Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
RAMBUS DRAM |
COMMERCIAL |
36 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2097152 words |
YES |
3.3 |
9 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G36 |
3.6 V |
1.7 mm |
11 mm |
Not Qualified |
18874368 bit |
3 V |
SELF REFRESH |
e0 |
25 mm |
|||||||||||||||||||||||
|
Toshiba |
RAMBUS DRAM |
107 |
TFBGA |
16384 |
SQUARE |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
MICROELECTRONIC ASSEMBLY |
BGA104,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
DUAL |
1 |
R-XDMA-N240 |
1.86 V |
1.2 mm |
Not Qualified |
268435456 bit |
1.74 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
92 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA92,10X18,32 |
DRAMs |
.8 mm |
3-STATE |
16MX18 |
16M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B92 |
2.63 V |
1.2 mm |
711 MHz |
9.057 mm |
Not Qualified |
301989888 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
17.349 mm |
50 ns |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
600 MHz |
11.66 mm |
Not Qualified |
134217728 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
100 |
TFBGA |
32768 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1450 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
32MX16 |
32M |
BOTTOM |
1 |
R-PBGA-B100 |
1.86 V |
1.2 mm |
14.56 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
.00005 Amp |
15.18 mm |
|||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
92 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA92,10X18,32 |
DRAMs |
.8 mm |
3-STATE |
16MX18 |
16M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B92 |
2.63 V |
1.2 mm |
600 MHz |
9.057 mm |
Not Qualified |
301989888 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
17.349 mm |
53 ns |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
COMMERCIAL |
36 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
1048576 words |
YES |
3.3 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G36 |
3.6 V |
1.7 mm |
11 mm |
Not Qualified |
8388608 bit |
3 V |
SELF REFRESH |
e0 |
25 mm |
|||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
711 MHz |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
600 MHz |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
54 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
18 |
GRID ARRAY, LOW PROFILE |
1.27 mm |
8MX18 |
8M |
BOTTOM |
1 |
R-PBGA-B54 |
2.63 V |
1.3 mm |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
12.92 mm |
|||||||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
711 MHz |
11.66 mm |
Not Qualified |
134217728 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
|||||||||||||||||||
Toshiba |
RAMBUS DRAM |
92 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA92,10X18,32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B92 |
2.63 V |
1.2 mm |
800 MHz |
9.057 mm |
Not Qualified |
268435456 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
17.349 mm |
45 ns |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
100 |
TFBGA |
32768 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
32MX16 |
32M |
BOTTOM |
1 |
R-PBGA-B100 |
1.86 V |
1.2 mm |
14.56 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
15.18 mm |
|||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
100 |
TFBGA |
32768 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1450 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
32MX16 |
32M |
BOTTOM |
1 |
R-PBGA-B100 |
1.86 V |
1.2 mm |
14.56 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
.00005 Amp |
15.18 mm |
|||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
54 |
LBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, LOW PROFILE |
BGA54,7X9,50 |
DRAMs |
1.27 mm |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B54 |
2.63 V |
1.3 mm |
800 MHz |
11.66 mm |
Not Qualified |
134217728 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
600 MHz |
11.66 mm |
Not Qualified |
134217728 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
|||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
711 MHz |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
800 MHz |
11.66 mm |
Not Qualified |
134217728 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
|||||||||||||||||||
Toshiba |
RAMBUS DRAM |
1 |
CMOS |
524288 words |
5 |
9 |
512KX9 |
512K |
1 |
5.5 V |
Not Qualified |
4718592 bit |
4.5 V |
||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
600 MHz |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
100 |
TFBGA |
32768 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
32MX16 |
32M |
BOTTOM |
1 |
R-PBGA-B100 |
1.86 V |
1.2 mm |
14.56 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
15.18 mm |
|||||||||||||||||||||||
|
Toshiba |
RAMBUS DRAM |
107 |
TFBGA |
16384 |
SQUARE |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
MICROELECTRONIC ASSEMBLY |
BGA104,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
DUAL |
1 |
R-XDMA-N240 |
1.86 V |
1.2 mm |
Not Qualified |
268435456 bit |
1.74 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||
|
Toshiba |
RAMBUS DRAM |
107 |
TFBGA |
16384 |
SQUARE |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
MICROELECTRONIC ASSEMBLY |
BGA104,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
DUAL |
1 |
R-XDMA-N240 |
1.86 V |
1.2 mm |
Not Qualified |
268435456 bit |
1.74 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
54 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
18 |
GRID ARRAY, LOW PROFILE |
1.27 mm |
8MX18 |
8M |
BOTTOM |
1 |
R-PBGA-B54 |
2.63 V |
1.3 mm |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
12.92 mm |
|||||||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
92 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA92,10X18,32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B92 |
2.63 V |
1.2 mm |
600 MHz |
9.057 mm |
Not Qualified |
268435456 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
17.349 mm |
53 ns |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
OTHER |
32 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
524288 words |
YES |
5 |
9 |
IN-LINE |
.65 mm |
100 Cel |
3-STATE |
512KX9 |
512K |
0 Cel |
SINGLE |
1 |
R-PSIP-T32 |
5.5 V |
11.5 mm |
1.2 mm |
Not Qualified |
4718592 bit |
4.5 V |
SELF CONTAINED REFRESH; RAMBUS SIGNALING LOGIC INTERFACE; OPTEMP SPECIFIED AS TJ |
25 mm |
|||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
92 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA92,10X18,32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B92 |
2.63 V |
1.2 mm |
711 MHz |
9.057 mm |
Not Qualified |
268435456 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
17.349 mm |
50 ns |
||||||||||||||||||||
|
Toshiba |
RAMBUS DRAM |
107 |
TFBGA |
16384 |
SQUARE |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
1.8 |
1.8 |
16 |
MICROELECTRONIC ASSEMBLY |
BGA104,11X16,50/32 |
DRAMs |
.8 mm |
3-STATE |
16MX16 |
16M |
DUAL |
1 |
R-XDMA-N240 |
1.86 V |
1.2 mm |
Not Qualified |
268435456 bit |
1.74 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
108 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE |
1.27 mm |
32MX16 |
32M |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B108 |
1.86 V |
1.2 mm |
Not Qualified |
536870912 bit |
1.74 V |
SELF CONTAINED REFRESH |
e1 |
|||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
COMMERCIAL |
72 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
480 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SSOP72,.5 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G72 |
250 MHz |
Not Qualified |
8388608 bit |
e0 |
.0002 Amp |
|||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
16 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
600 MHz |
Not Qualified |
134217728 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
18 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
711 MHz |
Not Qualified |
150994944 bit |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
COMMERCIAL |
72 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
440 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SSOP72,.5 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G72 |
225 MHz |
Not Qualified |
8388608 bit |
e0 |
.0002 Amp |
|||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
16 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
600 MHz |
Not Qualified |
134217728 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
18 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
800 MHz |
Not Qualified |
150994944 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
COMMERCIAL |
32 |
1024 |
PLASTIC/EPOXY |
YES |
CMOS |
480 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
9 |
SMSIP32,25 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
250 MHz |
Not Qualified |
18874368 bit |
e0 |
.35 Amp |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
COMMERCIAL |
32 |
1024 |
PLASTIC/EPOXY |
YES |
CMOS |
440 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
9 |
SMSIP32,25 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
225 MHz |
Not Qualified |
18874368 bit |
e0 |
.125 Amp |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
18 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
600 MHz |
Not Qualified |
150994944 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
74 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
570 mA |
4194304 words |
COMMON |
1.8/2.5,2.5 |
18 |
GRID ARRAY, FINE PITCH |
BGA74,7X16,30 |
DRAMs |
.75 mm |
3-STATE |
4MX18 |
4M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B74 |
600 MHz |
Not Qualified |
75497472 bit |
e0 |
.006 Amp |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
74 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
4194304 words |
COMMON |
1.8/2.5,2.5 |
18 |
GRID ARRAY |
BGA74(UNSPEC) |
DRAMs |
3-STATE |
4MX18 |
4M |
Tin/Lead (Sn/Pb) |
BOTTOM |
800 MHz |
Not Qualified |
75497472 bit |
e0 |
||||||||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
16 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
800 MHz |
Not Qualified |
134217728 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
62 |
BGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
COMMON |
1.8/2.5,2.5 |
16 |
GRID ARRAY |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
YES |
3-STATE |
8MX16 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B62 |
711 MHz |
Not Qualified |
134217728 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
72 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
440 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SSOP72,.5 |
DRAMs |
.635 mm |
3-STATE |
2MX8 |
2M |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G72 |
225 MHz |
Not Qualified |
16777216 bit |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
32 |
PLASTIC/EPOXY |
YES |
CMOS |
440 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
8 |
SMSIP32,25 |
DRAMs |
2.54 mm |
3-STATE |
2MX8 |
2M |
Tin/Lead (Sn/Pb) |
SINGLE |
225 MHz |
Not Qualified |
16777216 bit |
e0 |
.125 Amp |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
OTHER |
32 |
1024 |
PLASTIC/EPOXY |
YES |
CMOS |
2097152 words |
COMMON |
3.3 |
3.3 |
9 |
SMSIP32,25 |
DRAMs |
2.54 mm |
100 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
250 MHz |
Not Qualified |
18874368 bit |
e0 |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
32 |
PLASTIC/EPOXY |
YES |
CMOS |
2097152 words |
COMMON |
5 |
5 |
8 |
SMSIP32,25 |
DRAMs |
2.54 mm |
3-STATE |
2MX8 |
2M |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
16777216 bit |
e0 |
||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
COMMERCIAL |
72 |
SSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
440 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
9 |
SMALL OUTLINE, SHRINK PITCH |
SSOP72,.5 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G72 |
225 MHz |
Not Qualified |
18874368 bit |
e0 |
.33 Amp |
||||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM |
74 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
4194304 words |
COMMON |
1.8/2.5,2.5 |
18 |
GRID ARRAY |
BGA74(UNSPEC) |
DRAMs |
3-STATE |
4MX18 |
4M |
Tin/Lead (Sn/Pb) |
BOTTOM |
800 MHz |
Not Qualified |
75497472 bit |
e0 |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.