Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
DUAL |
R-XDSO-N8 |
5.5 V |
.6 mm |
.4 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1024 words |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
OPEN-DRAIN |
1KX1 |
1K |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
1.8 V |
e4 |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
.8 mA |
2048 words |
2.5 |
1.8/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-20 Cel |
1010MMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
2048 words |
8 |
SMALL OUTLINE |
SOP8,.25 |
200 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-20 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
4000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e4 |
.000002 Amp |
4.9 mm |
||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4096 words |
1.8 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
32768 bit |
1.7 V |
e0 |
4.9 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
.8 mA |
1024 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
1 |
EEPROMs |
40 |
.5 mm |
85 Cel |
1KX8 |
1K |
-20 Cel |
NICKEL PALLADIUM GOLD |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
.4 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.7 V |
e4 |
30 |
260 |
.000001 Amp |
3 mm |
||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
10 ms |
I2C |
32768 bit |
1.6 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.32 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
1.8 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
32768 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-20 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
262144 bit |
1.8 V |
4.9 mm |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1 mA |
65536 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOLCC8,.3 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
64KX8 |
64K |
-20 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-N8 |
5.5 V |
1.14 mm |
100000 Write/Erase Cycles |
.4 MHz |
5 mm |
Not Qualified |
10 ms |
I2C |
524288 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
8 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
2.7 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e4 |
4.9 mm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1024 words |
1.8 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
1KX8 |
1K |
-20 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.4 MHz |
7.62 mm |
5 ms |
I2C |
8192 bit |
1.7 V |
9.27 mm |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
IN-LINE |
40 |
2.54 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
7.62 mm |
Not Qualified |
SPI |
131072 bit |
4.5 V |
100000 ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION |
9.27 mm |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
5 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
2.5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
DUAL |
R-PDSO-N5 |
5.5 V |
.6 mm |
1 MHz |
1.4 mm |
5 ms |
I2C |
32768 bit |
2.5 V |
1.7 mm |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1024 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
1KX8 |
1K |
-20 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.6 mm |
.4 MHz |
1.025 mm |
5 ms |
I2C |
8192 bit |
1.8 V |
ALSO AVALIABLE IN 100 KHZ AND VOLATGE AND TEMPERATURE CAPTURED BASED ON ORDERING INFORMATION |
1.215 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
1KX8 |
1K |
-20 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
100000 Write/Erase Cycles |
7.62 mm |
Not Qualified |
SPI |
8192 bit |
2.5 V |
e0 |
.000002 Amp |
9.27 mm |
||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.8 V |
e4 |
4.9 mm |
||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
16384 words |
3 |
3/3.3 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
3.6 V |
5.33 mm |
100000 Write/Erase Cycles |
7.62 mm |
Not Qualified |
SPI |
131072 bit |
2.7 V |
100000 ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION |
e0 |
.000002 Amp |
9.27 mm |
|||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
10 ms |
I2C |
32768 bit |
1.6 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
.8 mA |
512 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
512X8 |
512 |
-20 Cel |
1010DDMR |
DUAL |
HARDWARE |
R-XDSO-N8 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
.4 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
3 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
16384 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
2.03 mm |
100000 Write/Erase Cycles |
5.25 mm |
Not Qualified |
SPI |
131072 bit |
2.5 V |
100000 ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION |
e3 |
.000002 Amp |
5.3 mm |
||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16384 words |
1.8 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.2 mm |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.4 mm |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
.4 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
1.6 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.2 mm |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.4 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16384 words |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.2 mm |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.4 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
512 words |
2.5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
512X8 |
512 |
-20 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.4 MHz |
7.62 mm |
5 ms |
I2C |
4096 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.27 mm |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
32768 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
32KX8 |
32K |
-20 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G14 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
4.4 mm |
Not Qualified |
I2C |
262144 bit |
4.5 V |
e0 |
.00001 Amp |
5 mm |
|||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
1.8 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
65536 bit |
1.7 V |
e4 |
4.9 mm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
1.8 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
65536 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
256 words |
5 |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
256X16 |
256 |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
10 ms |
MICROWIRE |
4096 bit |
2.5 V |
CONFIGURABLE AS 256 X 16 |
e4 |
.00001 Amp |
4.9 mm |
|||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
2048 words |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
200 |
.65 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-20 Cel |
1010DDDR |
DUAL |
R-PDSO-G8 |
5.5 V |
1.2 mm |
4000000 Write/Erase Cycles |
.4 MHz |
3 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
.000002 Amp |
4.4 mm |
||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
10 ms |
I2C |
32768 bit |
1.6 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
2 mA |
4096 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
EEPROMs |
40 |
.635 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G14 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
32768 bit |
e0 |
.00001 Amp |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1 mA |
65536 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
64KX8 |
64K |
-20 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
100000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
524288 bit |
2.5 V |
e3 |
.000002 Amp |
9.27 mm |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
.4 MHz |
.674 mm |
10 ms |
I2C |
32768 bit |
1.6 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.4 MHz |
6.37 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.8 V |
e3 |
9.27 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16384 words |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
OPEN-DRAIN |
16KX1 |
16K |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
1.8 V |
e4 |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
16384 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.4 MHz |
6.37 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.27 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
2.5 |
2/3.3 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
512X16 |
512 |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.5 MHz |
3.9 mm |
Not Qualified |
10 ms |
MICROWIRE |
8192 bit |
1.8 V |
CONFIGURABLE AS 512 X 16 |
e4 |
.000005 Amp |
4.9 mm |
|||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.32 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
2.5 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1 mA |
8192 words |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.9 mm |
1000000 Write/Erase Cycles |
7.62 mm |
Not Qualified |
I2C |
65536 bit |
2.5 V |
e0 |
.000002 Amp |
9.55 mm |
||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
512X8 |
512 |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
3 mm |
Not Qualified |
SPI |
4096 bit |
4.5 V |
e4 |
4.4 mm |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512X8 |
512 |
-20 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
5 ms |
I2C |
4096 bit |
1.8 V |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
5 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
2.5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
DUAL |
R-PDSO-N5 |
5.5 V |
.6 mm |
1 MHz |
1.4 mm |
10 ms |
I2C |
32768 bit |
1.6 V |
1.7 mm |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
1.7 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
16 words |
2.5 |
2/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
8 |
EEPROMs |
40 |
.65 mm |
85 Cel |
16X16 |
16 |
-20 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
.5 MHz |
3 mm |
Not Qualified |
10 ms |
MICROWIRE |
256 bit |
1.8 V |
CONFIGURABLE AS 16 X 16 |
e0 |
.000005 Amp |
4.4 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
5 |
VBCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1 mA |
2048 words |
8 |
CHIP CARRIER, VERY THIN PROFILE |
SOLCC5,.06,16 |
200 |
.4 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-20 Cel |
1010DDDR |
BOTTOM |
R-XBCC-N5 |
5.5 V |
.6 mm |
4000000 Write/Erase Cycles |
.4 MHz |
1.4 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
.000002 Amp |
1.7 mm |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
1.8 |
1.8/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
10 ms |
I2C |
32768 bit |
1.7 V |
e4 |
.000001 Amp |
4.4 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.