Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
256 |
e0 |
240 |
NOR TYPE |
.0001 Amp |
18.4 mm |
120 ns |
5 |
YES |
||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
NO |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.57 mm |
10000 Write/Erase Cycles |
16.5862 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
128 |
e0 |
225 |
NOR TYPE |
.0002 Amp |
16.5862 mm |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
15 mA |
131072 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1K |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.56 mm |
11.43 mm |
Not Qualified |
20 ms |
1048576 bit |
3 V |
e0 |
225 |
NOR TYPE |
.00004 Amp |
13.97 mm |
150 ns |
3 |
YES |
|||||||||||||||||||
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
32MX1 |
32M |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
13 MHz |
8 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
HARDWARE DATA PROTECTION; SPI SERIAL INTERFACE |
e0 |
240 |
NOR TYPE |
.00001 Amp |
18.4 mm |
2.7 |
|||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,32K,64K |
80 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
8,2,30 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
4.5 V |
CONFIGURABLE AS 2M X 8 |
e0 |
NOR TYPE |
.003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
50 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
BOTTOM |
2097152 bit |
3 V |
e0 |
240 |
NOR TYPE |
.00005 Amp |
18.4 mm |
90 ns |
3 |
YES |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
64 mA |
4194304 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
16 |
Flash Memories |
.5 mm |
70 Cel |
4MX8 |
4M |
0 Cel |
64 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
128/256 |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
70 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
1048576 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
CONFG AS 512K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
5 |
NO |
|||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
16777216 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
1K |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
512 |
e0 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
35 ns |
2.7 |
NO |
|||||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
55 mA |
524288 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
1,2,1,3 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
100000 ERASE CYCLES; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
80 ns |
5 |
NO |
|||||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
30 mA |
1048576 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G40 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
100,000 ERASE CYCLES, USER SELECTABLE VPP=3.3V/5V/12V; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
100 ns |
3 |
NO |
|||||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
25 mA |
524288 words |
3.3 |
NO |
3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G44 |
3.6 V |
2.8 mm |
100000 Write/Erase Cycles |
12.6 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
100,000 ERASE CYCLES; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
28.02 mm |
90 ns |
3 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
1073741824 bit |
2.7 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
18.4 mm |
2.7 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
132 |
PLASTIC/EPOXY |
YES |
CMOS |
PARALLEL |
1M |
50 mA |
NO |
1.8,3/3.3 |
BGA132,11X17,40 |
Flash Memories |
70 Cel |
0 Cel |
32K |
YES |
YES |
Not Qualified |
274877906944 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4294967296 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
34359738368 bit |
2.7 V |
30 |
260 |
MLC NAND TYPE |
18.4 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
1073741824 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
1GX8 |
1G |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
8589934592 bit |
2.7 V |
4K |
SLC NAND TYPE |
.0001 Amp |
11 mm |
NO |
||||||||||||||||||||||||
Samsung |
FLASH MODULE |
COMMERCIAL |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
500000000000 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
500GX8 |
500G |
0 Cel |
SINGLE |
R-XSMA-N |
4000000000000 bit |
MLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,112K |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,2,1 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.5 V |
DEEP POWER-DOWN; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000001 Amp |
13.97 mm |
120 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
100000 ERASE/PROGRAM CYCLES |
e0 |
NOR TYPE |
.0001 Amp |
13.97 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
524288 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
1,2,1,3 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.95 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
CONFG AS 256K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
28.2 mm |
70 ns |
5 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
524288 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
1,2,1,3 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.95 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
CONFG AS 256K X 16; USER SELECTABLE AS 5V OR 12V VPP; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
28.2 mm |
80 ns |
5 |
NO |
|||||||||||||||||||
|
Intel |
FLASH |
COMMERCIAL |
22 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
515396075520 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
480GX8 |
480G |
0 Cel |
SINGLE |
R-XSMA-N22 |
5.25 V |
7 mm |
69.85 mm |
4123168604160 bit |
4.75 V |
ALSO OPERATES @ 12V NOM, AVAILABLE 2.5INCH @ 100GB, 1.8INCH @ 800GB, LG-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
100.45 mm |
5 |
|||||||||||||||||||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
30 mA |
131072 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
20 |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
2.7 V |
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION |
e0 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
3 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1K |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
5.59 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
e0 |
NOR TYPE |
.0001 Amp |
42.05 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,1,1 |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
42.037 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.55 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
NOR TYPE |
13.97 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
256 |
e0 |
240 |
NOR TYPE |
.0001 Amp |
18.4 mm |
100 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
250 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.75 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.75 V |
e0 |
NOR TYPE |
13.97 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
524288 bit |
4.75 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
128 |
e0 |
225 |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
4194304 words |
2.7 |
2.7/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
1.27 mm |
70 Cel |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
15 MHz |
5.24 mm |
Not Qualified |
SPI |
4194304 bit |
2.5 V |
ORGANIZED AS 2048 PAGES OF 264 BYTES EACH |
e0 |
240 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
|||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
Flash Memories |
.55 mm |
70 Cel |
32MX1 |
32M |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
40 MHz |
8 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
ORGANISED AS 8192 PAGES OF 528 BYTES EACH |
e0 |
NOR TYPE |
.000015 Amp |
11.8 mm |
2.7 |
||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,248K |
50 mA |
262144 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
BOTTOM |
2097152 bit |
2.7 V |
e0 |
240 |
NOR TYPE |
.00005 Amp |
18.4 mm |
120 ns |
2.7 |
YES |
||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
90 mA |
262144 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
1 |
5.5 V |
5.59 mm |
15.24 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
HARDWARE DATA PROTECTION |
e0 |
NOR TYPE |
.0001 Amp |
42.05 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
50 mA |
131072 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
BOTTOM |
1048576 bit |
3 V |
e0 |
225 |
NOR TYPE |
.00005 Amp |
13.97 mm |
90 ns |
3 |
YES |
||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,32K,64K |
50 mA |
1048576 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
8,2,30 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
3 V |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
90 ns |
3 |
YES |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
60 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
10 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
DUAL |
R-PDSO-N40 |
5.25 V |
1.2 mm |
100000 Write/Erase Cycles |
10 mm |
Not Qualified |
TOP |
2097152 bit |
4.75 V |
BOTTOM BOOT BLOCK |
NOR TYPE |
.0000012 Amp |
18.4 mm |
80 ns |
12 |
NO |
|||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
128K |
35 mA |
134217728 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
1K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
1073741824 bit |
2K |
SLC NAND TYPE |
.00008 Amp |
20 ns |
2.7 |
NO |
||||||||||||||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
45 mA |
4194304 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
4MX8 |
4M |
-20 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.25 V |
1.2 mm |
10 mm |
Not Qualified |
33554432 bit |
4.75 V |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||||||
Fujitsu |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
35 mA |
1048576 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
1,2,1,15 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
CAN ALSO BE CONFIGURABLE AS 512K X 16 ;100K PROGRAM/ERASE CYCLE MIN |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
120 ns |
3 |
YES |
||||||||||||||||||
Spansion |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,224K,256K |
70 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
-20 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
ALSO CONFIGURABLE AS 2M X 8 |
8/16 |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
75 ns |
3 |
YES |
||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
2097152 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
2MX8 |
2M |
0 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
16777216 bit |
4.5 V |
DEEP POWER DOWN; USER CONFIGURABLE 5V OR 12V VPP |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
90 ns |
5 |
NO |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
35 mA |
268435456 words |
3.3 |
NO |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX16 |
256M |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
2.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
Samsung |
FLASH MODULE |
COMMERCIAL |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
268435456000 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
250GX8 |
250G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
2147483648000 bit |
MLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH MODULE |
COMMERCIAL |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
1000000000000 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1TX8 |
1T |
0 Cel |
SINGLE |
R-XSMA-N |
8000000000000 bit |
MLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH MODULE |
COMMERCIAL |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
250000000000 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
250GX8 |
250G |
0 Cel |
SINGLE |
R-XSMA-N |
2000000000000 bit |
MLC NAND TYPE |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.