Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
256MX64 |
256M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.5 mm |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
128MX72 |
128M |
-40 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
9663676416 bit |
.75 ns |
||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
-40 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
235 |
.75 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX64 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
Not Qualified |
8589934592 bit |
1.425 V |
SELF CONTAINED REFRESH |
e4 |
|||||||||||||||||||||||||||
Micron Technology |
STATIC COLUMN DRAM |
INDUSTRIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
60 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
100 ns |
||||||||||||||||||||||||||
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
INDUSTRIAL |
168 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
32MX64 |
32M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
e4 |
5.4 ns |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
32MX72 |
32M |
-40 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
235 |
.75 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2925 mA |
16777216 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
16MX72 |
16M |
-40 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
1207959552 bit |
.75 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5040 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
128MX72 |
128M |
-40 Cel |
DUAL |
R-PDMA-N184 |
133 MHz |
Not Qualified |
9663676416 bit |
.75 ns |
|||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
INDUSTRIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH |
e0 |
17.17 mm |
80 ns |
||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.75 ns |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
8 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
18 mm |
4 mm |
Not Qualified |
2147483648 bit |
1.425 V |
SELF CONTAINED REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX64 |
512M |
-40 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.575 V |
Not Qualified |
34359738368 bit |
1.425 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.75 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX64 |
512M |
-40 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
3.8 mm |
30 mm |
Not Qualified |
34359738368 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
67.6 mm |
||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX64 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
4 mm |
30.175 mm |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
||||||||||||||||||||||||
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
1.8 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX36 |
16M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
603979776 bit |
1.7 V |
AUTO REFRESH |
18.5 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
4 mm |
30 mm |
Not Qualified |
77309411328 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
||||||||||||||||||||||||
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
1.8 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX18 |
32M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
e0 |
18.5 mm |
|||||||||||||||||||||||||
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
597 mA |
16777216 words |
SEPARATE |
1.8 |
1.5/1.8,1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
200 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH |
e0 |
.026 Amp |
2,4,8 |
18.5 mm |
.5 ns |
|||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX64 |
256M |
-40 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.575 V |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
e4 |
|||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
INDUSTRIAL |
SOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
16777216 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SO(UNSPEC) |
DRAMs |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
Not Qualified |
16777216 bit |
e0 |
50 ns |
||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
128MX72 |
128M |
-40 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
133.35 mm |
||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
128MX64 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
18 |
GRID ARRAY |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
.93 mm |
200 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH |
e0 |
18.5 mm |
.5 ns |
|||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
INDUSTRIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
1MX1 |
1M |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.17 mm |
70 ns |
||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX72 |
256M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.15 mm |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX72 |
256M |
-40 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
3.8 mm |
30 mm |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
67.6 mm |
||||||||||||||||||||||||
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
1.8 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX18 |
32M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
603979776 bit |
1.7 V |
AUTO REFRESH |
e0 |
18.5 mm |
15 ns |
|||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
256MX72 |
256M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
4 mm |
Not Qualified |
19327352832 bit |
1.7 V |
SELF CONTAINED REFRESH; WD-MAX |
e4 |
133.35 mm |
||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
4 mm |
17.9 mm |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
|||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX64 |
256M |
-40 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
16MX64 |
16M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
Not Qualified |
1073741824 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
|||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
INDUSTRIAL |
20 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
90 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
ZIP20,.1 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
-40 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T20 |
5.5 V |
9.35 mm |
2.795 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH |
e0 |
.0002 Amp |
25.295 mm |
60 ns |
||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
288 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
1GX72 |
1G |
-40 Cel |
DUAL |
1 |
R-PDMA-N288 |
1.26 V |
18.9 mm |
4 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
80 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
980 mA |
33554432 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX18 |
32M |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
400 MHz |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
e1 |
.053 Amp |
18.5 mm |
15 ns |
||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5220 mA |
268435456 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
256MX72 |
256M |
-40 Cel |
DUAL |
R-PDMA-N184 |
166 MHz |
Not Qualified |
19327352832 bit |
.09 Amp |
.7 ns |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
700 mA |
8388608 words |
2,4,8 |
COMMON |
1.8 |
1.5/1.8,1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
400 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH |
18.5 mm |
|||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
-40 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.5 mm |
4 mm |
77309411328 bit |
1.425 V |
SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
-40 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
3.8 mm |
38654705664 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
82 mm |
||||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
INDUSTRIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
90 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.32 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
.001 Amp |
24.635 mm |
60 ns |
||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.5 mm |
85 Cel |
1GX72 |
1G |
-40 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
30.15 mm |
4 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
80 mm |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
256MX64 |
256M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.5 mm |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
|||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
16MX72 |
16M |
-40 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
235 |
.9 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.8 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM |
INDUSTRIAL |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
1.8 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX36 |
16M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
603979776 bit |
1.7 V |
AUTO REFRESH |
e1 |
18.5 mm |
||||||||||||||||||||||||
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
INDUSTRIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
16MX64 |
16M |
-40 Cel |
DUAL |
R-PDMA-N168 |
133 MHz |
Not Qualified |
1073741824 bit |
.008 Amp |
5.4 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.