Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
1024 words |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B6 |
5.25 V |
.67 mm |
1.75 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e0 |
1.98 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
112 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
112X8 |
112 |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
3.63 V |
.37 mm |
.908 mm |
1-WIRE |
896 bit |
1.71 V |
NOT SPECIFIED |
NOT SPECIFIED |
.908 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.3 mm |
1 MHz |
.84 mm |
5 ms |
I2C |
131072 bit |
1.6 V |
e1 |
.84 mm |
||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
105 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.35 mm |
1 MHz |
.77 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.77 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.3 mm |
1 MHz |
.77 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
IT ALSO OPERATES AT 0.4MHZ |
NOT SPECIFIED |
260 |
.77 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.3 mm |
1 MHz |
.84 mm |
5 ms |
I2C |
131072 bit |
1.7 V |
e1 |
30 |
260 |
.84 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1024 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.4 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.41 mm |
4 MHz |
.96 mm |
MICROWIRE |
16384 bit |
1.8 V |
1.17 mm |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
65536 words |
2.5 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.35 mm |
85 Cel |
64KX1 |
64K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.38 mm |
1 MHz |
.77 mm |
4 ms |
I2C |
65536 bit |
1.7 V |
.77 mm |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
262144 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
70 Cel |
256KX8 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B8 |
1 |
3.6 V |
.37 mm |
5 MHz |
2.04 mm |
10 ms |
I2C |
2097152 bit |
1.6 V |
e1 |
30 |
260 |
3.12 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
6 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2 mA |
32768 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,14 |
100 |
.35 mm |
105 Cel |
32KX8 |
32K |
-40 Cel |
1010D00R |
BOTTOM |
HARDWARE |
R-XBGA-B6 |
5.5 V |
.35 mm |
1000000 Write/Erase Cycles |
1 MHz |
.976 mm |
5 ms |
I2C |
262144 bit |
1.7 V |
64 |
.000002 Amp |
1.106 mm |
5 |
||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32768 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.35 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.3 mm |
1 MHz |
.96 mm |
5 ms |
I2C |
262144 bit |
1.7 V |
e3 |
30 |
260 |
1.09 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2 mA |
16384 words |
3.3 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA4,2X2,16 |
100 |
.4 mm |
85 Cel |
16KX1 |
16K |
-40 Cel |
1010MMMR |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
.84 mm |
5 ms |
I2C |
16384 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
.86 mm |
||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
64 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
64X16 |
64 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
1024 bit |
1.8 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
128X16 |
128 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
2048 bit |
1.8 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
3.6 V |
.33 mm |
.4 MHz |
.8 mm |
5 ms |
I2C |
16384 bit |
1.7 V |
1.2 mm |
|||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.3 mm |
1 MHz |
.85 mm |
5 ms |
I2C |
131072 bit |
2.5 V |
ALSO AVAILABLE 1.6-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ, 1.7-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ |
.85 mm |
||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
32X16 |
32 |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
512 bit |
1.8 V |
e4 |
.856 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2 mA |
4096 words |
3.3 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA4,2X2,16 |
100 |
.4 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
1010000R |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
.84 mm |
5 ms |
I2C |
4096 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
.86 mm |
||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2 mA |
8192 words |
3.3 |
1.8/5 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA4,2X2,16 |
EEPROMs |
100 |
.4 mm |
85 Cel |
8KX1 |
8K |
-40 Cel |
TIN SILVER COPPER |
10100MMR |
BOTTOM |
R-PBGA-B4 |
1 |
5.5 V |
.38 mm |
1000000 Write/Erase Cycles |
.4 MHz |
.84 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.7 V |
e1 |
30 |
260 |
.000001 Amp |
.86 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
2 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.33 mm |
1 MHz |
.8 mm |
5 ms |
I2C |
16384 bit |
1.7 V |
e1 |
30 |
260 |
1.2 mm |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
2048 bit |
1.7 V |
e4 |
.856 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
262144 words |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
70 Cel |
256KX16 |
256K |
0 Cel |
TIN SILVER |
BOTTOM |
R-PBGA-B8 |
3.6 V |
.37 mm |
5 MHz |
2.04 mm |
10 ms |
SPI |
4194304 bit |
1.6 V |
e2 |
3.12 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
2048 bit |
1.7 V |
e4 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4096 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.35 mm |
1 MHz |
.76 mm |
4 ms |
I2C |
32768 bit |
1.7 V |
.76 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
3.6 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
16KX1 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B4 |
1 |
5.5 V |
.38 mm |
.4 MHz |
.84 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
e1 |
30 |
260 |
.86 mm |
||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
85 Cel |
32X16 |
32 |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
512 bit |
1.7 V |
e4 |
.856 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.3 mm |
1 MHz |
.85 mm |
5 ms |
I2C |
131072 bit |
2.5 V |
ALSO AVAILABLE 1.6-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ, 1.7-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ |
e1 |
30 |
260 |
.85 mm |
||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
2048 bit |
1.7 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
32X16 |
32 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
512 bit |
1.7 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
128X16 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
2048 bit |
1.8 V |
e4 |
.856 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
3.6 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
125 Cel |
16KX1 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.39 mm |
.4 MHz |
.84 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
ALSO AVAILABLE 2.5-5.5V WITH 0.1MHZ |
.86 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4096 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
4KX8 |
4K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B5 |
1 |
5.5 V |
.35 mm |
.4 MHz |
.91 mm |
5 ms |
I2C |
32768 bit |
2.5 V |
e1 |
30 |
260 |
1.34 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2 mA |
4096 words |
3.3 |
1.8/5 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA5,3X3,10/6 |
EEPROMs |
100 |
.3 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
1010000R |
BOTTOM |
HARDWARE |
R-PBGA-B5 |
1 |
5.5 V |
.39 mm |
1000000 Write/Erase Cycles |
.4 MHz |
.84 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
1.7 V |
e1 |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
.86 mm |
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Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.76 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
.76 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
131072 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
105 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.39 mm |
5 MHz |
1.95 mm |
5 ms |
SPI |
1048576 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.24 mm |
|||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
512 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
3.6 V |
.5 mm |
.4 MHz |
.79 mm |
10 ms |
I2C |
4096 bit |
1.7 V |
1.06 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4096 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B5 |
1 |
5.5 V |
.35 mm |
1 MHz |
.91 mm |
5 ms |
I2C |
32768 bit |
2.5 V |
ALSO AVAILABLE 1.7-5.5V WITH 0.1MHZ WITH 0.4MHZ FOR -40 TO 125 AND -40 TO 85 DEG CEL |
e1 |
30 |
260 |
1.34 mm |
||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
64 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
1024 bit |
1.7 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
125 Cel |
32X16 |
32 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
512 bit |
1.8 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
64 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
1024 bit |
1.7 V |
e3 |
.856 mm |
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|
Onsemi |
EEPROM |
COMMERCIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
262144 words |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
70 Cel |
256KX16 |
256K |
0 Cel |
TIN SILVER |
BOTTOM |
R-PBGA-B8 |
3.6 V |
.37 mm |
5 MHz |
2.04 mm |
10 ms |
SPI |
4194304 bit |
1.6 V |
e2 |
3.12 mm |
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|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B8 |
1 |
5.5 V |
.6 mm |
.4 MHz |
1.39 mm |
5 ms |
I2C |
524288 bit |
1.8 V |
e1 |
30 |
260 |
1.65 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4096 words |
3.3 |
1.8/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
EEPROMs |
.4 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B5 |
1 |
5.5 V |
.35 mm |
1 MHz |
.91 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
ALSO AVAILABLE 1.7-5.5V WITH 0.1MHZ WITH 0.4MHZ FOR -40 TO 125 AND -40 TO 85 DEG CEL |
e1 |
30 |
260 |
1.34 mm |
|||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
2 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.33 mm |
1 MHz |
.8 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
e1 |
30 |
260 |
1.2 mm |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
32X16 |
32 |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
512 bit |
1.7 V |
e4 |
.856 mm |
|||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.3 mm |
85 Cel |
32X16 |
32 |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.35 mm |
.4 MHz |
.832 mm |
5 ms |
I2C |
512 bit |
1.7 V |
e3 |
.856 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
3.6 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
8KX1 |
8K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B4 |
1 |
5.5 V |
.38 mm |
.4 MHz |
.84 mm |
5 ms |
I2C |
8192 bit |
2.5 V |
e1 |
30 |
260 |
.86 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
3.6 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
8KX1 |
8K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B4 |
1 |
5.5 V |
.38 mm |
.4 MHz |
.84 mm |
5 ms |
I2C |
8192 bit |
2.5 V |
e1 |
30 |
260 |
.86 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.