Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1820 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.34 Amp |
.75 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
50 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
5 |
16 |
SMALL OUTLINE |
70 Cel |
4MX16 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G50 |
5.5 V |
Not Qualified |
67108864 bit |
4.5 V |
60 ns |
|||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
200 mA |
2097152 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G86 |
166 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
1,2,4,8 |
5.5 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
268435456 bit |
e0 |
.0005 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
100 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.001 Amp |
18.42 mm |
60 ns |
|||||||||||||||||
Samsung |
EDO DRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
16777216 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
45 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2000 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
133 MHz |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
.032 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
400 mA |
4194304 words |
COMMON |
5 |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
268435456 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
50 ns |
|||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2800 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2 |
2.7 V |
200 MHz |
Not Qualified |
2147483648 bit |
2.5 V |
AUTO/SELF REFRESH |
.65 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
42 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
150 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J42 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
27.31 mm |
60 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
60 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.65 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0002 Amp |
24.56 mm |
80 ns |
||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
18.41 mm |
50 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
29.21 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
7 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
13 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
CACHE DRAM MODULE |
COMMERCIAL |
54 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
340 mA |
67108864 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP54,.46,16 |
DRAMs |
.4 mm |
70 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G54 |
1 |
133 MHz |
Not Qualified |
536870912 bit |
e3 |
.005 Amp |
2,4,8 |
.75 ns |
|||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.00025 Amp |
18.41 mm |
50 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1885 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
667 MHz |
4 mm |
Not Qualified |
19327352832 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
.688 Amp |
133.35 mm |
.255 ns |
|||||||||||||||
Samsung |
EDO DRAM |
INDUSTRIAL |
50 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
50 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
360 mA |
134217728 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G66 |
1 |
166 MHz |
Not Qualified |
536870912 bit |
e3 |
.005 Amp |
2,4,8 |
.7 ns |
|||||||||||||||||||||
Samsung |
VIDEO DRAM |
COMMERCIAL |
64 |
TSOP2-R |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
DUAL |
2 |
R-PDSO-G64 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 16 SAM PORT |
23.49 mm |
80 ns |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
760 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
29.9974 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
6 ns |
|||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
4MX16 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
30 |
240 |
20.95 mm |
45 ns |
||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
8388608 words |
YES |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
8MX8 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
30 |
225 |
20.96 mm |
50 ns |
|||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4194304 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX8 |
4M |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
Not Qualified |
33554432 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
80 ns |
||||||||||||||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
300 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.003 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2480 mA |
67108864 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
100 MHz |
Not Qualified |
4831838208 bit |
3 V |
AUTO/SELF REFRESH |
.038 Amp |
6 ns |
||||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
67108864 words |
4,8 |
COMMON |
1.8 |
1.8 |
8 |
GRID ARRAY, FINE PITCH |
BGA60,9X11,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B60 |
1 |
333 MHz |
Not Qualified |
536870912 bit |
e3 |
260 |
4,8 |
.45 ns |
||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
366 mA |
8388608 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
SINGLE |
R-PSMA-N72 |
Not Qualified |
301989888 bit |
.006 Amp |
60 ns |
||||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
2097152 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
2MX8 |
2M |
0 Cel |
DUAL |
1 |
R-PDSO-G28 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
18.41 mm |
50 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
7 ns |
||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1520 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
6 ns |
|||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
440 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
DUAL |
1 |
R-XDMA-N72 |
3.6 V |
25.4 mm |
Not Qualified |
33554432 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0004 Amp |
70 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
80 mA |
524288 words |
NO |
COMMON |
5 |
5 |
9 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX9 |
512K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4718592 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
.001 Amp |
18.41 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
16777216 words |
YES |
3.3 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.96 mm |
50 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
68 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
350 mA |
536870912 words |
4,8 |
COMMON |
1.8 |
1.8 |
4 |
GRID ARRAY, FINE PITCH |
BGA68,9X19,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
512MX4 |
512M |
0 Cel |
BOTTOM |
R-PBGA-B68 |
400 MHz |
Not Qualified |
2147483648 bit |
.008 Amp |
4,8 |
.4 ns |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B54 |
3.6 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
e0 |
.0005 Amp |
1,2,4,8 |
8 mm |
7 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
90 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
95 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
1.95 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
240 |
.0003 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1290 mA |
4194304 words |
2,4,8,FP |
YES |
COMMON |
2.8 |
2.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.94 V |
1.4 mm |
450 MHz |
12 mm |
Not Qualified |
134217728 bit |
2.66 V |
AUTO/SELF REFRESH |
e0 |
.12 Amp |
2,4,8 |
12 mm |
.55 ns |
||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
85 mA |
524288 words |
YES |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.00015 Amp |
18.42 mm |
50 ns |
|||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
140 mA |
1048576 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
DUAL |
R-PDSO-J42 |
Not Qualified |
16777216 bit |
.0002 Amp |
50 ns |
|||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
70 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
130 mA |
524288 words |
YES |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE |
TSSOP70,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G70 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0005 Amp |
23.49 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
800 mA |
16777216 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
22.86 mm |
Not Qualified |
134217728 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
.008 Amp |
70 ns |
||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
284 mA |
2097152 words |
NO |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
19.05 mm |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.004 Amp |
70 ns |
||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.75 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
250 mA |
16777216 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
DUAL |
R-PDSO-G66 |
3 |
133 MHz |
Not Qualified |
134217728 bit |
260 |
.003 Amp |
2,4,8 |
.75 ns |
||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
325 mA |
134217728 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
DUAL |
R-PDSO-G66 |
3 |
133 MHz |
Not Qualified |
536870912 bit |
260 |
.005 Amp |
2,4,8 |
.75 ns |
||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
55 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.76 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
17.145 mm |
80 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM MODULE |
COMMERCIAL |
144 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
690 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX64 |
1M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
166 MHz |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.5 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.