Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
DRAM CARD |
COMMERCIAL |
88 |
1024 |
UNSPECIFIED |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
MOS |
UNSPECIFIED |
ASYNCHRONOUS |
1048576 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
UNSPECIFIED |
1 |
X-XXMA-X88 |
5.25 V |
Not Qualified |
33554432 bit |
4.75 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
||||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
150 mA |
8388608 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.96 mm |
50 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5000 mA |
134217728 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
133 MHz |
Not Qualified |
9663676416 bit |
3 V |
AUTO/SELF REFRESH |
.074 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4460 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
133 MHz |
Not Qualified |
2415919104 bit |
3 V |
AUTO/SELF REFRESH |
.02 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
80 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
18.42 mm |
60 ns |
|||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
67108864 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
2 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Samsung |
VIDEO DRAM |
COMMERCIAL |
64 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
DUAL |
2 |
R-PDSO-G64 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 16 SAM PORT |
23.49 mm |
80 ns |
||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4194304 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX36 |
4M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
150994944 bit |
4.5 V |
60 ns |
||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
500 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
83 MHz |
Not Qualified |
268435456 bit |
.008 Amp |
8 ns |
|||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3710 mA |
134217728 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.3 V |
100 MHz |
Not Qualified |
9663676416 bit |
3 V |
AUTO/SELF REFRESH |
.038 Amp |
6 ns |
|||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
880 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
29.21 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
7 ns |
||||||||||||||||||
|
Samsung |
GDDR3 DRAM |
OTHER |
136 |
TFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
935 mA |
8388608 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA136,12X17,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2 |
1.9 V |
1.2 mm |
700 MHz |
11 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
.09 Amp |
4,8 |
14 mm |
.26 ns |
||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1040 mA |
8388608 words |
COMMON |
5 |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
536870912 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
70 ns |
||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
140 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
166 MHz |
Not Qualified |
134217728 bit |
.0005 Amp |
1,2,4,8 |
60 ns |
|||||||||||||||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
8388608 words |
4 |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
BOTTOM |
S-PBGA-B144 |
3 |
450 MHz |
Not Qualified |
268435456 bit |
260 |
.45 ns |
|||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3250 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
133 MHz |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.75 ns |
||||||||||||||||||
|
Samsung |
DDR3 DRAM |
OTHER |
78 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
160 mA |
268435456 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA78,9X13,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
256MX8 |
256M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B78 |
1.575 V |
1.2 mm |
933 MHz |
7.5 mm |
Not Qualified |
2147483648 bit |
1.425 V |
AUTO/SELF REFRESH |
.012 Amp |
8 |
11 mm |
.195 ns |
|||||||||||||
Samsung |
DDR2 DRAM |
84 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
16MX16 |
16M |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B84 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
e0 |
13 mm |
.5 ns |
||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
18.41 mm |
50 ns |
|||||||||||||||
Samsung |
EDO DRAM |
INDUSTRIAL |
32 |
TSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
100 mA |
16777216 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
16MX4 |
16M |
-40 Cel |
DUAL |
R-PDSO-G32 |
Not Qualified |
67108864 bit |
.0005 Amp |
60 ns |
|||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
DUAL |
2 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
18.41 mm |
50 ns |
||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2-R |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
2097152 words |
NO |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
YES |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
18.41 mm |
50 ns |
||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
2097152 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G28 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
18.41 mm |
60 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
13 mm |
6 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B90 |
1 |
166 MHz |
Not Qualified |
268435456 bit |
e3 |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B54 |
2 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
2.7 V |
AUTO/SELF REFRESH |
e1 |
8 mm |
5.4 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
133 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
225 mA |
134217728 words |
4,8 |
COMMON |
1.8 |
1.8 |
8 |
GRID ARRAY, FINE PITCH |
BGA60,9X11,32 |
DRAMs |
.8 mm |
3-STATE |
128MX8 |
128M |
MATTE TIN |
BOTTOM |
R-PBGA-B60 |
1 |
200 MHz |
Not Qualified |
1073741824 bit |
e3 |
4,8 |
.6 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4194304 words |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX9 |
4M |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
Not Qualified |
37748736 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
100 ns |
||||||||||||||||||||||||||||||
Samsung |
DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
YES |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
70 Cel |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
19.18 mm |
8.89 mm |
67108864 bit |
4.5 V |
SELF REFRESH; WD-MAX |
107.95 mm |
60 ns |
||||||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
810 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
603979776 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
60 ns |
|||||||||||||||||||||
Samsung |
DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
YES |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
70 Cel |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
24.63 mm |
5.08 mm |
67108864 bit |
4.5 V |
SELF REFRESH; WD-MAX |
107.95 mm |
60 ns |
||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
e1 |
13 mm |
7 ns |
|||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
150 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B90 |
1 |
133 MHz |
Not Qualified |
536870912 bit |
e3 |
.0003 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
300 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
3 |
105 MHz |
Not Qualified |
536870912 bit |
260 |
.0015 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
115 mA |
1048576 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
20.95 mm |
6 ns |
||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
220 mA |
33554432 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G66 |
1 |
200 MHz |
Not Qualified |
536870912 bit |
e3 |
260 |
.005 Amp |
2,4,8 |
.65 ns |
||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
600 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX64 |
1M |
0 Cel |
DUAL |
R-PDMA-N144 |
25.4 mm |
Not Qualified |
67108864 bit |
.0008 Amp |
60 ns |
||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
16777216 words |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
16MX9 |
16M |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
Not Qualified |
150994944 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
80 ns |
|||||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
524288 words |
YES |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
18.42 mm |
50 ns |
|||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
7300 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
333 MHz |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
1.4 Amp |
.45 ns |
||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
135 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
133 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
16777216 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
50 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
110 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
1 |
111 MHz |
Not Qualified |
67108864 bit |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
60 |
TBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
180 mA |
67108864 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
BGA60,9X12,40/32 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.7 V |
1.2 mm |
166 MHz |
9 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.005 Amp |
2,4,8 |
12 mm |
.7 ns |
||||||||||||
Samsung |
DDR DRAM MODULE |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
64MX72 |
64M |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
230 |
.45 ns |
||||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2250 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
133 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
.36 Amp |
.75 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.