Samsung DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

KMCJ5321000-6

Samsung

DRAM CARD

COMMERCIAL

88

1024

UNSPECIFIED

UNSPECIFIED

FAST PAGE

NO

1

MOS

UNSPECIFIED

ASYNCHRONOUS

1048576 words

5

32

MICROELECTRONIC ASSEMBLY

16

70 Cel

3-STATE

1MX32

1M

0 Cel

UNSPECIFIED

1

X-XXMA-X88

5.25 V

Not Qualified

33554432 bit

4.75 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

60 ns

KM48V8104AK-5

Samsung

EDO DRAM

COMMERCIAL

32

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

150 mA

8388608 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

20.96 mm

50 ns

M390S2858CTU-C7C

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

5000 mA

134217728 words

YES

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

133 MHz

Not Qualified

9663676416 bit

3 V

AUTO/SELF REFRESH

.074 Amp

5.4 ns

M390S3320BT1-C75

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4460 mA

33554432 words

YES

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N168

1

3.6 V

133 MHz

Not Qualified

2415919104 bit

3 V

AUTO/SELF REFRESH

.02 Amp

5.4 ns

K4F170812C-BL60

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

80 mA

2097152 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ28,.34

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J28

3.6 V

3.76 mm

7.62 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0002 Amp

18.42 mm

60 ns

K4S510832D-UL750

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

200 mA

67108864 words

1,2,4,8

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

DUAL

1

R-PDSO-G54

2

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.002 Amp

1,2,4,8

22.22 mm

5.4 ns

KM4216V255T-8

Samsung

VIDEO DRAM

COMMERCIAL

64

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

DUAL

2

R-PDSO-G64

3.6 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 16 SAM PORT

23.49 mm

80 ns

KMM5364003CKVG-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

4194304 words

5

36

MICROELECTRONIC ASSEMBLY

70 Cel

4MX36

4M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

150994944 bit

4.5 V

60 ns

KMM366S404AT-G2

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

500 mA

4194304 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

4MX64

4M

0 Cel

DUAL

R-PDMA-N168

83 MHz

Not Qualified

268435456 bit

.008 Amp

8 ns

K4S560832E-TC75T

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

22.22 mm

5.4 ns

KMM377S2857AT2-GH

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3710 mA

134217728 words

YES

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N168

3.3 V

100 MHz

Not Qualified

9663676416 bit

3 V

AUTO/SELF REFRESH

.038 Amp

6 ns

M466S0823CT2-L10

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

29.21 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

7 ns

K4J55323QG-BC140

Samsung

GDDR3 DRAM

OTHER

136

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

935 mA

8388608 words

4,8

YES

COMMON

1.8

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA136,12X17,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B136

2

1.9 V

1.2 mm

700 MHz

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

.09 Amp

4,8

14 mm

.26 ns

KMM364E803AS-7

Samsung

EDO DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1040 mA

8388608 words

COMMON

5

5

64

MICROELECTRONIC ASSEMBLY

DIMM168

32

DRAMs

1.27 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

Not Qualified

536870912 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

70 ns

K4M283233H-HL60T

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX32

4M

-25 Cel

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

134217728 bit

.0005 Amp

1,2,4,8

60 ns

K4D55323QF-VC22

Samsung

GDDR1 DRAM

COMMERCIAL

144

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

4

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

8MX32

8M

0 Cel

BOTTOM

S-PBGA-B144

3

450 MHz

Not Qualified

268435456 bit

260

.45 ns

M383L1713ETS-CB0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3250 mA

16777216 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

TIN LEAD

DUAL

1

R-XDMA-N184

2.7 V

133 MHz

Not Qualified

1207959552 bit

2.3 V

AUTO/SELF REFRESH

e0

.75 ns

K4B2G0846E-BCMA0

Samsung

DDR3 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

160 mA

268435456 words

8

YES

COMMON

1.5

1.5

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.2 mm

933 MHz

7.5 mm

Not Qualified

2147483648 bit

1.425 V

AUTO/SELF REFRESH

.012 Amp

8

11 mm

.195 ns

K4N56163QF-GC370

Samsung

DDR2 DRAM

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

16MX16

16M

TIN LEAD

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e0

13 mm

.5 ns

KM44C4004AT-5

Samsung

EDO DRAM

COMMERCIAL

24

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

100 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

18.41 mm

50 ns

K4E660412E-TI600

Samsung

EDO DRAM

INDUSTRIAL

32

TSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

100 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP32,.46

DRAMs

1.27 mm

85 Cel

3-STATE

16MX4

16M

-40 Cel

DUAL

R-PDSO-G32

Not Qualified

67108864 bit

.0005 Amp

60 ns

KM48C514DLT-5

Samsung

EDO DRAM

COMMERCIAL

28

TSOP2

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

524288 words

5

8

SMALL OUTLINE, THIN PROFILE

1.27 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

DUAL

2

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

18.41 mm

50 ns

KM48C2100ATR-5

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2-R

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

110 mA

2097152 words

NO

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

YES

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

18.41 mm

50 ns

KM48V2004ALT-6

Samsung

EDO DRAM

COMMERCIAL

28

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

2097152 words

NO

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

3.6 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

18.41 mm

60 ns

K4M51323LE-ME800

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

-25 Cel

BOTTOM

1

R-PBGA-B90

2.7 V

1.4 mm

11 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

13 mm

6 ns

K4M563233G-HG60

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

MATTE TIN

BOTTOM

R-PBGA-B90

1

166 MHz

Not Qualified

268435456 bit

e3

.001 Amp

1,2,4,8

5.4 ns

K4M281633F-BC750

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

2

3.6 V

1 mm

8 mm

Not Qualified

134217728 bit

2.7 V

AUTO/SELF REFRESH

e1

8 mm

5.4 ns

K4M51163LC-RG75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

33554432 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

K4T1G084QD-ZCCC

Samsung

DDR2 DRAM

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

225 mA

134217728 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

3-STATE

128MX8

128M

MATTE TIN

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

1073741824 bit

e3

4,8

.6 ns

KMM594020A-10

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

30

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

4194304 words

5

9

MICROELECTRONIC ASSEMBLY

70 Cel

4MX9

4M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

Not Qualified

37748736 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

100 ns

KMM5322204C2W-60

Samsung

DRAM MODULE

COMMERCIAL

72

SIMM

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

2097152 words

YES

5

32

MICROELECTRONIC ASSEMBLY

1.27 mm

70 Cel

2MX32

2M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

19.18 mm

8.89 mm

67108864 bit

4.5 V

SELF REFRESH; WD-MAX

107.95 mm

60 ns

M372F0883BT0-C60

Samsung

EDO DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

810 mA

8388608 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

8MX72

8M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

603979776 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

60 ns

KMM5322104CKU-60

Samsung

DRAM MODULE

COMMERCIAL

72

SIMM

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

2097152 words

YES

5

32

MICROELECTRONIC ASSEMBLY

1.27 mm

70 Cel

2MX32

2M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

24.63 mm

5.08 mm

67108864 bit

4.5 V

SELF REFRESH; WD-MAX

107.95 mm

60 ns

K4S513233F-EL1H0

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3

3.6 V

1.4 mm

11 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

e1

13 mm

7 ns

K4M51323PC-DF75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

MATTE TIN

BOTTOM

R-PBGA-B90

1

133 MHz

Not Qualified

536870912 bit

e3

.0003 Amp

1,2,4,8

6 ns

K4M513233E-EF1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

16777216 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

3

105 MHz

Not Qualified

536870912 bit

260

.0015 Amp

1,2,4,8

7 ns

KM416S1020CT-GL

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

50

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

115 mA

1048576 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G50

3.6 V

1.2 mm

100 MHz

10.16 mm

Not Qualified

16777216 bit

3 V

AUTO/SELF REFRESH

e0

.001 Amp

1,2,4,8

20.95 mm

6 ns

K4H511638J-LLCCT

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

220 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

200 MHz

Not Qualified

536870912 bit

e3

260

.005 Amp

2,4,8

.65 ns

KMM466F124AT1-L6

Samsung

EDO DRAM MODULE

COMMERCIAL

144

DIMM

1024

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

600 mA

1048576 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX64

1M

0 Cel

DUAL

R-PDMA-N144

25.4 mm

Not Qualified

67108864 bit

.0008 Amp

60 ns

KMM5916000A-8

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

30

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

16777216 words

5

9

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

16MX9

16M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

Not Qualified

150994944 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

80 ns

KM48C512DLJ-5

Samsung

FAST PAGE DRAM

COMMERCIAL

28

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

524288 words

YES

5

8

SMALL OUTLINE

1.27 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

DUAL

1

R-PDSO-J28

5.5 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

18.42 mm

50 ns

M393T5160CZA-CE6

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

7300 mA

536870912 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

512MX72

512M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

333 MHz

Not Qualified

38654705664 bit

1.7 V

AUTO/SELF REFRESH

260

1.4 Amp

.45 ns

KM44S16030DT-GA

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

135 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

133 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

5.4 ns

K4E640412D-TL500

Samsung

EDO DRAM

COMMERCIAL

32

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

16777216 words

YES

3.3

4

SMALL OUTLINE, THIN PROFILE

1.27 mm

70 Cel

16MX4

16M

0 Cel

DUAL

1

R-PDSO-G32

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

20.95 mm

50 ns

K4M641633K-RN1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

110 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

7 ns

K4H510838J-BCB30

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

9 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

260

.005 Amp

2,4,8

12 mm

.7 ns

M393T6450FG0-LE6

Samsung

DDR DRAM MODULE

240

DIMM

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

64MX72

64M

DUAL

1

R-XDMA-N240

1.9 V

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

30

230

.45 ns

M312L3223ETS-CB0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2250 mA

33554432 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

133 MHz

Not Qualified

2415919104 bit

2.3 V

AUTO/SELF REFRESH

.36 Amp

.75 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.