RECTANGULAR Other Function Memory ICs 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S98WS064RBOHI0010

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

67108864 bit

1.7 V

10 mm

S70KL1281DABHB033

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1 mm

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

S70KL1281DABHA030

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1 mm

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

S70KL1281DABHA023

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1 mm

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

S70KS1281DPBHB020

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

16777216 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

1.95 V

1 mm

6 mm

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

S71KL512SC0BHA000

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

67108864 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B24

1 mm

6 mm

536870912 bit

HYPER RAM IS ORGANISED AS 8MX8

8 mm

S71KL512SC0BHV000

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

105 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B24

3

1 mm

6 mm

536870912 bit

HYPER RAM IS ORGANISED AS 8MX8

8 mm

S71GL064NB0BFW0U3

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B56

3

3.1 V

1.2 mm

7 mm

Not Qualified

67108864 bit

2.7 V

PSRAM IS ORGANIZED AS 2M X 16

e1

40

260

9 mm

S71NS128NA0BJWSE2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWSF2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S72WS01GSF0YHM150

Infineon Technologies

MEMORY CIRCUIT

OTHER

186

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

1.8

FLASH+SDRAM

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA186,13X17,25

Other Memory ICs

.65 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B186

1.95 V

1.2 mm

11 mm

Not Qualified

536870912 bit

1.7 V

512 MBIT SDRAM

13 mm

100 ns

S71NS128NA0BJWMF3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSN2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS256RD0AHKJL0

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA56,10X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B56

Not Qualified

S71NS128NA0BJWMM3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S70KL1281DABHB030

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1 mm

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

S71GL128PC0HH31Y0

Infineon Technologies

MEMORY CIRCUIT

OTHER

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

R-PBGA-B84

3.1 V

1.2 mm

8 mm

Not Qualified

134217728 bit

2.7 V

11.6 mm

S72WS512RE0HH6GN0

Infineon Technologies

MEMORY CIRCUIT

OTHER

137

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-20 Cel

BOTTOM

R-PBGA-B137

1.95 V

1.2 mm

9 mm

536870912 bit

1.7 V

11.5 mm

S71NS128NA0BJWMM2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSM2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71GL032NA0BHW0U2

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

2097152 words

3

FLASH+SRAM

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA56,8X8,32

Other Memory ICs

.8 mm

85 Cel

2MX16

2M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B56

3

3.1 V

1.2 mm

7 mm

Not Qualified

33554432 bit

2.7 V

PSRAM IS ORGANIZED AS 1M X 16

e1

40

260

9 mm

90 ns

S98NS128NB0HW0023

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

R-PBGA-B56

1.95 V

1.2 mm

8 mm

134217728 bit

1.7 V

9.2 mm

S71GL032NA0BFW0Z3

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

2097152 words

3

FLASH+SRAM

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA56,8X8,32

Other Memory ICs

.8 mm

85 Cel

2MX16

2M

-25 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B56

3

3.1 V

1.2 mm

7 mm

Not Qualified

33554432 bit

2.7 V

PSRAM IS ORGANIZED AS 1M X 16

e1

40

260

9 mm

90 ns

S71GL032N40BHW0K2

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

2MX16

2M

-25 Cel

BOTTOM

R-PBGA-B56

3.1 V

1.2 mm

7 mm

Not Qualified

33554432 bit

2.7 V

PSRAM IS ORGANIZED AS 256K X 16

9 mm

S71NS128NA0BJWSF3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S72WS01GSF0YHMJ50

Infineon Technologies

MEMORY CIRCUIT

OTHER

186

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

1.8

FLASH+SDRAM

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA186,13X17,25

Other Memory ICs

.65 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B186

1.95 V

1.2 mm

11 mm

Not Qualified

536870912 bit

1.7 V

512 MBIT SDRAM

13 mm

100 ns

S72WS01GSF0YHMJ53

Infineon Technologies

MEMORY CIRCUIT

OTHER

186

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

1.8

FLASH+SDRAM

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA186,13X17,25

Other Memory ICs

.65 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B186

1.95 V

1.2 mm

11 mm

Not Qualified

536870912 bit

1.7 V

512 MBIT SDRAM

13 mm

100 ns

S71NS064NB0BHWTN2

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B56

1.95 V

1.2 mm

8 mm

67108864 bit

1.7 V

PSRAM IS ORGANIZED AS 2M X 16

9.2 mm

S98WS064RBOHI0013

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

67108864 bit

1.7 V

10 mm

SM2603T-6

Infineon Technologies

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

8388608 words

1,2,4,8,FP

COMMON

2.5/3.3,3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

Other Memory ICs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

DUAL

R-PDSO-G54

166 MHz

Not Qualified

67108864 bit

1,2,4,8

4.3 ns

S98WS064RBOHI0020

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

67108864 bit

1.7 V

10 mm

SM2604T-10

Infineon Technologies

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

4194304 words

1,2,4,8,FP

COMMON

2.5/3.3,3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

Other Memory ICs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

DUAL

R-PDSO-G54

100 MHz

Not Qualified

67108864 bit

1,2,4,8

4.7 ns

S71GL032N80BHW0K2

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

2MX16

2M

-25 Cel

BOTTOM

R-PBGA-B56

3.1 V

1.2 mm

7 mm

Not Qualified

33554432 bit

2.7 V

PSRAM IS ORGANIZED AS 512K X 16

9 mm

S71NS128NA0BJWSP3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWSW0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

CY8C24633-24PVXI

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

8192 words

1

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

8KX1

8K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3

5.25 V

2 mm

5.3 mm

Not Qualified

8192 bit

3 V

e4

20

260

10.2 mm

S98WS064RBOHW0010

Infineon Technologies

MEMORY CIRCUIT

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

67108864 bit

1.7 V

10 mm

S70KL1281DABHI030

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1 mm

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

S71NS128NA0BJWMY2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71GL064NB0BHW0U2

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

4194304 words

3

FLASH+PSRAM

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA56,8X8,32

Other Memory ICs

.8 mm

85 Cel

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B56

3

3.1 V

1.2 mm

7 mm

Not Qualified

67108864 bit

2.7 V

PSRAM IS ORGANIZED AS 2M X 16

e1

40

260

9 mm

90 ns

S71GL064NA0BFW0Z3

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

4194304 words

3

FLASH+SRAM

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA56,8X8,32

Other Memory ICs

.8 mm

85 Cel

4MX16

4M

-25 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B56

3

3.1 V

1.2 mm

7 mm

Not Qualified

67108864 bit

2.7 V

PSRAM IS ORGANIZED AS 1M X 16

e1

40

260

9 mm

90 ns

S72NS512RE0AHGL40

Infineon Technologies

MEMORY CIRCUIT

OTHER

133

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

1.8

FLASH+SDRAM

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA133,14X14,20

Other Memory ICs

.5 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B133

1.95 V

1 mm

10 mm

Not Qualified

536870912 bit

1.7 V

DRAM IS ORGANISED AS 16M X 16

11 mm

S71GL128PC0HH30Y0

Infineon Technologies

MEMORY CIRCUIT

OTHER

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

R-PBGA-B84

3.1 V

1.2 mm

8 mm

Not Qualified

134217728 bit

2.7 V

11.6 mm

S71NS128NA0BJWMP2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS064NB0BHWTN3

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B56

1.95 V

1.2 mm

8 mm

67108864 bit

1.7 V

PSRAM IS ORGANIZED AS 2M X 16

9.2 mm

S71GL032NA0BFW0U3

Infineon Technologies

MEMORY CIRCUIT

OTHER

56

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

2097152 words

3

FLASH+SRAM

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA56,8X8,32

Other Memory ICs

.8 mm

85 Cel

2MX16

2M

-25 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B56

3

3.1 V

1.2 mm

7 mm

Not Qualified

33554432 bit

2.7 V

PSRAM IS ORGANIZED AS 1M X 16

e1

40

260

9 mm

90 ns

S71NS128NA0BJWMP3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71KL512SC0BHI003

Infineon Technologies

MEMORY CIRCUIT

INDUSTRIAL

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

3

8

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B24

1 mm

6 mm

536870912 bit

HYPER RAM IS ORGANISED AS 8MX8

8 mm

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.