Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Spansion |
FLASH |
INDUSTRIAL |
80 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
45 mA |
4194304 words |
3 |
YES |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE |
BGA80,8X10,40 |
16 |
Flash Memories |
1 mm |
85 Cel |
4MX32 |
4M |
-40 Cel |
16,254 |
YES |
TIN LEAD |
YES |
BOTTOM |
R-PBGA-B80 |
3 |
3.6 V |
1.4 mm |
10 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
4/8 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
15 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
Adesto Technologies |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
1 |
SMALL OUTLINE |
125 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
85 MHz |
4194304 bit |
2.5 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Dialog Semiconductor |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 mA |
8388608 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
104 MHz |
2 mm |
SPI |
8388608 bit |
2.5 V |
ALSO OPERATES WITH 2.3VMIN SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000025 Amp |
3 mm |
3 |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
524288 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
105 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
4194304 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000018 Amp |
4.9 mm |
3 |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
1.27 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
SPI |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0002 Amp |
10.3 mm |
1.8 |
||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE |
4 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.52 mm |
134217728 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 64M X 2 AND 128M X 1 |
e3 |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 128M X 1 |
e3 |
NOR TYPE |
.00002 Amp |
6 mm |
3 |
|||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
2.16 mm |
80 MHz |
5.23 mm |
16777216 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
108 MHz |
7.5 mm |
268435456 bit |
2.7 V |
30 |
260 |
NOR TYPE |
10.3 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16K,64K |
31 mA |
16777216 words |
3 |
NO |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
BOTTOM |
268435456 bit |
2.3 V |
BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE |
e1 |
NOR TYPE |
.00021 Amp |
13 mm |
YES |
95 ns |
3 |
NO |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
20 |
1.27 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
80 MHz |
7.5 mm |
SPI |
512753664 bit |
2.7 V |
e3 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
1.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
1.8 |
||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
3.6 V |
536870912 bit |
2.7 V |
96 ns |
3 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B56 |
3 |
3.6 V |
1 mm |
7 mm |
1073741824 bit |
2.7 V |
9 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8K,64K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
OTHER |
84 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
80 mA |
16777216 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA84,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
8,254 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B84 |
3 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
80 ns |
1.8 |
YES |
||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
17179869184 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
15 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
2097152 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00003 Amp |
4.9 mm |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
128 |
YES |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOR TYPE |
.0001 Amp |
12.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||||
|
Transcend Information |
FLASH CARD |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
34359738368 words |
8 |
UNCASED CHIP |
85 Cel |
32GX8 |
32G |
-25 Cel |
UPPER |
R-XUUC-N |
3.6 V |
274877906944 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
.000055 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
19 mA |
8388608 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
1000000 Write/Erase Cycles |
85 MHz |
7.5 mm |
Not Qualified |
5 ms |
SPI |
67108864 bit |
2.7 V |
e4 |
NOR TYPE |
.000005 Amp |
10.3 mm |
2.7 |
||||||||||||||||||||||
Samsung |
FLASH CARD |
OTHER |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
4294967296 words |
1.8 |
8 |
GRID ARRAY |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B |
34359738368 bit |
3.3V SUPPLY IS ALSO AVAILABLE |
NAND TYPE |
1.8 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
256MX4 |
256M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
166 MHz |
7.52 mm |
1073741824 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 1G X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
50 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
33554432 words |
3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
1 |
2 |
.5 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
14 mm |
268435456 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e3 |
NAND TYPE |
.0001 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
2.5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
80 MHz |
2 mm |
8388608 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
20 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G48 |
3 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION |
e3 |
40 |
260 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
|||||||||||||||||||||||||
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
2.8 mm |
1000000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
28.2 mm |
90 ns |
5 |
YES |
||||||||||||||||
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
8 |
1.27 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.8 mm |
13.3 mm |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
28.2 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.24 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
5.29 mm |
3 |
|||||||||||||||||||||||||||
|
Dialog Semiconductor |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 mA |
8388608 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
8388608 bit |
2.5 V |
ALSO OPERATES WITH 2.3VMIN SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000025 Amp |
4.925 mm |
3 |
||||||||||||||||||||||||
Dialog Semiconductor |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
1 |
SMALL OUTLINE |
125 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
85 MHz |
16777216 bit |
2.5 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
2MX4 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
2 mm |
SPI |
8388608 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
3 mm |
3.3 |
||||||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
105 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
120 MHz |
5.23 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000025 Amp |
5.28 mm |
3.3 |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
50 MHz |
7.5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.00001 Amp |
10.3 mm |
2.7 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
125 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512K |
50 mA |
2147483648 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
4K |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
17179869184 bit |
2.7 V |
4K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
30 ns |
2.7 |
NO |
||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
120 MHz |
7.52 mm |
134217728 bit |
2.7 V |
CAN BE ORGANISED AS 128 M X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
64 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM/TOP |
33554432 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
2MX1 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-N8 |
1.95 V |
.6 mm |
100000 Write/Erase Cycles |
40 MHz |
2 mm |
SPI |
2097152 bit |
1.65 V |
e3 |
NOR TYPE |
.00001 Amp |
3 mm |
1.8 |
|||||||||||||||||||||||
Kioxia Holdings |
FLASH |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
28 mA |
524288 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
HARDWARE |
R-XDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
6 mm |
SPI |
4294967296 bit |
2.7 V |
NAND TYPE |
.00021 Amp |
8 mm |
3.3 |
|||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
17179869184 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
137438953472 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4194304 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
33554432 bit |
3 V |
2.7V NOMINAL AVAILABLE WITH 104MHZ |
e1 |
260 |
8 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.