Infineon Technologies Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S28HS256TFPBHA0333

Infineon Technologies

FLASH

1.8

S29CL016J0MFAM003

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

3.3

YES

S29GL01GT13DHB040

Infineon Technologies

FLASH

S29XS032R0PBHW301

Infineon Technologies

FLASH

S29GL512T12FHVV20

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM/TOP

536870912 bit

2.7 V

NOR TYPE

13 mm

120 ns

2.7

S29GL512T11FHBV40

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

8

GRID ARRAY, LOW PROFILE

1

1 mm

105 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

536870912 bit

2.7 V

13 mm

110 ns

2.7

S29GL256S11DHIV20

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

33554432 words

3

YES

3/3.3

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

32MX8

32M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

Not Qualified

268435456 bit

2.7 V

16

e1

30

260

NOR TYPE

.0001 Amp

9 mm

YES

110 ns

2.7

YES

S29CD032G0MQAN002

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

2K,16K

90 mA

1048576 words

YES

1.8/2.6,2.6

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

Not Qualified

TOP

33554432 bit

e0

260

NOR TYPE

.00006 Amp

YES

64 ns

YES

S29CD016J1MQFM132

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

2.6

32

FLATPACK

.8 mm

125 Cel

512KX32

512K

-40 Cel

MATTE TIN

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

TOP BOOT BLOCK

e3

NOR TYPE

20 mm

54 ns

2.7

S29GL512T13FHV043

Infineon Technologies

FLASH

S29WS512POPBFW000

Infineon Technologies

FLASH

OTHER

84

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

80 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA84,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

8, 510

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B84

3

Not Qualified

BOTTOM/TOP

536870912 bit

8

e1

40

260

NOR TYPE

.000005 Amp

YES

11.2 ns

YES

S29CL016J0PQAI00

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

85 Cel

512KX32

512K

-40 Cel

QUAD

R-PQFP-G80

3.6 V

3.35 mm

66 MHz

14 mm

Not Qualified

.000065 ms

TOP

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

20 mm

54 ns

3.3

S28HS256TGABHB0130

Infineon Technologies

FLASH

1.8

S29CL032J1JQFM033

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

MATTE TIN

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

BOTTOM

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e3

40

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

3.3

YES

S26HS256TFPBHB020

Infineon Technologies

FLASH

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

32MX8

32M

-40 Cel

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1 mm

640000 Write/Erase Cycles

166 MHz

6 mm

SPI

268435456 bit

1.7 V

NOR TYPE

8 mm

1.8

S29CD016J1JBAM003

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

Not Qualified

TOP

16777216 bit

2.5 V

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S29CD032J0MQFM022

Infineon Technologies

FLASH

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

32

FLATPACK

QFP80,.7X.9,32

20

.8 mm

125 Cel

3-STATE

1MX32

1M

-40 Cel

16,62

YES

YES

QUAD

R-PQFP-G80

2.75 V

3.35 mm

1000000 Write/Erase Cycles

56 MHz

14 mm

.00006 ms

TOP

33554432 bit

2.5 V

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.6

YES

S29GL128P90FAI013

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

1

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

134217728 bit

2.7 V

NOR TYPE

13 mm

90 ns

3

S28HL512TGABHM0100

Infineon Technologies

FLASH

3

S29CD016J0MFAI133

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29WS01GRAABHW402

Infineon Technologies

S29CD032J1JFAI023

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

TOP

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29GL064S90FHBV23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

4194304 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

20

1 mm

105 Cel

3-STATE

4MX16

4M

-40 Cel

128

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

67108864 bit

2.7 V

8/16

NOR TYPE

.0001 Amp

13 mm

90 ns

3

YES

FL116K0XMFI041

Infineon Technologies

FLASH

S29GL512T11TFAV20

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

32MX16

32M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

BOTTOM/TOP

536870912 bit

2.7 V

NOR TYPE

18.4 mm

110 ns

2.7

S29CL016J1JFAM012

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

3.3

YES

S29WS01GSAAWHW203

Infineon Technologies

S29GL064N90TAIR13

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

4MX16

4M

-40 Cel

TIN LEAD

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

Not Qualified

67108864 bit

3 V

e0

NOR TYPE

18.4 mm

90 ns

3

S29GL064N11FFAV10

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM/TOP

67108864 bit

2.7 V

NOR TYPE

13 mm

110 ns

3

S29CD032J0RFAI122

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

2.6

32

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

1MX32

1M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e0

NOR TYPE

13 mm

48 ns

2.7

S29CL016J1MFFM133

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

GRID ARRAY, LOW PROFILE

1 mm

125 Cel

512KX32

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

3 V

TOP BOOT BLOCK

e1

NOR TYPE

13 mm

54 ns

3.3

S29CL032J0JBAM003

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3.6 V

1.4 mm

9 mm

Not Qualified

TOP

33554432 bit

3 V

e0

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S28HS256TGABHI0333

Infineon Technologies

FLASH

1.8

S29CD032J0PQAM003

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

TOP

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29GL064N11DFIV22

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

50 mA

4194304 words

3

YES

1.8/3.3,3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

128

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

BOTTOM/TOP

67108864 bit

2.7 V

8/16

NOR TYPE

.000005 Amp

9 mm

YES

110 ns

3

YES

S29GL01GT13GHIV30

Infineon Technologies

FLASH

S29GL01GT13FAI023

Infineon Technologies

FLASH

S29GL01GT11DHAV33

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

1073741824 bit

2.7 V

NOR TYPE

9 mm

110 ns

2.7

S29CL016J1JQFI01

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

85 Cel

512KX32

512K

-40 Cel

QUAD

R-PQFP-G80

3.6 V

3.35 mm

40 MHz

14 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

20 mm

54 ns

3.3

S29GL064S80TFIV73

Infineon Technologies

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

8MX8

8M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

14 mm

67108864 bit

2.7 V

18.4 mm

80 ns

3

S29CD016J0JFAI000

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29GL064N90BFI032

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

TOP

67108864 bit

2.7 V

8/16

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

90 ns

3

YES

S29NS128N0PBFW002

Infineon Technologies

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

60 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

4,127

YES

TIN SILVER COPPER NICKEL

YES

BOTTOM

R-PBGA-B44

3

Not Qualified

TOP

134217728 bit

e2

40

260

NOR TYPE

.00004 Amp

YES

80 ns

YES

S29CD016J0JFAM000

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29CD016J1MFFM030

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

2.6

32

GRID ARRAY, LOW PROFILE

1 mm

125 Cel

512KX32

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

TOP BOOT BLOCK

e1

NOR TYPE

13 mm

54 ns

2.7

S29CL032J0JBFM000

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B80

3.6 V

1.4 mm

9 mm

Not Qualified

TOP

33554432 bit

3 V

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S26HL512TFPBHI023

Infineon Technologies

FLASH

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

64MX8

64M

-40 Cel

BOTTOM

HARDWARE

R-PBGA-B24

3.6 V

1 mm

1280000 Write/Erase Cycles

166 MHz

6 mm

SPI

536870912 bit

2.7 V

NOR TYPE

8 mm

3

S29CL016J0PQAM120

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

125 Cel

512KX32

512K

-40 Cel

TIN LEAD

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

16777216 bit

3 V

TOP BOOT BLOCK

e0

NOR TYPE

20 mm

54 ns

3.3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.