RECTANGULAR Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT28EW512ABA1HJS-0SIT

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

32MX16

32M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

536870912 bit

2.7 V

30

260

NOR TYPE

18.4 mm

95 ns

3

MT29F128G08CFAAAWPITZ:A

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

17179869184 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

16GX8

16G

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e3

MLC NAND TYPE

18.4 mm

2.7

MT29F16G08ABACAWP-Z:C

Micron Technology

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

512K

50 mA

2147483648 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

2GX8

2G

0 Cel

4K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

17179869184 bit

2.7 V

4K

SLC NAND TYPE

.00005 Amp

18.4 mm

20 ns

2.7

NO

MT29F32G08ABCABH1-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

4294967296 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

4GX8

4G

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

34359738368 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MTFC4GACAANA-4MIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA100,10X17,40

1 mm

85 Cel

OPEN-DRAIN

4GX8

4G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

52 MHz

14 mm

34359738368 bit

2.7 V

30

260

MLC NAND TYPE

18 mm

3.3

MX25L25645GMI-08G

Macronix

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3

8

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

120 MHz

7.52 mm

SPI

268435456 bit

2.7 V

e3

NOR TYPE

.00002 Amp

10.3 mm

3

N25Q064A13ESFA0F

Micron Technology

FLASH

AUTOMOTIVE

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

8388608 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

125 Cel

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

10.3 mm

3

S29AL008J55TFIR10

Infineon Technologies

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

12 mA

524288 words

3.3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

20

.5 mm

85 Cel

3-STATE

512KX16

512K

-40 Cel

1,2,1,15

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

1000000 Write/Erase Cycles

12 mm

Not Qualified

TOP

8388608 bit

3 V

TOP BOOT BLOCK

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

55 ns

3

YES

S29GL256S10TFB020

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

NAND TYPE

.0002 Amp

18.4 mm

YES

100 ns

3

YES

S29GL512T10TFI023

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

32MX16

32M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

536870912 bit

2.7 V

e3

18.4 mm

100 ns

2.7

S29PL127J70BAI000

Cypress Semiconductor

FLASH

INDUSTRIAL

80

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

8388608 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,8X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-40 Cel

16,254

YES

YES

BOTTOM

R-PBGA-B80

3.6 V

1 mm

8 mm

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

TOP AND BOTTOM BOOT BLOCK

8

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

11 mm

YES

70 ns

3

YES

SST39LF401C-55-4C-B3KE

Microchip Technology

FLASH

COMMERCIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,4K,16K,32K

30 mA

262144 words

3.3

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

1,2,1,7

YES

TIN SILVER COPPER

YES

BOTTOM

1

R-PBGA-B48

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

6 mm

Not Qualified

BOTTOM

4194304 bit

3 V

BOTTOM BOOT BLOCK

e1

40

260

NOR TYPE

.00002 Amp

8 mm

YES

55 ns

3.3

YES

W25N512GVEIG

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

67108864 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

85 Cel

64MX8

64M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

166 MHz

6 mm

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

8 mm

3

W25Q128FVAIG

Winbond Electronics

FLASH

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

20 mA

134217728 words

3

3/3.3

1

IN-LINE

DIP8,.3

Flash Memories

20

2.54 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDIP-T8

3.6 V

5.33 mm

100000 Write/Erase Cycles

104 MHz

7.62 mm

Not Qualified

SPI

134217728 bit

2.7 V

NOR TYPE

.00002 Amp

9.27 mm

3

W25Q256JVBIQ

Winbond Electronics

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

3 V

ALSO OPERATES AT 104MHZ AT 2.7-3.0V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

8 mm

3.3

W25Q256JWBIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

12 mA

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

32MX8

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.95 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

8 mm

1.8

WDS500G3XHC

Western Digital

FLASH MODULE

COMMERCIAL

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

536870912000 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

500GX8

500G

0 Cel

SINGLE

R-XSMA-N

8.1 mm

300 Write/Erase Cycles

24.2 mm

4294967296000 bit

NAND TYPE

80 mm

AM29F160DB90EF

Spansion

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

50 mA

1048576 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

5.5 V

1.2 mm

12 mm

Not Qualified

90 ms

BOTTOM

16777216 bit

4.5 V

MIN 1000K WRITE CYCLE; CAN ALSO BE CONFG AS 2M X 8; BOTTOM BOOT BLOCK

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

90 ns

5

YES

AM29LV040B-70JC

Spansion

FLASH

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

64K

30 mA

524288 words

3

YES

3/3.3

8

CHIP CARRIER

LDCC32,.5X.6

Flash Memories

1.27 mm

70 Cel

512KX8

512K

0 Cel

8

YES

TIN LEAD

QUAD

R-PQCC-J32

3

3.6 V

3.556 mm

1000000 Write/Erase Cycles

11.43 mm

Not Qualified

4194304 bit

2.7 V

e0

260

NOR TYPE

.000005 Amp

13.97 mm

70 ns

3

YES

AT25DF021A-MAHN-T

Renesas Electronics

FLASH

INDUSTRIAL

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2097152 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

2MX1

2M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N

1

3.6 V

.6 mm

104 MHz

2 mm

2097152 bit

1.65 V

IT ALSO OPERATES AT 2.3V MIN

e4

NOR TYPE

3 mm

1.8

AT25DN512C-SSHF-B

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

18 mA

65536 words

3

8

SMALL OUTLINE

SOP8,.25

20

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

104 MHz

3.9 mm

SPI

524288 bit

2.3 V

e4

NOR TYPE

.000015 Amp

4.925 mm

3

AT25FF161A-SHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17.5 mA

2097152 words

1.8

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

85 Cel

3-STATE

2MX8

2M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.24 mm

SPI

16777216 bit

1.65 V

e4

NOR TYPE

.00005 Amp

5.29 mm

1.8

AT25XE041B-MHNHR-T

Renesas Electronics

FLASH

AUTOMOTIVE

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4194304 words

1

SMALL OUTLINE

125 Cel

4MX1

4M

-40 Cel

DUAL

R-PDSO-N8

1

3.6 V

85 MHz

4194304 bit

1.7 V

1.8

AT45DB041D-SSU

Atmel

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

4MX1

4M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

66 MHz

3.9 mm

Not Qualified

SPI

4194304 bit

2.7 V

ORGANIZED AS 2048 PAGES OF 264 BYTES EACH

e3

40

260

NOR TYPE

.00001 Amp

4.925 mm

2.7

IS25LP128F-JLLE

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

16777216 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

1

20

1.27 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

166 MHz

6 mm

SPI

134217728 bit

2.3 V

ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY

e3

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00007 Amp

8 mm

3

IS25WP256E-JLLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

105 Cel

32MX8

32M

-40 Cel

DUAL

R-PDSO-N8

1.95 V

.8 mm

166 MHz

6 mm

268435456 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

JS28F320J3F75A

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

80 mA

2097152 words

3

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

32

YES

Matte Tin (Sn)

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

33554432 bit

2.7 V

4/8

e3

30

260

NOR TYPE

.00012 Amp

18.4 mm

YES

75 ns

2.7

NO

M28W320FCT70N6E

STMicroelectronics

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K,32K

20 mA

2097152 words

3

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

TIN/TIN BISMUTH

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

33554432 bit

2.7 V

e3/e6

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

70 ns

3

NO

MT35XU512ABA1G12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

512MX1

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

536870912 bit

1.7 V

e1

30

260

8 mm

1.8

MTFC4GACAALT-4MIT

Micron Technology

FLASH

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA100,10X17,40

1 mm

85 Cel

OPEN-DRAIN

4GX8

4G

-40 Cel

NO

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

52 MHz

14 mm

34359738368 bit

2.7 V

e1

30

260

MLC NAND TYPE

18 mm

3.3

NO

MTFC64GAZAQHD-IT

Micron Technology

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

95 Cel

64GX8

64G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

11.5 mm

549755813888 bit

2.7 V

NAND TYPE

13 mm

MX25L6406EMI-12G

Macronix

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

8388608 words

3.3

3/3.3

8

SMALL OUTLINE

SOP16,.4

1

Flash Memories

20

1.27 mm

85 Cel

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

86 MHz

7.52 mm

Not Qualified

SPI

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

10.3 mm

3.3

MX29LV160DTTI-70G

Macronix

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000015 Amp

18.4 mm

YES

70 ns

3

YES

MX29LV640EBXEI-70G

Macronix

FLASH

INDUSTRIAL

48

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

8

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.3 mm

6 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

8 mm

70 ns

3

S29GL128P90FFIR22

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

110 mA

134217728 words

3.3

YES

3.3

1

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

128MX1

128M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

134217728 bit

3 V

8/16

e1

40

260

NOR TYPE

.000005 Amp

13 mm

YES

90 ns

3

YES

S34ML08G201TFI000

Cypress Semiconductor

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

256K

30 mA

1073741824 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

1GX8

1G

-40 Cel

4K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

8589934592 bit

2.7 V

2K

e3

260

SLC NAND TYPE

.00005 Amp

18.4 mm

3

NO

SST39SF040-70-4I-WHE-T

Microchip Technology

FLASH

INDUSTRIAL

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K

35 mA

524288 words

5

YES

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.56,20

Flash Memories

100

.5 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

128

YES

MATTE TIN

DUAL

1

R-PDSO-G32

3

5.5 V

1.2 mm

100000 Write/Erase Cycles

8 mm

Not Qualified

4194304 bit

4.5 V

e3

30

260

NOR TYPE

.0001 Amp

12.4 mm

70 ns

5

YES

AT25DF641A-MH-Y

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

40 mA

67108864 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

64MX1

64M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

85 MHz

5 mm

Not Qualified

SPI

67108864 bit

2.7 V

e4

NOR TYPE

.00002 Amp

6 mm

2.7

AT25EU0021A-SSHN-B

Renesas Electronics

FLASH

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

262144 words

1.8

8

SMALL OUTLINE

SOP8,.25

20

1.27 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

85 MHz

3.9 mm

SPI

2097152 bit

1.65 V

NOR TYPE

.0000145 Amp

4.925 mm

1.8

AT25XE081D-SHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17.5 mA

2097152 words

3.3

4

SMALL OUTLINE

SOP8,.3

20

1.27 mm

85 Cel

3-STATE

2MX4

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.24 mm

SPI

8388608 bit

2.7 V

NOR TYPE

.00005 Amp

5.29 mm

3.3

IS25LP256D-RMLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

3

8

SMALL OUTLINE

1.27 mm

105 Cel

32MX8

32M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.65 mm

133 MHz

7.49 mm

268435456 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

10.31 mm

3

IS25WP064A-JMLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

8388608 words

1.8

8

SMALL OUTLINE

1.27 mm

105 Cel

8MX8

8M

-40 Cel

DUAL

R-PDSO-G16

1.95 V

2.65 mm

133 MHz

7.49 mm

67108864 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

10.31 mm

1.8

IS25WP256E-JLLE

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

105 Cel

32MX8

32M

-40 Cel

DUAL

R-PDSO-N8

1.95 V

.8 mm

166 MHz

6 mm

268435456 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

M29W640FB70N6E

STMicroelectronics

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

20 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN/TIN BISMUTH

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

4/8

e3/e6

40

260

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

M58BW016FB7T3T

STMicroelectronics

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

40 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

QUAD

R-PQFP-G80

3.6 V

3.4 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

20 mm

YES

70 ns

3

NO

MT25QU256ABA8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

1

1 mm

125 Cel

32MX8

32M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

S25FL256SAGMFI010

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

64MX4

64M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

268435456 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

NOR TYPE

.0001 Amp

10.3 mm

3

S29AL016J70TFA020

Infineon Technologies

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

20

.5 mm

85 Cel

3-STATE

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

1000000 Write/Erase Cycles

12 mm

BOTTOM

16777216 bit

2.7 V

e3

NOR TYPE

.000005 Amp

18.4 mm

YES

70 ns

3

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.