Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Spansion |
FLASH |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
262144 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.8,20 |
Flash Memories |
20 |
.5 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
1,2,1,3 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
3 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
2097152 bit |
2.7 V |
MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
3 |
YES |
|||||||||||||||||
|
Spansion |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
8 |
YES |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
3 |
YES |
||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
8 |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
3 |
5.5 V |
5.715 mm |
1000000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
42.037 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.25 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.75 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
55 ns |
5 |
YES |
||||||||||||||||||||
|
Spansion |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
524288 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.001 Amp |
18.4 mm |
90 ns |
5 |
YES |
||||||||||||||
|
Spansion |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3 |
8 |
CHIP CARRIER |
20 |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
1048576 bit |
2.7 V |
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION |
e3 |
40 |
260 |
13.97 mm |
55 ns |
3 |
||||||||||||||||||||||||||||
|
Catalyst Semiconductor |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
YES |
MATTE TIN |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
NOR TYPE |
.00001 Amp |
42.03 mm |
120 ns |
12 |
NO |
|||||||||||||||||||||||
|
Onsemi |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
YES |
TIN |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
NOR TYPE |
.00001 Amp |
42.03 mm |
120 ns |
12 |
NO |
|||||||||||||||||||||||
|
Macronix |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
8 |
YES |
Tin (Sn) |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
14.05 mm |
70 ns |
5 |
YES |
||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
NOR TYPE |
13.97 mm |
70 ns |
12 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
100 |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
128 |
YES |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
3.6 V |
2.8448 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3 |
245 |
NOR TYPE |
.000015 Amp |
13.97 mm |
70 ns |
3 |
YES |
||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
262144 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
2.8 mm |
1000000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
TOP |
4194304 bit |
2.7 V |
TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
28.2 mm |
90 ns |
3 |
YES |
||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
512K |
50 mA |
2147483648 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
17179869184 bit |
4K |
SLC NAND TYPE |
.00005 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
4294967296 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
34359738368 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Western Digital |
FLASH MODULE |
COMMERCIAL |
SMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
536870912000 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
500GX8 |
500G |
0 Cel |
SINGLE |
R-XSMA-N |
2.38 mm |
300 Write/Erase Cycles |
22 mm |
4294967296000 bit |
NAND TYPE |
80 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Spansion |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
8 |
YES |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||
|
Spansion |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
1,2,1,7 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.75 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
55 ns |
5 |
YES |
||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
4294967296 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
34359738368 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
262144 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
100 |
1.27 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
64 |
YES |
Matte Tin (Sn) |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
e3 |
40 |
245 |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.71,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
1K |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
262144 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
64 |
YES |
Matte Tin (Sn) |
DUAL |
1 |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
2097152 bit |
4.5 V |
e3 |
40 |
260 |
NOR TYPE |
.0001 Amp |
12.4 mm |
70 ns |
5 |
YES |
|||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
524288 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
1,2,1,15 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.001 Amp |
18.4 mm |
90 ns |
5 |
YES |
||||||||||||||||
|
Onsemi |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,112K |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
1,2,1 |
YES |
TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
260 |
NOR TYPE |
.000001 Amp |
13.97 mm |
120 ns |
12 |
NO |
|||||||||||||||||
|
Intel |
EEPROM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
4194304 words |
3.3 |
3.3 |
1 |
FLATPACK |
Flash Memories |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
100000 Write/Erase Cycles |
66.7 MHz |
Not Qualified |
4194304 bit |
3 V |
e3 |
NOR TYPE |
.00015 Amp |
||||||||||||||||||||||||||||||
|
Sk Hynix |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K |
30 mA |
67108864 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
536870912 bit |
512 |
SLC NAND TYPE |
.00005 Amp |
18 ns |
NO |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
8388608 words |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
70 Cel |
3-STATE |
8MX1 |
8M |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
50 MHz |
5 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
e4 |
NOR TYPE |
.00003 Amp |
6 mm |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
524288 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
0 Cel |
256 |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
8388608 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
55 ns |
3.3 |
YES |
||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
1K |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
67108864 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
4K |
YES |
TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
536870912 bit |
2.7 V |
512 |
e6 |
260 |
.00005 Amp |
18.4 mm |
30 ns |
3.3 |
NO |
|||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K |
25 mA |
33554432 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
2K |
YES |
TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3 |
Not Qualified |
268435456 bit |
512 |
e6 |
260 |
.00005 Amp |
30 ns |
NO |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
2.7 |
NO |
||||||||||||||||||||
|
Advantech |
FLASH MODULE |
COMMERCIAL |
52 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
68719476736 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64GX8 |
64G |
0 Cel |
SINGLE |
R-XSMA-N52 |
4.2 mm |
30 mm |
549755813888 bit |
MLC NAND TYPE |
50.8 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Amic Technology |
FLASH |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
26 mA |
4194304 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
70 Cel |
4MX8 |
4M |
0 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
100000 Write/Erase Cycles |
100 MHz |
Not Qualified |
SPI |
33554432 bit |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000015 Amp |
2.7 |
|||||||||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
256 |
15 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
1K |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
20 ms |
BOTTOM/TOP |
2097152 bit |
3 V |
e0 |
225 |
NOR TYPE |
.00004 Amp |
13.97 mm |
200 ns |
3 |
YES |
||||||||||||||||||
Intel |
EEPROM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
4194304 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
3.4 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.00015 Amp |
20 mm |
|||||||||||||||||||||||||||
|
Catalyst Semiconductor |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
YES |
MATTE TIN |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
NOR TYPE |
.00001 Amp |
18.4 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||
|
Onsemi |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
YES |
TIN |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
NOR TYPE |
.00001 Amp |
18.4 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
536870912 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
512MX8 |
512M |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
1.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
Amic Technology |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
8 |
YES |
DUAL |
R-PDIP-T32 |
5.5 V |
5.334 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
41.91 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512K |
50 mA |
2147483648 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
17179869184 bit |
2.7 V |
4K |
e3 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
20 ns |
2.7 |
NO |
||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
1M |
50 mA |
4294967296 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
34359738368 bit |
4K |
MLC NAND TYPE |
.00005 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
262144 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
128 |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
30 mA |
2097152 words |
3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
2MX8 |
2M |
0 Cel |
32 |
YES |
YES |
DUAL |
R-PDSO-G40 |
1 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
16777216 bit |
2.7 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
1,2,1,31 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
Advanced Micro Devices |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
1,2,1,31 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
MIN 1000K WRITE CYCLES; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,1,1 |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.5 V |
e0 |
240 |
NOR TYPE |
.00003 Amp |
18.4 mm |
120 ns |
5 |
YES |
||||||||||||||||||
|
Greenliant Systems |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
NO |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
.00005 Amp |
13.97 mm |
70 ns |
5 |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.