Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
130 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
260 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
|||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
17.14 mm |
50 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
2.7 V |
1 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
8 mm |
5.4 ns |
|||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.68 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
17.145 mm |
80 ns |
||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
345 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2 |
2.7 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.005 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
160 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
1 |
133 MHz |
Not Qualified |
268435456 bit |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
100 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J24 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
17.145 mm |
60 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
40 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
262144 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ40,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J40 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.0001 Amp |
26.04 mm |
60 ns |
||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
100 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
DUAL |
R-PDSO-G32 |
Not Qualified |
67108864 bit |
.0002 Amp |
60 ns |
|||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
120 mA |
8388608 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
DUAL |
R-PDSO-G32 |
Not Qualified |
67108864 bit |
.0005 Amp |
45 ns |
|||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
65 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.68 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0001 Amp |
17.145 mm |
70 ns |
|||||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
344 mA |
4194304 words |
2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
200 MHz |
Not Qualified |
134217728 bit |
e1 |
260 |
.02 Amp |
2,4,8 |
.7 ns |
||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B60 |
2 |
2.7 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.7 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
240 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
111 MHz |
Not Qualified |
536870912 bit |
e0 |
.001 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
8388608 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
8MX8 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
30 |
240 |
20.95 mm |
50 ns |
||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
16777216 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX1 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.76 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
17.15 mm |
60 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
400 MHz |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.4 ns |
||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
60 |
BGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
280 mA |
33554432 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
8 |
GRID ARRAY |
BGA60,9X12,40/32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
BOTTOM |
R-PBGA-B60 |
3 |
166 MHz |
Not Qualified |
268435456 bit |
260 |
.003 Amp |
2,4,8 |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
800 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
133 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4000 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
100 MHz |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
.08 Amp |
.8 ns |
||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8040 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1350 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
100 MHz |
Not Qualified |
1207959552 bit |
3 V |
AUTO/SELF REFRESH |
.018 Amp |
6 ns |
||||||||||||||||||
|
Samsung |
GDDR3 DRAM |
OTHER |
136 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1452 mA |
16777216 words |
4,8 |
YES |
COMMON |
2.05 |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA136,12X17,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
3 |
2.1 V |
1.2 mm |
1300 MHz |
10 mm |
Not Qualified |
536870912 bit |
2 V |
AUTO/SELF REFRESH |
e1 |
260 |
.109 Amp |
4,8 |
14 mm |
.18 ns |
|||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
50 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
4MX16 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
45 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
50 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
60 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
50 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSSOP20/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G20 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
17.14 mm |
80 ns |
|||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
24 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
YES |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
17.14 mm |
60 ns |
|||||||||||||||||||||||||
Samsung |
DDR3 DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
1 mm |
95 Cel |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
8589934592 bit |
1.425 V |
AUTO/SELF REFRESH |
133.35 mm |
.225 ns |
|||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
70 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
18.41 mm |
70 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
130 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
20.95 mm |
45 ns |
|||||||||||||||
|
Samsung |
CACHE DRAM MODULE |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
345 mA |
33554432 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G66 |
1 |
133 MHz |
Not Qualified |
536870912 bit |
e3 |
.005 Amp |
2,4,8 |
.75 ns |
|||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4786 mA |
4294967296 words |
YES |
COMMON |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM288,33 |
.85 mm |
4GX72 |
4G |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
4.3 mm |
309237645312 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
.723 Amp |
133.35 mm |
||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
8388608 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
8MX8 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
65 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSOP2-R |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
60 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSSOP20/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
YES |
3-STATE |
1MX4 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G20 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0001 Amp |
17.14 mm |
60 ns |
||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
44 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
150 mA |
1048576 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
45 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
810 mA |
4194304 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX36 |
4M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
31.75 mm |
Not Qualified |
150994944 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
.009 Amp |
60 ns |
||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
390 mA |
67108864 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
.005 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1464 mA |
33554432 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX36 |
32M |
0 Cel |
SINGLE |
R-PSMA-N72 |
Not Qualified |
1207959552 bit |
.024 Amp |
60 ns |
||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
7 ns |
||||||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
11 mm |
5.4 ns |
|||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1800 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
25.4 mm |
Not Qualified |
301989888 bit |
3 V |
CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH |
.03 Amp |
60 ns |
|||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
22.22 mm |
.7 ns |
|||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2750 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||
|
Samsung |
DDR1 DRAM |
OTHER |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
115 mA |
33554432 words |
2,4,8,16 |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA60,9X10,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
R-PBGA-B60 |
133 MHz |
Not Qualified |
536870912 bit |
.000015 Amp |
2,4,8,16 |
6 ns |
||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
YES |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
18.41 mm |
50 ns |
|||||||||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
18 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
16MX18 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.625 V |
1.2 mm |
10.16 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
22.22 mm |
.6 ns |
|||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
810 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX72 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
150994944 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0045 Amp |
60 ns |
||||||||||||||||||||
Samsung |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
8388608 words |
COMMON |
5 |
5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
31.75 mm |
Not Qualified |
603979776 bit |
.03 Amp |
50 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.