Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
5 |
EEPROM+SRAM |
8 |
SMALL OUTLINE |
SOP8,.23 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
3 |
5.5 V |
1.75 mm |
3.9 mm |
4096 bit |
4.5 V |
e3 |
40 |
260 |
4.9 mm |
400 ns |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MEMORY CIRCUIT |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
EEPROM+SRAM |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
.65 mm |
125 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
3 mm |
4096 bit |
2.7 V |
e3 |
40 |
260 |
4.4 mm |
400 ns |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTO MEMORY |
COMMERCIAL |
8 |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
32768 words |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,8LEAD,.46 |
70 Cel |
32KX8 |
32K |
0 Cel |
Nickel/Gold (Ni/Au) |
UNSPECIFIED |
1 |
R-XXMA-X8 |
5.5 V |
262144 bit |
2.7 V |
e4 |
35 ns |
||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTO MEMORY |
COMMERCIAL |
8 |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
32768 words |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,8LEAD,.46 |
70 Cel |
32KX8 |
32K |
0 Cel |
MATTE TIN |
UNSPECIFIED |
1 |
R-XXMA-X8 |
5.5 V |
262144 bit |
2.7 V |
35 ns |
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|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
65536 words |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
105 Cel |
64KX1 |
64K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.2 mm |
2.9 mm |
65536 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.3 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
65536 words |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
64KX1 |
64K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
3.9 mm |
65536 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
5 |
EEPROM+SRAM |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
.65 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
3 mm |
4096 bit |
4.5 V |
e3 |
40 |
260 |
4.4 mm |
400 ns |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
5 mm |
16777216 bit |
2.7 V |
e3 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1048576 words |
3.3 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.65 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.55 mm |
3.23 mm |
8388608 bit |
1.8 V |
3.28 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1048576 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1.27 mm |
105 Cel |
1MX8 |
1M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
5 mm |
8388608 bit |
2.7 V |
e3 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
|
Fujitsu |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.73 mm |
5.3 mm |
4194304 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
5.85 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
SPI BUS SERIAL EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
32768 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
262144 bit |
2.7 V |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MEMORY CIRCUIT |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
5 |
EEPROM+SRAM |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
.65 mm |
125 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
3 mm |
4096 bit |
4.5 V |
e3 |
40 |
260 |
4.4 mm |
400 ns |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MEMORY CIRCUIT |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2048 words |
EEPROM+SRAM |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
.65 mm |
125 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
3 mm |
16384 bit |
2.7 V |
e3 |
40 |
260 |
4.4 mm |
400 ns |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTO MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
128 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
1.27 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
DUAL |
1 |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
1024 bit |
2.7 V |
4.9 mm |
250 ns |
|||||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
AUTOMOTIVE |
8 |
HSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SYNCHRONOUS |
32768 words |
3.3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG |
SOLCC8,.25 |
SRAMs |
1.27 mm |
125 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
1.05 mm |
5 mm |
Not Qualified |
262144 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00001 Amp |
6 mm |
||||||||||||||||||||||||||||||||||||
|
Lapis Semiconductor |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.65 mm |
3.9 mm |
1048576 bit |
1.8 V |
4.9 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Lapis Semiconductor |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
4096 words |
3.3 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.65 mm |
3.9 mm |
32768 bit |
2.7 V |
4.9 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTO MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
32768 words |
8 |
SMALL OUTLINE |
SOP8,.23 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1 |
R-PDSO-G8 |
5.5 V |
1.75 mm |
3.9 mm |
262144 bit |
2.7 V |
e3 |
4.925 mm |
35 ns |
||||||||||||||||||||||||||||||||||||||||
|
Lapis Semiconductor |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.65 mm |
3.9 mm |
65536 bit |
1.8 V |
4.9 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
4096 words |
1 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
4096 bit |
2.7 V |
e3 |
4.925 mm |
|||||||||||||||||||||||||||||||||||||||||
Xilinx |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
5 mA |
1040128 words |
COMMON |
3.3 |
3.3 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
1040128X1 |
1040128 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
3.6 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
1040128 bit |
3 V |
e0 |
30 |
225 |
.00005 Amp |
9.3599 mm |
|||||||||||||||||||||||||||||||
Xilinx |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
10 mA |
329312 words |
COMMON |
5 |
5 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
329312X1 |
329312 |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDIP-T8 |
1 |
5.5 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
329312 bit |
4.5 V |
e0 |
30 |
225 |
.00005 Amp |
9.3599 mm |
|||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2048 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
2KX1 |
2K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
5.25 V |
1.727 mm |
3.9 mm |
Not Qualified |
2048 bit |
2.4 V |
SRAM IS ORGANISED AS 512MB |
e4 |
20 |
260 |
4.889 mm |
|||||||||||||||||||||||||||||||||||||
Xilinx |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
10 mA |
178144 words |
COMMON |
5 |
5 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
178144X1 |
178144 |
0 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
178144 bit |
4.75 V |
e0 |
30 |
225 |
.00005 Amp |
9.3599 mm |
|||||||||||||||||||||||||||||||
Lapis Semiconductor |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.65 mm |
3.9 mm |
65536 bit |
1.8 V |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Atmel |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
1024 words |
3.3 |
3/5 |
1 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
MATTE TIN |
1011CCCC |
DUAL |
SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
100000 Write/Erase Cycles |
3.9 mm |
Not Qualified |
I2C |
1024 bit |
2.7 V |
e3 |
.0001 Amp |
4.925 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G8 |
3 |
3.65 V |
1.727 mm |
3.8985 mm |
4096 bit |
2.7 V |
260 |
4.889 mm |
|||||||||||||||||||||||||||||||||||||||||
Lapis Semiconductor |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
262144 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDIP-T8 |
3.6 V |
7.62 mm |
2097152 bit |
2.7 V |
9.2 mm |
||||||||||||||||||||||||||||||||||||||||||||||
Xilinx |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
5 mA |
95752 words |
COMMON |
3.3 |
3.3 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
95752X1 |
95752 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
3.6 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
95752 bit |
3 V |
e0 |
30 |
225 |
.00005 Amp |
9.3599 mm |
|||||||||||||||||||||||||||||||
Xilinx |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
5 mA |
249168 words |
COMMON |
3.3 |
3.3 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
249168X1 |
249168 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
3.6 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
249168 bit |
3 V |
e0 |
30 |
225 |
.00005 Amp |
9.3599 mm |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
EEPROM+SRAM |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
.65 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
3 mm |
4096 bit |
2.7 V |
e3 |
40 |
260 |
4.4 mm |
400 ns |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTO MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
128 words |
8 |
SMALL OUTLINE |
SOP8,.23 |
1.27 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
R-PDSO-G8 |
5.5 V |
1.75 mm |
3.9 mm |
1024 bit |
2.7 V |
e4 |
4.925 mm |
35 ns |
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|
Microchip Technology |
CRYPTO MEMORY |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
128 words |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
EEPROMs |
.5 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
DUAL |
1 |
R-XDSO-N8 |
3.6 V |
.6 mm |
2 mm |
Not Qualified |
1024 bit |
2.7 V |
3 mm |
250 ns |
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|
Microchip Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
4096 words |
1 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
4096 bit |
2.7 V |
e3 |
4.925 mm |
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|
Microchip Technology |
CRYPTO MEMORY |
8 |
SOP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
2048 bit |
2.7 V |
e3 |
4.9 mm |
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|
Microchip Technology |
CRYPTO MEMORY |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
512 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.23 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
1 |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
4096 bit |
2.7 V |
4.9 mm |
250 ns |
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|
Microchip Technology |
CRYPTO MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
1024 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
DUAL |
1 |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
8192 bit |
2.7 V |
4.9 mm |
250 ns |
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|
Microchip Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SYNCHRONOUS |
524288 words |
8 |
SMALL OUTLINE |
SOP8,.23 |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
3.6 V |
1.75 mm |
3.9 mm |
4194304 bit |
2.7 V |
e3 |
4.9 mm |
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|
Texas Instruments |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
GULL WING |
2097152 words |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
OTP ROMs |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3 |
Not Qualified |
16777216 bit |
30 |
260 |
.00005 Amp |
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Analog Devices |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP8,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
Not Qualified |
e0 |
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Analog Devices |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP8,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MEMORY CIRCUIT |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
64 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64X1 |
64 |
-25 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
2.13 mm |
5.285 mm |
Not Qualified |
64 bit |
2.7 V |
e0 |
5.31 mm |
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Analog Devices |
MEMORY CIRCUIT |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP8,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GULL WING |
64 words |
32 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
105 Cel |
64X32 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
10 V |
1.75 mm |
3.9 mm |
2048 bit |
1.8 V |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GULL WING |
64 words |
32 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
105 Cel |
64X32 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
10 V |
1.75 mm |
3.9 mm |
2048 bit |
1.8 V |
4.9 mm |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.