Samsung DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

KMM5328100CKG-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

2048

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

816 mA

8388608 words

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

268435456 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.016 Amp

60 ns

K4S561632N-LI75T

Samsung

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

80 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G54

1

133 MHz

Not Qualified

268435456 bit

e3

260

.002 Amp

1,2,4,8

5.4 ns

K4T51163QC-ZCE7T

Samsung

DDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

340 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B84

3

400 MHz

Not Qualified

536870912 bit

260

.008 Amp

4,8

.4 ns

K4H560838H-UCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

280 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN BISMUTH

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e6

260

.003 Amp

2,4,8

22.22 mm

.7 ns

KM44C1010AZ-10

Samsung

FAST PAGE DRAM

COMMERCIAL

20

ZIP

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

85 mA

1048576 words

NO

COMMON

5

5

4

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

70 Cel

3-STATE

1MX4

1M

0 Cel

TIN LEAD

ZIG-ZAG

1

R-PZIP-T20

5.5 V

10.16 mm

2.96 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

26.165 mm

100 ns

M966G0225MQ0-C70

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

640 mA

2097152 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX64

2M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

143 MHz

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

.008 Amp

5.5 ns

M368L6423FTN-CCC

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3400 mA

67108864 words

YES

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

200 MHz

Not Qualified

4294967296 bit

2.5 V

AUTO/SELF REFRESH

.65 ns

KMM5321204AW-6

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

320 mA

1048576 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

16

DRAMs

1.27 mm

70 Cel

3-STATE

1MX32

1M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

19.05 mm

Not Qualified

33554432 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.002 Amp

60 ns

KMM372E3200CK-6

Samsung

EDO DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

33554432 words

5

72

MICROELECTRONIC ASSEMBLY

70 Cel

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

Not Qualified

2415919104 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

60 ns

K4S64323LF-SS1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

2097152 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

2MX32

2M

-25 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

2.7 V

1.4 mm

100 MHz

11 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

e0

.0005 Amp

1,2,4,8

13 mm

7 ns

KM44C4110ASLK-7

Samsung

FAST PAGE DRAM

COMMERCIAL

24

SOJ

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE

SOJ24/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J24

5.5 V

3.68 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0002 Amp

17.145 mm

70 ns

K4F170811C-BC50

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

2097152 words

NO

COMMON

5

5

8

SMALL OUTLINE

SOJ28,.34

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J28

5.5 V

3.76 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

18.42 mm

50 ns

KMM372E803CS-6

Samsung

EDO DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

990 mA

8388608 words

COMMON

5

5

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

8MX72

8M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

Not Qualified

603979776 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

60 ns

K4M563233E-EC1L0

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

3

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

13 mm

7 ns

K4P170411C-B6000

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

4194304 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

4MX4

4M

0 Cel

DUAL

1

R-PDSO-J28

5.5 V

3.76 mm

7.62 mm

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

18.42 mm

60 ns

K4H1G0438A-UCCC0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

250 mA

268435456 words

2,4,8

YES

COMMON

2.6

2.6

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

256MX4

256M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

1073741824 bit

2.5 V

AUTO/SELF REFRESH

.015 Amp

2,4,8

22.22 mm

.65 ns

M368L6423ETM-CC5

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3320 mA

67108864 words

YES

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

233 MHz

Not Qualified

4294967296 bit

2.5 V

AUTO/SELF REFRESH

.65 ns

M474A1G43EB1-CPB/RC

Samsung

DDR DRAM MODULE

KM48C2000ALLT-6

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

80 mA

2097152 words

YES

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

18.41 mm

60 ns

M391B1G73QH0-YK0

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.35

72

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

1GX72

1G

0 Cel

DUAL

1

R-XDMA-N240

1.45 V

30.15 mm

4 mm

77309411328 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX

133.35 mm

K4H510438B-ZCCC0

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

2.6

4

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

128MX4

128M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.5 V

AUTO/SELF REFRESH

e1

12 mm

.65 ns

M393T6450FZA-CE6

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

95 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N240

2

1.9 V

333 MHz

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

.45 ns

K4M511633C-RG1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1 mm

10 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

30

240

11.5 mm

7 ns

M391B2873GB0-K00

Samsung

DDR3 DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.5

72

MICROELECTRONIC ASSEMBLY

1 mm

95 Cel

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

30.15 mm

9663676416 bit

1.425 V

AUTO/SELF REFRESH

133.35 mm

.225 ns

K4D263238E-GC250

Samsung

DDR1 DRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

2.8

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

65 Cel

4MX32

4M

0 Cel

BOTTOM

1

S-PBGA-B144

2.94 V

1.4 mm

12 mm

Not Qualified

134217728 bit

2.66 V

AUTO/SELF REFRESH

12 mm

.55 ns

K4H560838E-GCA2

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

250 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

133 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

14 mm

.75 ns

K4S51163LF-YC750

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

30

240

11.5 mm

5.4 ns

KMMR18R86C-RG6

Samsung

RAMBUS DRAM MODULE

184

DIMM

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

50331648 words

COMMON

1.8/2.5,2.5

18

MICROELECTRONIC ASSEMBLY

DIMM184,40

DRAMs

1 mm

3-STATE

48MX18

48M

DUAL

R-PDMA-N184

600 MHz

Not Qualified

905969664 bit

M381L1713BT0-CA2

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

Other Memory ICs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

133 MHz

Not Qualified

1207959552 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

M366S3253CTS-L7C

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1760 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

133 MHz

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

.016 Amp

5.4 ns

MR18R0828AN1-CG6

Samsung

RAMBUS DRAM MODULE

184

DIMM

RECTANGULAR

UNSPECIFIED

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

COMMON

2.5

1.8/2.5,2.5

18

MICROELECTRONIC ASSEMBLY

DIMM184,40

DRAMs

1 mm

3-STATE

64MX18

64M

DUAL

1

R-XDMA-N184

2.63 V

600 MHz

Not Qualified

1207959552 bit

2.37 V

SELF CONTAINED REFRESH

53.3 ns

KM48V2004ALTR-6

Samsung

EDO DRAM

COMMERCIAL

28

TSOP2-R

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

2097152 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

YES

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

3.6 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

18.41 mm

60 ns

K4F171612C-JC500

Samsung

FAST PAGE DRAM

COMMERCIAL

42

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

1048576 words

NO

COMMON

3.3

3.3

16

SMALL OUTLINE

SOJ42,.44

DRAMs

1.27 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

DUAL

1

R-PDSO-J42

1

3.6 V

3.76 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.0005 Amp

27.31 mm

50 ns

K4H280438E-TLA00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

32MX4

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

22.22 mm

.8 ns

K4Y50084UC-JCC40

Samsung

RAMBUS DRAM

OTHER

104

TBGA

32768

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

1360 mA

67108864 words

YES

COMMON

1.8

1.8

8

GRID ARRAY, THIN PROFILE

BGA104,11X16,50/32

DRAMs

1.27 mm

100 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B104

2

1.89 V

1.13 mm

14 mm

Not Qualified

536870912 bit

1.71 V

SELF CONTAINED REFRESH

e1

.025 Amp

14.5 mm

28 ns

KMM5368100AK-7

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

2048

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

8388608 words

5

36

MICROELECTRONIC ASSEMBLY

18

70 Cel

3-STATE

8MX36

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

301989888 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

70 ns

M390S1620FT1-C7A

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2930 mA

16777216 words

YES

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

133 MHz

Not Qualified

1207959552 bit

3 V

AUTO/SELF REFRESH

.02 Amp

5.4 ns

K4S56323LF-FC600

Samsung

SYNCHRONOUS DRAM

OTHER

90

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

30

240

13 mm

5.4 ns

K4S56323LF-HN1H0

Samsung

SYNCHRONOUS DRAM

OTHER

90

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX32

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e1

13 mm

7 ns

K4T51083QC-ZLD60

Samsung

DDR2 DRAM

OTHER

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

3

1.9 V

1.2 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

11 mm

.45 ns

KM48C512SLT-7

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

105 mA

524288 words

NO

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0001 Amp

18.41 mm

70 ns

K4S561632A-TC80T

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

210 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

125 MHz

Not Qualified

268435456 bit

e0

.002 Amp

1,2,4,8

6 ns

M391T6553CZ0-CF7

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2205 mA

67108864 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

400 MHz

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.072 Amp

.4 ns

KM48V512DJ-6

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

70 mA

524288 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J28

3.6 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

18.42 mm

60 ns

K4M563233E-ML1L0

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

3

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

13 mm

7 ns

KM416V4100BS-6T

Samsung

FAST PAGE DRAM

COMMERCIAL

50

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

110 mA

4194304 words

NO

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G50

Not Qualified

67108864 bit

e0

.0005 Amp

60 ns

K4S511632C-KL7C

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

440 mA

33554432 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.004 Amp

1,2,4,8

22.22 mm

5.4 ns

K4E660812E-TI45T

Samsung

EDO DRAM

INDUSTRIAL

32

TSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

120 mA

8388608 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP32,.46

DRAMs

1.27 mm

85 Cel

3-STATE

8MX8

8M

-40 Cel

DUAL

R-PDSO-G32

Not Qualified

67108864 bit

.001 Amp

45 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.