

UPD488130LVN-A45-9

Renesas Electronics

RAMBUS DRAM

32

PLASTIC/EPOXY

YES

CMOS

440 mA

2097152 words

COMMON

3.3

3.3

8

SMSIP32,25

DRAMs

2.54 mm

3-STATE

2MX8

2M

Tin/Lead (Sn/Pb)

SINGLE

225 MHz

Not Qualified

16777216 bit

e0

.125 Amp

UPD488170VN-A50-9

Renesas Electronics

RAMBUS DRAM

OTHER

32

1024

PLASTIC/EPOXY

YES

CMOS

2097152 words

COMMON

3.3

3.3

9

SMSIP32,25

DRAMs

2.54 mm

100 Cel

3-STATE

2MX9

2M

0 Cel

Tin/Lead (Sn/Pb)

SINGLE

250 MHz

Not Qualified

18874368 bit

e0

UPD488130

Renesas Electronics

RAMBUS DRAM

32

PLASTIC/EPOXY

YES

CMOS

2097152 words

COMMON

5

5

8

SMSIP32,25

DRAMs

2.54 mm

3-STATE

2MX8

2M

Tin/Lead (Sn/Pb)

SINGLE

Not Qualified

16777216 bit

e0

UPD488170LG6-A45

Renesas Electronics

RAMBUS DRAM

COMMERCIAL

72

SSOP

1024

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

440 mA

2097152 words

COMMON

3.3

3.3

9

SMALL OUTLINE, SHRINK PITCH

SSOP72,.5

DRAMs

.635 mm

70 Cel

3-STATE

2MX9

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G72

225 MHz

Not Qualified

18874368 bit

e0

.33 Amp

UPD488385-C80-50BF1

Renesas Electronics

RAMBUS DRAM

74

BGA

PLASTIC/EPOXY

YES

CMOS

BALL

4194304 words

COMMON

1.8/2.5,2.5

18

GRID ARRAY

BGA74(UNSPEC)

DRAMs

3-STATE

4MX18

4M

Tin/Lead (Sn/Pb)

BOTTOM

800 MHz

Not Qualified

75497472 bit

e0

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.