DIE Flash Memory 319

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	No. of Words	Nominal Supply Voltage / Vsup (V)	Memory Width	Package Style (Meter)	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Type	Length	Maximum Access Time	Programming Voltage (V)
MZ-76P512BW	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	549755813888 words		8	UNCASED CHIP	70 Cel	512GX8	512G	0 Cel	UPPER	R-XUUC-N					4398046511104 bit					MLC NAND TYPE
MZ-76P1T0B/CN	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	1099511627776 words		8	UNCASED CHIP	70 Cel	1TX8	1T	0 Cel	UPPER	R-XUUC-N					8796093022208 bit					MLC NAND TYPE
MZ-76P4T0B/CN	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	3298534883328 words		8	UNCASED CHIP	70 Cel	4TX8	4T	0 Cel	UPPER	R-XUUC-N					26388279066624 bit					MLC NAND TYPE
MZ-76P1T0B/KR	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	1099511627776 words		8	UNCASED CHIP	70 Cel	1TX8	1T	0 Cel	UPPER	R-XUUC-N					8796093022208 bit					MLC NAND TYPE
MZ-76P1T0B/EU	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	1099511627776 words		8	UNCASED CHIP	70 Cel	1TX8	1T	0 Cel	UPPER	R-XUUC-N					8796093022208 bit					MLC NAND TYPE
MZ-76P256B/CN	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	274877906944 words		8	UNCASED CHIP	70 Cel	256GX8	256G	0 Cel	UPPER	R-XUUC-N					2199023255552 bit					MLC NAND TYPE
MZ-76P2T0B/KR	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	2199023255552 words		8	UNCASED CHIP	70 Cel	2TX8	2T	0 Cel	UPPER	R-XUUC-N					17592186044416 bit					MLC NAND TYPE
MZ-76P1T0BW	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	1099511627776 words		8	UNCASED CHIP	70 Cel	1TX8	1T	0 Cel	UPPER	R-XUUC-N					8796093022208 bit					MLC NAND TYPE
MZ-76P512B/KR	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	549755813888 words		8	UNCASED CHIP	70 Cel	512GX8	512G	0 Cel	UPPER	R-XUUC-N					4398046511104 bit					MLC NAND TYPE
MZ-76P4T0BW	Samsung	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD		ASYNCHRONOUS	3298534883328 words		8	UNCASED CHIP	70 Cel	4TX8	4T	0 Cel	UPPER	R-XUUC-N					26388279066624 bit					MLC NAND TYPE
K9F1G08R0A-XIB00	Samsung	FLASH	INDUSTRIAL		DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	134217728 words	1.8	8	UNCASED CHIP	85 Cel	128MX8	128M	-40 Cel	UPPER	R-XUUC-N	1.95 V			Not Qualified	1073741824 bit	1.65 V				SLC NAND TYPE		30 ns	1.8
K9F1G08R0A-XCB00	Samsung	FLASH	COMMERCIAL		DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	134217728 words	1.8	8	UNCASED CHIP	70 Cel	128MX8	128M	0 Cel	UPPER	R-XUUC-N	1.95 V			Not Qualified	1073741824 bit	1.65 V				SLC NAND TYPE		30 ns	1.8
MTFDDAT240MAV-1AE12ZZYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAT120MAV-1AE11AAYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAK120MAV-1AE12ZZYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm					NOT SPECIFIED	NOT SPECIFIED	MLC NAND TYPE	100.5 mm		3.3
MTFDDAT480MAV-1AE12ABYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAK480MAV-1AE11ACYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAK960MAV-1AE11AAYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAK120MAV-1AE11AAYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm					NOT SPECIFIED	NOT SPECIFIED	MLC NAND TYPE	100.5 mm		3.3
MTFDDAK120MAV-1AE11ACYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm					NOT SPECIFIED	NOT SPECIFIED	MLC NAND TYPE	100.5 mm		3.3
MTFDDAT240MAV-1AE11ABYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
SMC08GCFD6E	Micron Technology	FLASH CARD	INDUSTRIAL	50	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	8589934592 words	3.3	8	UNCASED CHIP	85 Cel	8GX8	8G	-40 Cel	UPPER	R-XUUC-N50	3.63 V	4.1 mm	36.4 mm		68719476736 bit	2.97 V	CAN ALSO OPERATE WITH 5V SUPPLY	NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	42.8 mm		3.3
MTFDDAK480MAV-1AE11ABYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAT240MAV-1AE12ACYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAT480MAV-1AE12ACYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
SMC01GCFC6E	Micron Technology	FLASH CARD	INDUSTRIAL	50	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	1073741824 words	3.3	8	UNCASED CHIP	85 Cel	1GX8	1G	-40 Cel	UPPER	R-XUUC-N50	3.63 V	4.1 mm	36.4 mm		8589934592 bit	2.97 V	CAN ALSO OPERATE WITH 5V SUPPLY	NOT SPECIFIED	NOT SPECIFIED		42.8 mm		3.3
MTFDDAK960MAV-1AE12AAYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAK960MAV-1AE12ACYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAK960MAV-1AE11ACYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAT120MAV-1AE12ACYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
SMC08GCFD6	Micron Technology	FLASH CARD	INDUSTRIAL	50	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	8589934592 words	3.3	8	UNCASED CHIP	85 Cel	8GX8	8G	-40 Cel	UPPER	R-XUUC-N50	3.63 V	4.1 mm	36.4 mm		68719476736 bit	2.97 V	CAN ALSO OPERATE WITH 5V SUPPLY	NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	42.8 mm		3.3
MTSD256AHC6MS-1WT	Micron Technology	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS	274877906944 words		8	UNCASED CHIP	85 Cel	256GX8	256G	-25 Cel	UPPER	R-XUUC-N					2199023255552 bit					NOR TYPE
MTFDDAK960MAV-1AE11ZZYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAT480MAV-1AE11ZZYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAT240MAV-1AE11ACYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAK120MAV-1AE11ABYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm					NOT SPECIFIED	NOT SPECIFIED	MLC NAND TYPE	100.5 mm		3.3
MTFDDAK480MAV-1AE12AAYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAT480MAV-1AE11ACYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAT480MAV-1AE12ZZYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
SMC128CFB6E	Micron Technology	FLASH CARD	INDUSTRIAL	50	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	134217728 words	3.3	8	UNCASED CHIP	85 Cel	128MX8	128M	-40 Cel	UPPER	R-XUUC-N50	3.63 V	4.1 mm	36.4 mm		1073741824 bit	2.97 V	CAN ALSO OPERATE WITH 5V SUPPLY	NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	42.8 mm		3.3
SMC128CFB6	Micron Technology	FLASH CARD	INDUSTRIAL	50	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	134217728 words	3.3	8	UNCASED CHIP	85 Cel	128MX8	128M	-40 Cel	UPPER	R-XUUC-N50	3.63 V	4.1 mm	36.4 mm		1073741824 bit	2.97 V	CAN ALSO OPERATE WITH 5V SUPPLY	NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	42.8 mm		3.3
MTSD128AHC6MS-1WT	Micron Technology	FLASH CARD			DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS	137438953472 words		8	UNCASED CHIP	85 Cel	128GX8	128G	-25 Cel	UPPER	R-XUUC-N					1099511627776 bit					NOR TYPE
MTFDDAT240MAV-1AE11AAYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAT240MAV-1AE12ABYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAK480MAV-1AE12ACYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAK120MAV-1AE12ABYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3
MTFDDAT120MAV-1AE11ACYY	Micron Technology	FLASH	COMMERCIAL	52	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N52		3.7 mm	29.85 mm							MLC NAND TYPE	50.8 mm		3.3
MTFDDAK960MAV-1AE12ZZYY	Micron Technology	FLASH	COMMERCIAL	22	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	NO LEAD						UNCASED CHIP					UPPER	R-XUUC-N22		7 mm	69.85 mm							MLC NAND TYPE	100.5 mm		3.3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.