Samsung DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4E641612C-TL60RM

Samsung

EDO DRAM

COMMERCIAL

50

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

110 mA

4194304 words

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G50

Not Qualified

67108864 bit

e0

.0002 Amp

60 ns

K4H280438C-TCA2T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

315 mA

33554432 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX4

32M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G66

133 MHz

Not Qualified

134217728 bit

e0

.004 Amp

2,4,8

.75 ns

KM428C64J-10

Samsung

VIDEO DRAM

COMMERCIAL

40

SOJ

256

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

140 mA

65536 words

5

5

8

SMALL OUTLINE

SOJ40,.44

Other Memory ICs

1.27 mm

70 Cel

64KX8

64K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-J40

5.5 V

3.76 mm

10.16 mm

Not Qualified

524288 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.005 Amp

26.035 mm

100 ns

K4F660411D-JC600

Samsung

FAST PAGE DRAM

COMMERCIAL

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

16777216 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

16MX4

16M

0 Cel

DUAL

1

R-PDSO-J32

5.5 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

20.96 mm

60 ns

K4H510838D-ZPB3

Samsung

DDR1 DRAM

AUTOMOTIVE

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

360 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

125 Cel

3-STATE

64MX8

64M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

K4M283233H-FG7L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

134217728 bit

.0005 Amp

1,2,4,8

7.5 ns

KM416V1004AJ-8

Samsung

EDO DRAM

COMMERCIAL

42

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

1048576 words

NO

COMMON

3.3

3.3

16

SMALL OUTLINE

SOJ42,.44

DRAMs

1.27 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J42

3.6 V

3.76 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

27.31 mm

80 ns

KM44C1003CLJ-5

Samsung

FAST PAGE DRAM

COMMERCIAL

24

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

85 mA

1048576 words

NO

COMMON

5

5

4

SMALL OUTLINE

SOJ24/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

1MX4

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J24

5.5 V

3.76 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0002 Amp

17.15 mm

50 ns

K4B2G1646Q-BHK00

Samsung

DDR3L DRAM

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

128MX16

128M

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH

13.3 mm

KM44S16030CT-G8Z

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

125 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

125 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

6 ns

KM44S16030CT-G7M1

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

125 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

143 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

6 ns

K4H511638J-BPCCT

Samsung

DDR1 DRAM

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

220 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

536870912 bit

e3

260

.005 Amp

2,4,8

.65 ns

KMM366S413DTS-GH

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4194304 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

4MX64

4M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

6 ns

K4S641632B-TC10

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

120 mA

4194304 words

1,2,4,8,FP

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

TIN LEAD

DUAL

R-PDSO-G54

100 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

7 ns

M393T2863AZ3-CCC

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2930 mA

134217728 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

95 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N240

2

1.9 V

200 MHz

Not Qualified

9663676416 bit

1.7 V

AUTO/SELF REFRESH

.585 Amp

.6 ns

M393A8K40B21-CTC

Samsung

DDR DRAM MODULE

288

DIMM

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

8589934592 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

8GX72

8G

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

4.1 mm

618475290624 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

K4H560838E-NCB3

Samsung

DDR1 DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

280 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

2.7 V

1.2 mm

166 MHz

7.6 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

14 mm

.7 ns

K4S640832C-TL10T

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

110 mA

8388608 words

1,2,4,8,FP

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

100 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

7 ns

K4M641633K-BL1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

2

3.6 V

1 mm

111 MHz

8 mm

Not Qualified

67108864 bit

2.7 V

AUTO/SELF REFRESH

e1

.0005 Amp

1,2,4,8

8 mm

7 ns

KM44V16000AR-7

Samsung

FAST PAGE DRAM

COMMERCIAL

32

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP32,.46

DRAMs

1.27 mm

70 Cel

YES

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G32

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

20.95 mm

70 ns

KMM381L1713BT-FZ

Samsung

DDR DRAM MODULE

COMMERCIAL

184

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

1207959552 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

M470T2953CZ3-CCC

Samsung

DDR DRAM MODULE

OTHER

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2040 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

95 Cel

3-STATE

128MX64

128M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1.9 V

200 MHz

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.128 Amp

.6 ns

M470L2923BN0-CA2

Samsung

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3120 mA

134217728 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

TIN LEAD

ZIG-ZAG

1

R-XZMA-N200

2.7 V

133 MHz

Not Qualified

8589934592 bit

2.3 V

AUTO/SELF REFRESH

e0

.08 Amp

.75 ns

M378A5244BB0-CPB

Samsung

DDR DRAM MODULE

288

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.2

64

MICROELECTRONIC ASSEMBLY

.85 mm

512MX64

512M

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

2.61 mm

34359738368 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

KM48S2021BT-F8

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

44

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

170 mA

2097152 words

1,2,4,8,FP

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

125 MHz

Not Qualified

16777216 bit

e0

.00025 Amp

4,8

5.5 ns

K4T1G044QE-HCF7

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

165 mA

268435456 words

4,8

YES

COMMON

1.8

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B60

3

1.9 V

1.2 mm

400 MHz

7.5 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

260

4,8

9.5 mm

.4 ns

M391T3253FG0-CD5

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2295 mA

33554432 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

266 MHz

Not Qualified

2415919104 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

230

.072 Amp

.5 ns

M391T2863AZ3-CE6

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2700 mA

134217728 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

95 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

333 MHz

Not Qualified

9663676416 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.135 Amp

.45 ns

KM44C256CLVR-8

Samsung

FAST PAGE DRAM

COMMERCIAL

20

TSOP1-R

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

60 mA

262144 words

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSSOP20/24,.63,20

DRAMs

.5 mm

70 Cel

YES

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G20

5.5 V

1.2 mm

6 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0002 Amp

14.4 mm

80 ns

K4F640412E-JI500

Samsung

FAST PAGE DRAM

INDUSTRIAL

32

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

110 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

85 Cel

3-STATE

16MX4

16M

-40 Cel

DUAL

R-PDSO-J32

Not Qualified

67108864 bit

.0005 Amp

50 ns

M393B2K70DM0-CF8

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3960 mA

2147483648 words

YES

COMMON

1.5

1.5

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N240

2

1.575 V

30.15 mm

533 MHz

4 mm

Not Qualified

154618822656 bit

1.425 V

AUTO/SELF REFRESH; WD-MAX

1.836 Amp

133.35 mm

.3 ns

KM49C512BLJ-7

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

70 mA

524288 words

NO

COMMON

5

5

9

SMALL OUTLINE

SOJ28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

512KX9

512K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J28

5.5 V

3.76 mm

10.16 mm

Not Qualified

4718592 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

18.42 mm

70 ns

M368L2923BTN-LB0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3040 mA

134217728 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

TIN LEAD

DUAL

1

R-XDMA-N184

2.7 V

133 MHz

Not Qualified

8589934592 bit

2.3 V

AUTO/SELF REFRESH

e0

.08 Amp

.75 ns

KM416V256BT-L8

Samsung

FAST PAGE DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

75 mA

262144 words

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G40

3.6 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

3 V

e0

.0001 Amp

18.41 mm

80 ns

KM44C4100LJ-8

Samsung

FAST PAGE DRAM

COMMERCIAL

24

SOJ

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE

SOJ24/28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J24

5.5 V

3.66 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.0003 Amp

18.42 mm

80 ns

K4S56163LF-XE1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

30

240

11 mm

7 ns

K4H561638F-TCAA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

16MX16

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

22.22 mm

.75 ns

KMM5328004CSW-6

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

224 mA

8388608 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

268435456 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.004 Amp

60 ns

M463S3254DK1-L1L

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,20

DRAMs

.5 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

100 MHz

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.016 Amp

6 ns

K4M28323LH-HL60T

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

4194304 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX32

4M

-25 Cel

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

134217728 bit

.0005 Amp

1,2,4,8

5.4 ns

K4S643232E-TN50

Samsung

SYNCHRONOUS DRAM

OTHER

86

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

190 mA

2097152 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

32

SMALL OUTLINE, THIN PROFILE

TSSOP86,.46,20

DRAMs

.5 mm

85 Cel

3-STATE

2MX32

2M

-25 Cel

TIN LEAD

DUAL

1

R-PDSO-G86

3.6 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

.002 Amp

1,2,4,8

22.22 mm

4.5 ns

KM416C157AZ-8

Samsung

FAST PAGE DRAM

COMMERCIAL

40

ZIP

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

80 mA

262144 words

NO

COMMON

5

5

16

IN-LINE

ZIP40,.1

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

ZIG-ZAG

1

R-PZIP-T40

5.5 V

12.06 mm

2.96 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.001 Amp

80 ns

KM44C4100ASR-7

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2-R

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

YES

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

70 ns

KM44C4103BS-L7

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

4194304 words

YES

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

17.14 mm

70 ns

KM48S8030BT-GHKZ

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

150 mA

8388608 words

1,2,4,8,FP

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

R-PDSO-G54

3

100 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

6 ns

M366S1654CTS-L1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

760 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

100 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

K4F640812B-TL500

Samsung

FAST PAGE DRAM

COMMERCIAL

32

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

8388608 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

1.27 mm

70 Cel

8MX8

8M

0 Cel

DUAL

1

R-PDSO-G32

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

20.95 mm

50 ns

K4M51163LC-RG750

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

33554432 words

1,2,4,8,FP

YES

COMMON

2.5

2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

2.7 V

1 mm

133 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

30

240

.001 Amp

1,2,4,8

11.5 mm

5.4 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.