EEPROM

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

24LC04BT-I/OTG

Microchip Technology

EEPROM

INDUSTRIAL

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

512 words

5

3/5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

EEPROMs

200

.95 mm

85 Cel

NO

512X8

512

-40 Cel

MATTE TIN

1010XXMR

DUAL

HARDWARE

R-PDSO-G5

1

5.5 V

1.45 mm

1000000 Write/Erase Cycles

.4 MHz

1.55 mm

Not Qualified

5 ms

I2C

4096 bit

2.5 V

e3

260

.000005 Amp

2.9 mm

M24256-BFDW6TP

STMicroelectronics

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

5 mA

32768 words

1.8

1.8/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

40

.65 mm

85 Cel

32KX8

32K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

1 MHz

3 mm

Not Qualified

5 ms

I2C

262144 bit

1.7 V

e4

30

260

.000001 Amp

4.4 mm

24LC1025T-I/SM

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

131072 words

3

3/5

8

SMALL OUTLINE

SOP8,.3

EEPROMs

200

1.27 mm

85 Cel

OPEN-DRAIN

128KX8

128K

-40 Cel

Matte Tin (Sn) - annealed

1010MDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

2.03 mm

1000000 Write/Erase Cycles

.4 MHz

5.25 mm

Not Qualified

5 ms

I2C

1048576 bit

2.5 V

e3

40

260

.000005 Amp

5.26 mm

3

AT28HC256-90JU

Microchip Technology

EEPROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

80 mA

32768 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

EEPROMs

1.27 mm

85 Cel

32KX8

32K

-40 Cel

NO

MATTE TIN

QUAD

R-PQCC-J32

2

5.5 V

3.556 mm

10000 Write/Erase Cycles

11.43 mm

Not Qualified

10 ms

262144 bit

4.5 V

64

e3

40

245

.0003 Amp

13.97 mm

90 ns

5

YES

24LC512T-I/SMG

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

65536 words

4.5

3/5

8

SMALL OUTLINE

SOP8,.3

EEPROMs

200

1.27 mm

85 Cel

64KX8

64K

-40 Cel

MATTE TIN

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

2.03 mm

1000000 Write/Erase Cycles

.4 MHz

5.23 mm

Not Qualified

5 ms

I2C

524288 bit

2.5 V

e3

260

.000001 Amp

5.245 mm

AT24MAC402-MAHM-T

Microchip Technology

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

256 words

2.5

1.8/5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

EEPROMs

100

.5 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

1

5.5 V

.6 mm

1000000 Write/Erase Cycles

1 MHz

2 mm

Not Qualified

5 ms

I2C

2048 bit

1.7 V

e4

40

260

.000006 Amp

3 mm

2.5

DS28E07Q+U

Analog Devices

EEPROM

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

1024 words

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC6,.11,37

10

.95 mm

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

DUAL

HARDWARE

S-PDSO-N6

5.25 V

.8 mm

10000 Write/Erase Cycles

3 mm

1-WIRE

1024 bit

3 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

3 mm

3

93LC46BT-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

2 mA

64 words

3

3/5

16

SMALL OUTLINE

SOP8,.25

EEPROMs

200

1.27 mm

85 Cel

NO

TOTEM POLE

64X16

64

-40 Cel

MATTE TIN

YES

DUAL

1

SOFTWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

2 MHz

3.9 mm

Not Qualified

6 ms

MICROWIRE

1024 bit

2.5 V

1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS

e3

30

260

.000001 Amp

4.9 mm

M24C32-FMC6TG

STMicroelectronics

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

5 mA

4096 words

1.8

1.8/5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

EEPROMs

40

.5 mm

85 Cel

4KX8

4K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

HARDWARE

R-PDSO-N8

1

5.5 V

.6 mm

1000000 Write/Erase Cycles

.4 MHz

2 mm

Not Qualified

5 ms

I2C

32768 bit

1.7 V

e4

30

260

.000001 Amp

3 mm

M95512-DRMN3TP/K

STMicroelectronics

EEPROM

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

5 mA

65536 words

5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

40

1.27 mm

125 Cel

64KX8

64K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.75 mm

4000000 Write/Erase Cycles

5 MHz

3.9 mm

Not Qualified

4 ms

SPI

524288 bit

1.8 V

e4

30

260

.000001 Amp

4.9 mm

24CW1280T-I/OT

Microchip Technology

EEPROM

INDUSTRIAL

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

1 mA

16384 words

1.8

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

200

.95 mm

85 Cel

OPEN-DRAIN

16KX8

16K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

SOFTWARE

R-PDSO-G5

5.5 V

1.45 mm

1000000 Write/Erase Cycles

1 MHz

1.63 mm

5 ms

I2C

131072 bit

1.6 V

e3

.000001 Amp

2.95 mm

1.8

24LC32A-I/SM

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

4096 words

5

8

SMALL OUTLINE

200

1.27 mm

85 Cel

OPEN-DRAIN

4KX8

4K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

5.5 V

2.03 mm

.4 MHz

5.25 mm

Not Qualified

5 ms

I2C

32768 bit

2.5 V

2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED

e3

40

260

5.26 mm

MT29F8G08ABACAWP-IT:C

Micron Technology

EEPROM CARD

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

256K

35 mA

1073741824 words

3.3

NO

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

.5 mm

85 Cel

1GX8

1G

-40 Cel

4K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

8589934592 bit

2.7 V

4K

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

.0001 Amp

18.4 mm

2.7

NO

24AA256T-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

32768 words

2.5

1.8/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

NO

OPEN-DRAIN

32KX8

32K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

262144 bit

1.7 V

e3

30

260

.000005 Amp

4.9 mm

2.5

93LC46B/P

Microchip Technology

EEPROM

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

1.5 mA

64 words

4.5

3/5

16

IN-LINE

DIP8,.3

EEPROMs

200

2.54 mm

70 Cel

64X16

64

0 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDIP-T8

6 V

5.334 mm

1000000 Write/Erase Cycles

2 MHz

7.62 mm

Not Qualified

6 ms

MICROWIRE

1024 bit

2.5 V

e3

.000001 Amp

9.271 mm

4.5

M24256-DFMC6TG

STMicroelectronics

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2.5 mA

32768 words

1.8

1.8/5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

EEPROMs

200

.5 mm

85 Cel

32KX8

32K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

HARDWARE

R-PDSO-N8

1

5.5 V

.6 mm

4000000 Write/Erase Cycles

1 MHz

2 mm

Not Qualified

5 ms

I2C

262144 bit

1.7 V

e4

30

260

.000001 Amp

3 mm

M24C32-RDW6TP

STMicroelectronics

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

4096 words

2.5

2/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

40

.65 mm

85 Cel

4KX8

4K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

32768 bit

1.8 V

e4

30

260

.000001 Amp

4.4 mm

24AA1025T-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

131072 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

OPEN-DRAIN

128KX8

128K

-40 Cel

MATTE TIN

1010MDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

1048576 bit

1.7 V

e3

30

260

.000005 Amp

4.9 mm

2.5

CAT24C128HU4IGT3

Onsemi

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

16384 words

3.3

2/5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

1

EEPROMs

100

.5 mm

85 Cel

OPEN-DRAIN

16KX8

16K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE

R-PDSO-N8

1

5.5 V

.55 mm

1000000 Write/Erase Cycles

1 MHz

2 mm

Not Qualified

5 ms

I2C

131072 bit

2.5 V

5MICROAMP STANDBY CURRENT AVAILABLE @ 125 TEMP, AND OPERATES WITH 1.8VMIN SUPPLY @ 0.1MHZ

e4

30

260

.000002 Amp

3 mm

3.3

M24512-DFMC6TG

STMicroelectronics

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

5 mA

65536 words

2.5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

64KX8

64K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N8

1

5.5 V

.6 mm

1 MHz

2 mm

5 ms

I2C

524288 bit

1.7 V

e4

30

260

3 mm

5

24LC128T-I/ST

Microchip Technology

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

16384 words

4.5

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

200

.65 mm

85 Cel

OPEN-DRAIN

16KX8

16K

-40 Cel

Matte Tin (Sn)

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

131072 bit

2.5 V

e3

40

260

.000005 Amp

4.4 mm

4.5

24C01C-I/P

Microchip Technology

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

128 words

5

5

8

IN-LINE

DIP8,.3

EEPROMs

200

2.54 mm

85 Cel

OPEN-DRAIN

128X8

128

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

R-PDIP-T8

5.5 V

5.334 mm

1000000 Write/Erase Cycles

.4 MHz

7.62 mm

Not Qualified

1 ms

I2C

1024 bit

4.5 V

e3

.000005 Amp

9.271 mm

5

AT24C01C-SSHM-B

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

128 words

2.5

8

SMALL OUTLINE

SOP8,.23

100

1.27 mm

85 Cel

NO

OPEN-DRAIN

128X8

128

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

3

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

5 ms

I2C

1024 bit

1.7 V

ALSO HAS 1 MHZ CLOCK FREQ AT 2.5V AND 5V SUPPLY

8

e4

.000006 Amp

4.925 mm

2.5

YES

DS2431GB+T

Analog Devices

EEPROM

INDUSTRIAL

2

PLASTIC/EPOXY

YES

1

CMOS

SERIAL

ASYNCHRONOUS

256 words

3.3

3/5

4

SURF MNT 2,.14X.2

EEPROMs

40

85 Cel

NO

OPEN-DRAIN

256X4

256

-40 Cel

NO

NICKEL PALLADIUM GOLD

HARDWARE

5.25 V

50000 Write/Erase Cycles

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e4

NO

M24256-BRMN6P

STMicroelectronics

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

5 mA

32768 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

40

1.27 mm

85 Cel

32KX8

32K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

262144 bit

1.8 V

e4

.000001 Amp

4.9 mm

DS2431GA+U

Analog Devices

EEPROM

INDUSTRIAL

2

VBCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

BUTT

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

CHIP CARRIER, VERY THIN PROFILE

SURF MNT 2,.14X.25

EEPROMs

40

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

NO

NICKEL GOLD PALLADIUM

BOTTOM

HARDWARE

R-XBCC-B2

5.25 V

.8 mm

50000 Write/Erase Cycles

3.5 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

6.5 mm

NO

AT24CM01-SHD-T-989

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

131072 words

5

8

SMALL OUTLINE

SOP8,.23

100

1.27 mm

85 Cel

NO

OPEN-DRAIN

128KX8

128K

-40 Cel

1010DDMR

DUAL

1

HARDWARE

R-PDSO-G8

5.5 V

2.16 mm

1000000 Write/Erase Cycles

1 MHz

5.24 mm

5 ms

I2C

1048576 bit

2.5 V

.000001 Amp

5.29 mm

5

AT28C256-15LM/883

Microchip Technology

EEPROM

MILITARY

32

QCCN

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-STD-883 Class C

NO LEAD

PARALLEL

ASYNCHRONOUS

50 mA

32768 words

5

YES

5

8

CHIP CARRIER

LCC32,.45X.55

EEPROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-55 Cel

NO

TIN LEAD

QUAD

R-CQCC-N32

5.5 V

2.54 mm

10000 Write/Erase Cycles

11.43 mm

Not Qualified

10 ms

262144 bit

4.5 V

AUTOMATIC WRITE

64

e0

.0003 Amp

13.97 mm

150 ns

5

YES

M24C04-WMN6P

STMicroelectronics

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2 mA

512 words

5

3/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

40

1.27 mm

85 Cel

512X8

512

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

1010DDMR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

4096 bit

2.5 V

e4

30

260

.000001 Amp

4.9 mm

M24C16-RMN6TP

STMicroelectronics

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1 mA

2048 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

200

1.27 mm

85 Cel

OPEN-DRAIN

2KX8

2K

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

R-PDSO-G8

1

5.5 V

1.75 mm

4000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

16384 bit

1.8 V

e4

260

.000001 Amp

4.9 mm

2.5

24AA025UID-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

8

SMALL OUTLINE

SOP8,.23

200

1.27 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

5 ms

I2C

2048 bit

2.5 V

1.7V TO 2.5V @ 0.1MHz

e3

30

260

.000001 Amp

4.9 mm

5

24LC1025-E/SN

Microchip Technology

EEPROM

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

5 mA

131072 words

3

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

125 Cel

OPEN-DRAIN

128KX8

128K

-40 Cel

MATTE TIN

1010MDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

1048576 bit

2.5 V

e3

30

260

.000005 Amp

4.9 mm

3

24LC16B/P

Microchip Technology

EEPROM

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

2048 words

5

3/5

8

IN-LINE

DIP8,.3

EEPROMs

200

2.54 mm

70 Cel

OPEN-DRAIN

2KX8

2K

0 Cel

MATTE TIN

1010MMMR

DUAL

1

HARDWARE

R-PDIP-T8

5.5 V

4.32 mm

1000000 Write/Erase Cycles

.4 MHz

7.62 mm

Not Qualified

10 ms

I2C

16384 bit

4.5 V

e3

.0001 Amp

9.46 mm

5

25AA256-I/P

Microchip Technology

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

AEC-Q100

THROUGH-HOLE

SERIAL

SYNCHRONOUS

6 mA

32768 words

2.5

2/5

8

IN-LINE

DIP8,.3

EEPROMs

200

2.54 mm

85 Cel

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDIP-T8

5.5 V

5.334 mm

1000000 Write/Erase Cycles

10 MHz

7.62 mm

Not Qualified

5 ms

SPI

262144 bit

1.8 V

e3

.000001 Amp

9.271 mm

2.5

DS2431G+U

Analog Devices

EEPROM

INDUSTRIAL

2

VBCC

SQUARE

UNSPECIFIED

YES

1

CMOS

BUTT

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

CHIP CARRIER, VERY THIN PROFILE

SURF MNT 2,.25SQ

EEPROMs

40

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

NO

NICKEL PALLADIUM GOLD

BOTTOM

HARDWARE

S-XBCC-B2

1

5.25 V

1 mm

50000 Write/Erase Cycles

6 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e4

6 mm

NO

M24C08-WMN6P

STMicroelectronics

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2 mA

1024 words

5

3/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

40

1.27 mm

85 Cel

1KX8

1K

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

1010DMMR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

8192 bit

2.5 V

e4

30

260

.000001 Amp

4.9 mm

24FC256-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

32768 words

2.5

1.8/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

NO

OPEN-DRAIN

32KX8

32K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

1 MHz

3.9 mm

Not Qualified

5 ms

I2C

262144 bit

1.7 V

e3

30

260

.000005 Amp

4.9 mm

2.5

DS28E07+T

Analog Devices

EEPROM

INDUSTRIAL

3

TO-92

ROUND

UNSPECIFIED

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

1024 words

1

CYLINDRICAL

10

2.6 mm

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

HARDWARE

O-XBCY-T3

5.25 V

10000 Write/Erase Cycles

1-WIRE

1024 bit

3 V

e3

250

3

24AA64-I/SNG

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

200

1.27 mm

85 Cel

8KX8

8K

-40 Cel

MATTE TIN

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

65536 bit

1.7 V

e3

.000001 Amp

4.9 mm

AT24C64BN-10SU-2.7

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

3

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

100

1.27 mm

85 Cel

OPEN-DRAIN

8KX8

8K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

3

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

65536 bit

2.7 V

e3

40

260

.000002 Amp

4.9 mm

3

AT24CS01-SSHM-T

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

5

1.8/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

100

1.27 mm

85 Cel

NO

3-STATE

2048X8

2048

-40 Cel

NICKEL PALLADIUM GOLD

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

3

5.5 V

1.75 mm

1000000 Write/Erase Cycles

1 MHz

3.9 mm

Not Qualified

5 ms

I2C

16384 bit

1.7 V

e4

40

260

.000001 Amp

4.925 mm

5

M24512-DRMF3TG/K

STMicroelectronics

EEPROM

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

65536 words

2.5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.08X.12,20

50

.5 mm

125 Cel

TOTEM POLE

64KX8

64K

-40 Cel

DUAL

R-PDSO-N8

1

5.5 V

.8 mm

1 MHz

2 mm

4 ms

I2C

524288 bit

1.8 V

3 mm

5

X28HC256JIZ-12T1

Renesas Electronics

EEPROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

32768 words

5

8

CHIP CARRIER

1.27 mm

85 Cel

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

3

5.5 V

3.55 mm

11.43 mm

Not Qualified

5 ms

262144 bit

4.5 V

e3

30

260

13.97 mm

120 ns

5

24LC02B-I/SNG

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

3/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

200

1.27 mm

85 Cel

256X8

256

-40 Cel

Matte Tin (Sn)

1010XXXR

DUAL

HARDWARE

R-PDSO-G8

3

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

2048 bit

2.5 V

e3

40

260

.000001 Amp

4.9 mm

ST25DV04KC-IE6S3

STMicroelectronics

EEPROM

12

24AA024-I/SN

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

2048 bit

1.7 V

e3

30

260

.000005 Amp

4.9 mm

2.5

24AA16T-E/OT

Microchip Technology

EEPROM

AUTOMOTIVE

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

2.5

2/5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

EEPROMs

200

.95 mm

125 Cel

2KX8

2K

-40 Cel

MATTE TIN

1010MMMR

DUAL

1

HARDWARE

R-PDSO-G5

1

5.5 V

1.45 mm

1000000 Write/Erase Cycles

.4 MHz

1.63 mm

Not Qualified

5 ms

I2C

16384 bit

1.7 V

1.7V TO 2.5V @ 0.1MHz

e3

260

.000005 Amp

2.95 mm

2.5

24LC32AT-I/SNG

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

4096 words

5

3/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

200

1.27 mm

85 Cel

4KX8

4K

-40 Cel

Matte Tin (Sn)

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

32768 bit

2.5 V

2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED

e3

40

260

.000001 Amp

4.9 mm

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.