Infineon Technologies Flash Memory 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S29CD032J1JQAM023

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

TOP

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29CL016J0MFFI110

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

512KX32

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

13 mm

54 ns

3.3

S29GL064S90TFVV23

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

105 Cel

8MX8

8M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

BOTTOM/TOP

67108864 bit

2.7 V

NOR TYPE

18.4 mm

90 ns

3

S28HL512TGABHV0100

Infineon Technologies

FLASH

3

S29GL01GT11DHBV10

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

GRID ARRAY, LOW PROFILE

1

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

1073741824 bit

2.7 V

9 mm

110 ns

2.7

S29CD016J0JBFI033

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S29CL016J0MQFI112

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

85 Cel

512KX32

512K

-40 Cel

MATTE TIN

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

3 V

BOTTOM BOOT BLOCK

e3

NOR TYPE

20 mm

54 ns

3.3

S28HL256TGABHM0333

Infineon Technologies

FLASH

3

S29GL512T11TFB030

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

105 Cel

32MX16

32M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

536870912 bit

2.7 V

CAN ALSO BE ORGANISED AS 512MX1

NOR TYPE

18.4 mm

110 ns

2.7

S29CL016J0MFAI01

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

GRID ARRAY

1 mm

85 Cel

512KX32

512K

-40 Cel

BOTTOM

R-PBGA-B80

3.6 V

1.4 mm

56 MHz

11 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

13 mm

54 ns

3.3

S29CD032J1JQAI130

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

2.6

32

FLATPACK

.8 mm

85 Cel

1MX32

1M

-40 Cel

TIN LEAD

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

TOP

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

NOR TYPE

20 mm

54 ns

2.7

S29GL512T12DHBV10

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

536870912 bit

2.7 V

NOR TYPE

9 mm

120 ns

2.7

S29GL512T12DHVV33

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

536870912 bit

2.7 V

NOR TYPE

9 mm

120 ns

2.7

S29GL064N11TFAV22

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

BOTTOM/TOP

67108864 bit

2.7 V

NOR TYPE

18.4 mm

110 ns

3

S29CD016J1MQAI020

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

2.6

32

FLATPACK

.8 mm

85 Cel

512KX32

512K

-40 Cel

QUAD

R-PQFP-G80

2.75 V

3.35 mm

14 mm

Not Qualified

TOP

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

NOR TYPE

20 mm

54 ns

2.7

S29CD016J0MQAI03

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

QUAD

R-PQFP-G80

2.75 V

3.35 mm

56 MHz

14 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29GL032N90FAI22

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

2MX16

2M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

33554432 bit

2.7 V

e0

NOR TYPE

13 mm

90 ns

3

S29CL016J0JFFM112

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

GRID ARRAY, LOW PROFILE

1 mm

125 Cel

512KX32

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

3 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

13 mm

54 ns

3.3

S29CL032J1JFAI000

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

3.3

YES

S29CD032G0PQAN010

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

2K,16K

90 mA

1048576 words

YES

1.8/2.6,2.6

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

Not Qualified

BOTTOM

33554432 bit

e0

260

NOR TYPE

.00006 Amp

YES

54 ns

YES

S29CL016J0MQAI013

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

3.3

YES

S29GL01GT13TFA013

Infineon Technologies

FLASH

S29GL064S90FHVV23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

GRID ARRAY, LOW PROFILE

1 mm

105 Cel

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM/TOP

67108864 bit

2.7 V

NOR TYPE

13 mm

90 ns

3

S28HL01GTFPBHI010

Infineon Technologies

FLASH

S29GL01GT10TFA040

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

64MX16

64M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

1073741824 bit

2.7 V

NOR TYPE

18.4 mm

100 ns

2.7

S29GL01GT10TFB013

Infineon Technologies

FLASH

S28HS256TFPBHA0103

Infineon Technologies

FLASH

1.8

S29CL016J0MQAM122

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

125 Cel

512KX32

512K

-40 Cel

TIN LEAD

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

16777216 bit

3 V

e0

NOR TYPE

20 mm

54 ns

3.3

S29GL01GT11TFBV40

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1

.5 mm

105 Cel

128MX8

128M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

1073741824 bit

2.7 V

18.4 mm

110 ns

2.7

S29GL032N90FFI32

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

2MX16

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

33554432 bit

2.7 V

e1

13 mm

90 ns

3

S29CD016J0JDGH037

Infineon Technologies

FLASH

AUTOMOTIVE

74

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

524288 words

2.6

32

UNCASED CHIP

145 Cel

512KX32

512K

-40 Cel

UPPER

R-XUUC-N74

2.75 V

Not Qualified

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

NOR TYPE

54 ns

2.7

S29GL01GT10DHB040

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

GRID ARRAY, LOW PROFILE

1

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

1073741824 bit

2.7 V

9 mm

100 ns

2.7

S29CL016J1JQFI003

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

MATTE TIN

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e3

40

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

3.3

YES

S29WS256P0SBFW300

Infineon Technologies

FLASH

OTHER

84

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS/ASYNCHRONOUS

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B84

1.95 V

1 mm

8 mm

BOTTOM/TOP

268435456 bit

1.7 V

NOR TYPE

11.6 mm

80 ns

1.8

S29CD032J0MQAI032

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29GL256P13FFIV22

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

16MX16

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

e1

NOR TYPE

13 mm

110 ns

3

S29GL512T11DHBV30

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

8

GRID ARRAY, LOW PROFILE

1

1 mm

105 Cel

64MX8

64M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

9 mm

110 ns

2.7

S29GL256P13FFIV12

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

16MX16

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

e1

NOR TYPE

13 mm

110 ns

3

S29GL01GP11TFCR22

Infineon Technologies

FLASH

OTHER

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

1073741824 words

COMMON

3.3

YES

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSOP56,.78,20

20

.5 mm

85 Cel

TOTEM POLE

1GX1

1G

0 Cel

YES

YES

DUAL

HARDWARE/SOFTWARE

R-PDSO-G56

3.6 V

1.2 mm

14 mm

1073741824 bit

3 V

.000005 Amp

18.4 mm

110 ns

3

YES

S29CD016J0PBAM123

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

524288 words

2.6

32

GRID ARRAY, LOW PROFILE

1 mm

125 Cel

512KX32

512K

-40 Cel

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

16777216 bit

2.5 V

11 mm

54 ns

2.7

S29CL032J0RQAM030

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

BOTTOM

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

48 ns

3.3

YES

S29WS256R0PBHW200

Infineon Technologies

FLASH

OTHER

84

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B84

1.95 V

1 mm

8 mm

TOP

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE, TOP BOOT BLOCK

NOR TYPE

11.6 mm

80 ns

1.8

S28HS01GTGABHA013

Infineon Technologies

FLASH

S29CL016J0JDGH014

Infineon Technologies

FLASH

AUTOMOTIVE

74

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

UNCASED CHIP

145 Cel

512KX32

512K

-40 Cel

UPPER

R-XUUC-N74

3.6 V

Not Qualified

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

NOR TYPE

54 ns

3.3

S29WS01GS0SWHW103

Infineon Technologies

S29NS01GS0SWHW103

Infineon Technologies

S29CD016J0JBAI022

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

Not Qualified

TOP

16777216 bit

2.5 V

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S29WS064J1ABAI000

Infineon Technologies

FLASH

INDUSTRIAL

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA80,8X10,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

16,126

YES

YES

BOTTOM

R-PBGA-B80

Not Qualified

BOTTOM/TOP

67108864 bit

NOR TYPE

.00005 Amp

YES

45 ns

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.