Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
1048576 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.5 mm |
100000 Write/Erase Cycles |
75 MHz |
5.62 mm |
Not Qualified |
15 ms |
SPI |
8388608 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
5.3 mm |
2.7 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
85 mA |
268435456 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
256MX8 |
256M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
BOTTOM/TOP |
2147483648 bit |
2.7 V |
NOR TYPE |
.0005 Amp |
8 mm |
3 |
|||||||||||||||||||||||||
|
Micron Technology |
FLASH |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
35 mA |
134217728 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
10 |
1.27 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
1.95 V |
.65 mm |
100000 Write/Erase Cycles |
83 MHz |
6 mm |
SPI |
1073741824 bit |
1.7 V |
SLC NAND TYPE |
.00005 Amp |
8 mm |
1.8 |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA100,10X17,40 |
1 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.5 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
NAND TYPE |
18 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
104 MHz |
5.23 mm |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE |
SOP8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
2 V |
2.16 mm |
100000 Write/Erase Cycles |
104 MHz |
5.23 mm |
Not Qualified |
SPI |
67108864 bit |
1.65 V |
CAN BE ORGANISED AS 64 MBIT X 1 |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
5.28 mm |
1.8 |
||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
524288 words |
3.3 |
2 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
512KX2 |
512K |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
80 MHz |
3.9 mm |
1048576 bit |
2.7 V |
ALSO OPERATES 2.3-2.7V SUP @ 50MHZ |
e3 |
4.9 mm |
3.3 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.000025 Amp |
6 mm |
3 |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
66 MHz |
3.9 mm |
2097152 bit |
2.7 V |
e4 |
260 |
4.925 mm |
2.7 |
||||||||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
66 MHz |
3.9 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
ORGANIZED AS 4096 PAGES OF 256 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
4.925 mm |
2.7 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3 |
3.6 V |
1.4 mm |
14 mm |
34359738368 bit |
2.7 V |
e1 |
10 |
260 |
18 mm |
3.3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
262144 words |
2.7 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
2.3 V |
40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST |
30 |
260 |
NOR TYPE |
.000005 Amp |
4.9 mm |
2.7 |
||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
20 mA |
1048576 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
e3/e6 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
e1 |
NOR TYPE |
.0001 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
2 |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
67108864 bit |
2.65 V |
ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
5.28 mm |
3.3 |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
33554432 words |
3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
2K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
268435456 bit |
2.7 V |
512 |
e3/e6 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
12000 ns |
3 |
NO |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
108 MHz |
7.5 mm |
67108864 bit |
2.7 V |
IT IS ALSO CONFIGURED AS 64M X 1 |
e3 |
10.3 mm |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
GRID ARRAY |
85 Cel |
32MX8 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
1.95 V |
268435456 bit |
1.7 V |
96 ns |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3 |
YES |
3,3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
TIN COPPER SILVER |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
BOTTOM BOOT BLOCK |
30 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
80 mA |
4194304 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
20 |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
6.15 mm |
TOP |
67108864 bit |
2.7 V |
8/16 |
NOR TYPE |
.0001 Amp |
8.15 mm |
70 ns |
3 |
YES |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
1K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
4194304 bit |
1.65 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
1.8 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
128 |
YES |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
22 mA |
33554432 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
70 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.3 V |
e4 |
NOR TYPE |
.000001 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
133 MHz |
2 mm |
8388608 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
128057344 words |
1.8 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
105 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
1024458752 bit |
1.7 V |
30 |
260 |
10.3 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
DUAL |
R-PDSO-G8 |
2 V |
2.16 mm |
104 MHz |
5.23 mm |
134217728 bit |
1.65 V |
IT CAN ALSO BE CONFIGURABLE AS 128MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
1.65 V |
CAN BE ORGANISED AS 128 MBIT X 1 |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
1.8 |
||||||||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
3000 Write/Erase Cycles |
11 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13.5 mm |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
100 |
1.27 mm |
105 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000045 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
6 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG |
SOLCC8,.2 |
1 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
104 MHz |
5 mm |
Not Qualified |
SPI |
67108864 bit |
3 V |
.00005 Amp |
6 mm |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
70 MHz |
5.24 mm |
2097152 bit |
1.65 V |
e4 |
260 |
NOR TYPE |
5.29 mm |
2.7 |
|||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
NO |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
86 MHz |
7.52 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
1.8 |
1.8 |
4 |
SMALL OUTLINE |
SOP8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
8MX4 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
2 V |
2.16 mm |
100000 Write/Erase Cycles |
104 MHz |
5.23 mm |
Not Qualified |
SPI |
33554432 bit |
1.65 V |
CAN BE ORGANISED AS 32 MBIT X 1 |
e3 |
NOR TYPE |
.00002 Amp |
5.28 mm |
1.8 |
||||||||||||||||||||
|
Sandisk |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
2GX8 |
2G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3 |
3.6 V |
1 mm |
11.5 mm |
17179869184 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
2097152 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
70 Cel |
3-STATE |
256KX8 |
2M |
0 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
2.7 V |
e3 |
NOR TYPE |
.00003 Amp |
4.9 mm |
|||||||||||||||||||||||
|
Transcend Information |
FLASH |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8589934592 words |
8 |
UNCASED CHIP |
85 Cel |
8GX8 |
8G |
-25 Cel |
UPPER |
R-XUUC-N |
3.6 V |
68719476736 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
2.7 |
|||||||||||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
35 mA |
1073741824 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.00005 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
40 mA |
67108864 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
e4 |
NOR TYPE |
.00002 Amp |
5.29 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18 mA |
65536 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
524288 bit |
2.3 V |
e4 |
NOR TYPE |
.000015 Amp |
4.925 mm |
3 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
33554432 bit |
2.65 V |
ALSO ORGANISED AS 32MX1 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.045 Amp |
6 mm |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
32 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
260 |
NOR TYPE |
.0001 Amp |
12.4 mm |
70 ns |
5 |
YES |
||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
512 |
YES |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e1 |
NOR TYPE |
.00002 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
-40 Cel |
512 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
5 |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.