Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
262144 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G40 |
5.25 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.75 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.00015 Amp |
18.41 mm |
50 ns |
|||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.8 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
140 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.95 mm |
50 ns |
|||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
72 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX36 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
301989888 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
50 ns |
|||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
30 |
240 |
22.22 mm |
5.4 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
135 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
83 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
4,8 |
8 ns |
|||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2-R |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
DRAMs |
1.27 mm |
70 Cel |
YES |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
18.41 mm |
50 ns |
||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
70 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B54 |
3 |
133 MHz |
Not Qualified |
134217728 bit |
e1 |
260 |
.0005 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
72 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
2097152 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
2MX36 |
2M |
SINGLE |
1 |
R-XSMA-N72 |
Not Qualified |
75497472 bit |
60 ns |
|||||||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
125 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4194304 words |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX72 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
301989888 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
|||||||||||||||||||||||||||||||
Samsung |
DDR2 DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
.4 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
400 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
.4 ns |
|||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
16777216 words |
YES |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
60 ns |
|||||||||||||||||||||||||
Samsung |
DDR3L DRAM |
INDUSTRIAL |
96 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
512MX16 |
512M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B96 |
1.45 V |
1.2 mm |
7.5 mm |
8589934592 bit |
1.283 V |
AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY |
13.3 mm |
|||||||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
480 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
268435456 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.002 Amp |
50 ns |
|||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1500 mA |
4194304 words |
COMMON |
5 |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
268435456 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
50 ns |
||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
5 |
40 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
8MX40 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
335544320 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
|||||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
110 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
Not Qualified |
67108864 bit |
e0 |
.0003 Amp |
60 ns |
||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1400 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
166 MHz |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.7 ns |
||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
3 |
2.7 V |
166 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.7 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2-R |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
70 mA |
524288 words |
YES |
COMMON |
3.3 |
3.3 |
9 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
YES |
3-STATE |
512KX9 |
512K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4718592 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
e0 |
.0001 Amp |
18.41 mm |
80 ns |
||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
SOJ |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
8388608 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.96 mm |
50 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
115 mA |
2097152 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G86 |
3 |
83 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
8 ns |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
120 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
2.7 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
.0005 Amp |
1,2,4,8 |
8 mm |
7 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
2.7 V |
1 mm |
105 MHz |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0005 Amp |
1,2,4,8 |
8 mm |
7 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1110 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
3 V |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
301989888 bit |
3 V |
AUTO/SELF REFRESH |
.018 Amp |
6 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
120 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
45 ns |
|||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
40 |
SOJ |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
65536 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ40,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J40 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.00015 Amp |
26.04 mm |
55 ns |
|||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1760 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
1073741824 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.008 Amp |
60 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
885 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX72 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
150994944 bit |
3 V |
AUTO/SELF REFRESH |
.009 Amp |
6 ns |
|||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
140 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
166 MHz |
Not Qualified |
134217728 bit |
.0005 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
7 ns |
|||||||||||||||||||||||||
Samsung |
EDO DRAM |
INDUSTRIAL |
50 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
130 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
45 ns |
|||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1760 mA |
16777216 words |
COMMON |
5 |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
1073741824 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
60 ns |
|||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
2.7 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
e1 |
260 |
.0005 Amp |
1,2,4,8 |
8 mm |
7 ns |
|||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
60 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
17.14 mm |
80 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
600 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
100 MHz |
Not Qualified |
268435456 bit |
.008 Amp |
7 ns |
|||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
50 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
120 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G50 |
Not Qualified |
67108864 bit |
e0 |
.0005 Amp |
50 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
16 |
SMALL OUTLINE |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
SOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
220 mA |
67108864 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
64MX4 |
64M |
-25 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
133 MHz |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
270 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
1.8/2.5,2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
105 MHz |
Not Qualified |
268435456 bit |
e0 |
.0012 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.75 ns |
|||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
16777216 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
CAS BEFORE RAS/RAS ONLY/HIDDEN/SELF REFRESH |
20.95 mm |
50 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
18.41 mm |
60 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
840 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
1 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
6 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.