Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
267 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.064 Amp |
.5 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1440 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
333 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.064 Amp |
.45 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1980 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
TIN SILVER COPPER |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
267 MHz |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
.072 Amp |
.5 ns |
||||||||||||||
Samsung |
DDR DRAM MODULE |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
2GX72 |
2G |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
4.3 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
|||||||||||||||||||||||||||||||
Samsung |
DDR4 DRAM MODULE |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
17179869184 words |
1.2 |
8 |
MICROELECTRONIC ASSEMBLY |
16GX8 |
16G |
DUAL |
1 |
R-XDMA-N |
137438953472 bit |
||||||||||||||||||||||||||||||||||||||||
Samsung |
DDR4 DRAM MODULE |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
17179869184 words |
1.2 |
8 |
MICROELECTRONIC ASSEMBLY |
16GX8 |
16G |
DUAL |
1 |
R-XDMA-N |
137438953472 bit |
||||||||||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3420 mA |
1073741824 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.575 V |
30.15 mm |
800 MHz |
4 mm |
Not Qualified |
77309411328 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
1.062 Amp |
133.35 mm |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3050 mA |
1073741824 words |
YES |
COMMON |
1.35 |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30.15 mm |
667 MHz |
4 mm |
Not Qualified |
77309411328 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY |
.9 Amp |
133.35 mm |
.25 ns |
|||||||||||||||
|
Samsung |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2147483648 words |
COMMON |
1.35 |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
2GX72 |
2G |
0 Cel |
DUAL |
R-PDMA-N240 |
667 MHz |
Not Qualified |
154618822656 bit |
.255 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4294967296 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
4GX72 |
4G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30.15 mm |
4 mm |
309237645312 bit |
1.28 V |
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
133.35 mm |
||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1975 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
667 MHz |
Not Qualified |
19327352832 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.76 Amp |
133.35 mm |
20 ns |
||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
920 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
133 MHz |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
5.4 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3 |
3.6 V |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
260 |
5.4 ns |
||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1200 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
3.8 mm |
400 MHz |
30 mm |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.12 Amp |
67.6 mm |
.4 ns |
|||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
.5 mm |
85 Cel |
1GX64 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
1.26 V |
30.15 mm |
3.7 mm |
68719476736 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
69.6 mm |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1180 mA |
536870912 words |
YES |
COMMON |
1.2 |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM260,20 |
DRAMs |
.5 mm |
85 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
1.26 V |
30.15 mm |
1066 MHz |
3.7 mm |
Not Qualified |
34359738368 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
.06 Amp |
69.6 mm |
.18 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1060 mA |
1073741824 words |
YES |
COMMON |
1.35 |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
1GX64 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.45 V |
30.15 mm |
800 MHz |
3.8 mm |
Not Qualified |
68719476736 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
67.6 mm |
.225 ns |
||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
Not Qualified |
8589934592 bit |
1.425 V |
AUTO/SELF REFRESH |
.3 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.255 ns |
||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1680 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
256MX8 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
3.8 mm |
667 MHz |
30 mm |
Not Qualified |
2147483648 bit |
1.425 V |
AUTO/SELF REFRESH |
260 |
.096 Amp |
67.6 mm |
.25 ns |
||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3440 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
256MX64 |
256M |
-40 Cel |
Gold (Au) |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
30.15 mm |
333 MHz |
3.8 mm |
Not Qualified |
17179869184 bit |
1.7 V |
SELF REFRESH; WD-MAX |
e4 |
.112 Amp |
67.6 mm |
||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX64 |
256M |
-40 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
30.15 mm |
3.8 mm |
17179869184 bit |
1.7 V |
SELF REFRESH; WD-MAX |
67.6 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3760 mA |
268435456 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
R-PDMA-N200 |
400 MHz |
Not Qualified |
17179869184 bit |
.112 Amp |
.4 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2780 mA |
536870912 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
R-PDMA-N240 |
333 MHz |
Not Qualified |
34359738368 bit |
.128 Amp |
.45 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.15 mm |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
260 |
133.35 mm |
|||||||||||||||||||||||||
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3123 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
MATTE TIN |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
1.9 V |
30.15 mm |
400 MHz |
3.8 mm |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH; WD-MAX |
e3 |
67.6 mm |
.4 ns |
|||||||||||||
Micron Technology |
DDR2 DRAM MODULE |
COMMERCIAL |
244 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256MX72 |
256M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N244 |
1.9 V |
3.8 mm |
18.2 mm |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO REFRESH |
e4 |
82 mm |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30.5 mm |
4 mm |
77309411328 bit |
1.283 V |
SELF REFRESH; IT ALSO REQUIRES 1.5V NOM; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1700 mA |
134217728 words |
COMMON |
1.35 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.45 V |
30.15 mm |
667 MHz |
2.45 mm |
Not Qualified |
8589934592 bit |
1.283 V |
WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
.048 Amp |
67.6 mm |
.255 ns |
||||||||||||||
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
65 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
R-PDMA-N168 |
133 MHz |
Not Qualified |
1073741824 bit |
.008 Amp |
5.4 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1920 mA |
33554432 words |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N184 |
200 MHz |
Not Qualified |
2147483648 bit |
.02 Amp |
.7 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2680 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
MATTE TIN |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1 |
1.9 V |
30.15 mm |
400 MHz |
3.8 mm |
Not Qualified |
8589934592 bit |
1.7 V |
SELF REFRESH; WD-MAX |
e3 |
.056 Amp |
67.6 mm |
|||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2920 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5,3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDMA-N204 |
1 |
1.575 V |
30.15 mm |
667 MHz |
30 mm |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
e3 |
.096 Amp |
67.6 mm |
|||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
268435456 words |
YES |
COMMON |
1.35 |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
Gold (Au) |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
800 MHz |
3.8 mm |
Not Qualified |
17179869184 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX |
e4 |
.096 Amp |
67.6 mm |
||||||||||||||
Micron Technology |
EDO DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
960 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-XDMA-N72 |
3.6 V |
25.654 mm |
Not Qualified |
134217728 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.004 Amp |
60 ns |
||||||||||||||||
Micron Technology |
EDO DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
960 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N72 |
1 |
3.6 V |
25.654 mm |
Not Qualified |
134217728 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0012 Amp |
60 ns |
|||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512MX64 |
512M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
2.45 mm |
34359738368 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY |
67.6 mm |
||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX72 |
128M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
30.15 mm |
3.8 mm |
9663676416 bit |
1.7 V |
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX |
67.6 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
3.8 mm |
31.75 mm |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
67.6 mm |
||||||||||||||||||||||||
|
Micron Technology |
DDR4 DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
8 |
YES |
COMMON |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
2GX64 |
2G |
1.14 V |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
1612 MHz |
3.9 mm |
137438953472 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
8 |
133.35 mm |
||||||||||||||||||||
Micron Technology |
DDR4 DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1881 mA |
2147483648 words |
4,8 |
YES |
COMMON |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
3-STATE |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
1.26 V |
30.15 mm |
1333 MHz |
3.7 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
.45 Amp |
4,8 |
69.6 mm |
|||||||||||||||||||||
Micron Technology |
DDR4 DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3870 mA |
2147483648 words |
8 |
YES |
COMMON |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM288,33 |
95 Cel |
OPEN-DRAIN |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
1466 MHz |
3.9 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
.396 Amp |
8 |
133.35 mm |
||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
Micron Technology |
DDR4 DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8589934592 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
8GX72 |
8G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
618475290624 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
3.7 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
69.6 mm |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR4 DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1480 mA |
2147483648 words |
YES |
COMMON |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM260,20 |
.5 mm |
95 Cel |
2GX64 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
30.15 mm |
1600 MHz |
3.7 mm |
137438953472 bit |
AUTO/SELF REFRESH; WD-MAX |
.304 Amp |
69.6 mm |
|||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.6 mm |
85 Cel |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
133.35 mm |
||||||||||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
520 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
25.4 mm |
Not Qualified |
268435456 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0006 Amp |
50 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.