SQUARE Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S29GL512T12DHVV23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

9 mm

120 ns

2.7

S29GL512S12DHIV20

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

67108864 words

3

YES

3/3.3

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

64MX8

64M

-40 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

Not Qualified

536870912 bit

2.7 V

16

e1

30

260

NOR TYPE

.0001 Amp

9 mm

YES

120 ns

2.7

YES

S70GL02GS120FHIV13

Infineon Technologies

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

160 mA

134217728 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

2147483648 bit

16/32

NOR TYPE

.0002 Amp

YES

120 ns

YES

S29GL512T12DHN010

Infineon Technologies

FLASH

AUTOMOTIVE

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

9 mm

120 ns

2.7

S70GL02GS110FHI010

Infineon Technologies

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

160 mA

134217728 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

2147483648 bit

16/32

NOR TYPE

.0002 Amp

YES

110 ns

YES

S29GL512T10DHA010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

9 mm

100 ns

2.7

S29GL512T11DHV010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

9 mm

110 ns

2.7

S29GL512T11DHV020

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

9 mm

110 ns

2.7

S29GL512T10DHI010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

32MX16

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

e1

260

9 mm

100 ns

2.7

S25FS128SDSMFB1D1

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25FS064SDSMFN013

Infineon Technologies

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16777216 words

1.8

4

SMALL OUTLINE

2

1.27 mm

125 Cel

16MX4

16M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.159 mm

80 MHz

5.283 mm

67108864 bit

1.7 V

IT ALSO HAVE MEMORY WIDTH X 1

5.283 mm

1.8

S25FS064SAGMFI011

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16777216 words

1.8

4

SMALL OUTLINE

2

1.27 mm

85 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

3

2 V

2.159 mm

133 MHz

5.283 mm

67108864 bit

1.7 V

IT ALSO HAVE MEMORY WIDTH X 1

e3

5.283 mm

1.8

AM29DL640G120PCEN

Infineon Technologies

FLASH

MILITARY

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K,64K

45 mA

4194304 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

125 Cel

4MX16

4M

-55 Cel

16,126

YES

TIN LEAD

YES

BOTTOM

S-PBGA-B64

3

Not Qualified

BOTTOM/TOP

67108864 bit

e0

260

NOR TYPE

.000005 Amp

YES

120 ns

YES

S25FL064LABMFV041

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

60 mA

8388608 words

3

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

105 Cel

8MX8

8M

-40 Cel

DUAL

R-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.28 mm

SPI

67108864 bit

2.7 V

NOR TYPE

.00003 Amp

5.28 mm

3

S25HL02GTFABHI050

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

130 mA

268435456 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

256MX8

256M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1.2 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

2147483648 bit

2.7 V

NOR TYPE

.000041 Amp

8 mm

3

S29AL016J55FFAR10

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3.3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

1MX16

1M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

16777216 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

9 mm

55 ns

3

S25FL064LABNFA041

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

85 Cel

16MX4

16M

-40 Cel

DUAL

S-PDSO-N8

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT IS ALSO CONFIGURED AS 64M X 1

4 mm

3

S25FS064SAGMFN013

Infineon Technologies

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16777216 words

1.8

4

SMALL OUTLINE

2

1.27 mm

125 Cel

16MX4

16M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.159 mm

133 MHz

5.283 mm

67108864 bit

1.7 V

IT ALSO HAVE MEMORY WIDTH X 1

5.283 mm

1.8

S25HL04GTDPBHB050

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

220 mA

4294967296 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

2.7 V

NOR TYPE

.000065 Amp

8 mm

3

S25FS128SAGMFA101

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25FL064LABNFN011

Infineon Technologies

FLASH

AUTOMOTIVE

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

125 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT ALSO HAVE X1 MEMORY WIDTH

e3

NOR TYPE

4 mm

3

S25FL127SABMFV100

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

50 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.3

4

Flash Memories

20

1.27 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3

3.6 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.28 mm

Not Qualified

SPI

134217728 bit

2.7 V

e3

NOR TYPE

.0003 Amp

5.28 mm

3

S25FS128SAGMFM103

Infineon Technologies

FLASH

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

125 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25FS128SDSMFV100

Infineon Technologies

FLASH

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25FL064LABNFB011

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

105 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT ALSO HAVE X1 MEMORY WIDTH

e3

4 mm

3

S29AL016J55FFIR22

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3.3

YES

3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

BOTTOM

16777216 bit

3 V

BOTTOM BOOT BLOCK

NOR TYPE

.000005 Amp

9 mm

YES

55 ns

3

YES

S25FS128SDSMFM1D1

Infineon Technologies

FLASH

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

125 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25HS04GTDPBHM050

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

175 mA

4294967296 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

1.7 V

NOR TYPE

.00013 Amp

8 mm

1.8

S25FL064LABNFN041

Infineon Technologies

FLASH

AUTOMOTIVE

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

125 Cel

16MX4

16M

-40 Cel

DUAL

S-PDSO-N8

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT IS ALSO CONFIGURED AS 64M X 1

NOR TYPE

4 mm

3

S25FL064LABMFN041

Infineon Technologies

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE

1

1.27 mm

125 Cel

8MX8

8M

-40 Cel

DUAL

S-PDSO-G8

3.6 V

2.16 mm

108 MHz

5.28 mm

67108864 bit

2.7 V

5.28 mm

3

S25FL128LDPMFB011

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

50 mA

16777216 words

3

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

66 MHz

5.28 mm

SPI

134217728 bit

2.7 V

NOR TYPE

.00006 Amp

5.28 mm

3

S25FS128SDSMFA1D1

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25HS04GTDPBHM053

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

175 mA

4294967296 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

1.7 V

NOR TYPE

.00013 Amp

8 mm

1.8

S25FL064LABNFN010

Infineon Technologies

FLASH

AUTOMOTIVE

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

125 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT ALSO HAVE X1 MEMORY WIDTH

e3

NOR TYPE

4 mm

3

S25HL04GTDPBHM050

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

220 mA

4294967296 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

2.7 V

NOR TYPE

.00013 Amp

8 mm

3

S25HL04GTDPBHI050

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

220 mA

4294967296 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

2.7 V

NOR TYPE

.000065 Amp

8 mm

3

S25HS02GTDPBHM053

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

110 mA

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

3-STATE

256MX8

256M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3

2 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

2147483648 bit

1.7 V

NOR TYPE

.00011 Amp

8 mm

1.8

S25FL128LAGMFA013

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

50 mA

16777216 words

3

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

2.7 V

e3

NOR TYPE

.00006 Amp

5.28 mm

3

S25FS128SDSMFA1D3

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

2

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

5.28 mm

1.8

S25HS02GTFABHA050

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

130 mA

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

256MX8

256M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1.2 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

2147483648 bit

1.7 V

NOR TYPE

.00004 Amp

8 mm

1.8

S25FS128SDSMFV1D0

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

1.8

4

SMALL OUTLINE

2

1.27 mm

105 Cel

32MX4

32M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.159 mm

80 MHz

5.283 mm

134217728 bit

1.7 V

5.283 mm

1.8

AM29DL640G70PCIN

Infineon Technologies

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K,64K

45 mA

4194304 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

16,126

YES

TIN LEAD

YES

BOTTOM

S-PBGA-B64

3

Not Qualified

BOTTOM/TOP

67108864 bit

e0

260

NOR TYPE

.000005 Amp

YES

70 ns

YES

S25FS128SDSMFI1D3

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

1.8

4

SMALL OUTLINE

2

1.27 mm

85 Cel

32MX4

32M

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

3

2 V

2.159 mm

80 MHz

5.283 mm

134217728 bit

1.7 V

e3

5.283 mm

1.8

S29AL016J70FFA013

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

1MX16

1M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

9 mm

70 ns

3

S29AL016J70FFN010

Infineon Technologies

FLASH

AUTOMOTIVE

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

.000005 Amp

9 mm

YES

70 ns

3

YES

S29AL016J70FFA010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

1MX16

1M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

9 mm

70 ns

3

S25HS04GTDPBHI053

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

175 mA

4294967296 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

1.7 V

NOR TYPE

.000065 Amp

8 mm

1.8

S25HS04GTDPBHV053

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

175 mA

4294967296 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1.2 mm

2560000 Write/Erase Cycles

133 MHz

8 mm

SPI

4294967296 bit

1.7 V

NOR TYPE

.000065 Amp

8 mm

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.