Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3.6 V |
1.4 mm |
9 mm |
BOTTOM/TOP |
33554432 bit |
2.7 V |
NOR TYPE |
9 mm |
110 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
134217728 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
1073741824 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
120 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
1 |
1 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3.6 V |
1.4 mm |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
NOR TYPE |
9 mm |
120 ns |
2.7 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
80 mA |
4194304 words |
3 |
YES |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
20 |
1 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM |
67108864 bit |
2.7 V |
8/16 |
NOR TYPE |
.0001 Amp |
9 mm |
70 ns |
3 |
YES |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
134217728 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
1073741824 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
120 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
120 ns |
3 |
YES |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||
|
Infineon Technologies |
FLASH |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
67108864 words |
3 |
YES |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
1 |
2 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
9 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e1 |
30 |
260 |
NAND TYPE |
.0002 Amp |
9 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
120 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
CAN ALSO BE ORGANISED AS 512MX1 |
9 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
33554432 words |
3 |
YES |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
20 |
1 mm |
125 Cel |
3-STATE |
32MX16 |
32M |
-55 Cel |
512 |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100 Write/Erase Cycles |
9 mm |
.00006 ms |
536870912 bit |
2.7 V |
16 |
260 |
NOR TYPE |
.0002 Amp |
9 mm |
YES |
120 ns |
3 |
YES |
||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
e1 |
260 |
9 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
120 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
120 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
105 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
NOR TYPE |
9 mm |
120 ns |
2.7 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
160 mA |
134217728 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
2147483648 bit |
16/32 |
NOR TYPE |
.0002 Amp |
YES |
120 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
160 mA |
134217728 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
2147483648 bit |
16/32 |
NOR TYPE |
.0002 Amp |
YES |
110 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
105 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
110 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
120 ns |
2.7 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
130 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
130 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
105 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
120 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
160 mA |
134217728 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
2147483648 bit |
16/32 |
NOR TYPE |
.0002 Amp |
YES |
110 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
130 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
e1 |
260 |
9 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
e1 |
9 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
160 mA |
134217728 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
2147483648 bit |
16/32 |
NOR TYPE |
.0002 Amp |
YES |
120 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
160 mA |
134217728 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
2147483648 bit |
16/32 |
NOR TYPE |
.0002 Amp |
YES |
110 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
125 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
536870912 bit |
2.7 V |
9 mm |
120 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
160 mA |
134217728 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
2147483648 bit |
16/32 |
NOR TYPE |
.0002 Amp |
YES |
120 ns |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.