Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
70 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
145 mA |
262144 words |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP70,.46 |
Other Memory ICs |
.635 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G70 |
Not Qualified |
4194304 bit |
e0 |
.00013 Amp |
60 ns |
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Renesas Electronics |
VIDEO DRAM |
COMMERCIAL |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
110 mA |
131072 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ40,.44 |
Other Memory ICs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
DUAL |
R-PDSO-J40 |
Not Qualified |
1048576 bit |
.007 Amp |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2044 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
R-PDMA-N168 |
31.75 mm |
Not Qualified |
1207959552 bit |
.073 Amp |
60 ns |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
77 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
HYBRID |
BALL |
45 mA |
FLASH+SRAM |
2.6/3 |
GRID ARRAY, FINE PITCH |
BGA77,8X14,32 |
Other Memory ICs |
.8 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B77 |
Not Qualified |
.00001 Amp |
100 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
+-5,12 |
SMALL OUTLINE |
SOP24,.5 |
Other Memory ICs |
1.27 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
80 mA |
5 |
5 |
IN-LINE |
ZIP28,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T28 |
Not Qualified |
e0 |
.08 Amp |
25 ns |
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Renesas Electronics |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
5 |
5 |
SMALL OUTLINE |
SOP28,.45 |
Other Memory ICs |
1.27 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
e0 |
25 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1099 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
Not Qualified |
603979776 bit |
.0685 Amp |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
70 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
105 mA |
262144 words |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP70,.46 |
Other Memory ICs |
.635 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G70 |
Not Qualified |
4194304 bit |
e0 |
.00013 Amp |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1630 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
25.4 mm |
Not Qualified |
301989888 bit |
.019 Amp |
70 ns |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
910 mA |
2097152 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
2MX72 |
2M |
0 Cel |
DUAL |
R-PDMA-N168 |
25.4 mm |
Not Qualified |
150994944 bit |
.041 Amp |
60 ns |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
61 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
1048576 words |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
1MX16 |
1M |
-20 Cel |
BOTTOM |
R-PBGA-B61 |
3 V |
1.2 mm |
7 mm |
Not Qualified |
16777216 bit |
2.6 V |
SRAM CONFIGURATION IS 256K X 16 |
9 mm |
||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
860 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
1MX72 |
1M |
0 Cel |
DUAL |
R-PDMA-N168 |
25.4 mm |
Not Qualified |
75497472 bit |
.066 Amp |
70 ns |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
PIN/PEG |
90 mA |
5 |
5 |
GRID ARRAY |
PGA68,11X11 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
77 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
HYBRID |
BALL |
45 mA |
FLASH+SRAM |
2.6/3 |
GRID ARRAY, FINE PITCH |
BGA77,8X14,32 |
Other Memory ICs |
.8 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B77 |
Not Qualified |
.00001 Amp |
80 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
800 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
Not Qualified |
301989888 bit |
.05 Amp |
50 ns |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
150 mA |
2097152 words |
3.3 |
3.3 |
4 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Memory ICs |
.5 mm |
70 Cel |
2MX4 |
2M |
0 Cel |
QUAD |
S-PQFP-G48 |
3.6 V |
1.7 mm |
7 mm |
Not Qualified |
8388608 bit |
3 V |
7 mm |
6 ns |
|||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
786432 words |
1.8 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
768KX8 |
768K |
0 Cel |
QUAD |
S-PQFP-G100 |
1.98 V |
1.7 mm |
14 mm |
Not Qualified |
6291456 bit |
1.62 V |
14 mm |
||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
40 mA |
5 |
5 |
SMALL OUTLINE |
SOP24,.5 |
Other Memory ICs |
1.27 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
.04 Amp |
40 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
40 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
190 mA |
262144 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
2097152 bit |
e0 |
.001 Amp |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
112 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
800 mA |
524288 words |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM112 |
Other Memory ICs |
1.27 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
DUAL |
R-PDMA-N112 |
Not Qualified |
16777216 bit |
.008 Amp |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1864 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
25.4 mm |
Not Qualified |
301989888 bit |
.073 Amp |
60 ns |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1045 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
Not Qualified |
603979776 bit |
.05 Amp |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
80 mA |
5 |
5 |
IN-LINE |
DIP24,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
.08 Amp |
21 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
60 mA |
+-5,12 |
IN-LINE |
DIP24,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
.06 Amp |
27 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
77 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
HYBRID |
BALL |
45 mA |
FLASH+SRAM |
2.6/3 |
GRID ARRAY, FINE PITCH |
BGA77,8X14,32 |
Other Memory ICs |
.8 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B77 |
Not Qualified |
.00001 Amp |
90 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
40 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
205 mA |
262144 words |
5 |
5 |
8 |
IN-LINE |
ZIP40,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T40 |
Not Qualified |
2097152 bit |
e0 |
.001 Amp |
70 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
VIDEO DRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
160 mA |
262144 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
Other Memory ICs |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
1048576 bit |
e0 |
.004 Amp |
100 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1100 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
603979776 bit |
.0025 Amp |
6 ns |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
22 |
DIP |
64 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
4096 words |
SEPARATE |
1 |
IN-LINE |
DIP22,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
4096 bit |
e0 |
250 ns |
|||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1320 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
603979776 bit |
.018 Amp |
6.5 ns |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
70 mA |
+-5,12 |
IN-LINE |
DIP24,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
.07 Amp |
27 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
40 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
200 mA |
262144 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
2097152 bit |
e0 |
.001 Amp |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2700 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
301989888 bit |
.036 Amp |
6 ns |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1215 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
603979776 bit |
.0045 Amp |
6 ns |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1242 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
29.21 mm |
83 MHz |
Not Qualified |
301989888 bit |
.036 Amp |
9 ns |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
72 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
840 mA |
524288 words |
COMMON |
5 |
5 |
40 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
512KX40 |
512K |
0 Cel |
SINGLE |
R-PSMA-N72 |
25.4 mm |
Not Qualified |
20971520 bit |
.02 Amp |
80 ns |
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Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
90 mA |
5 |
5 |
IN-LINE |
DIP24,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
.09 Amp |
21 ns |
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Renesas Electronics |
COMMERCIAL |
22 |
DIP |
64 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
4096 words |
SEPARATE |
1 |
IN-LINE |
DIP22,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
4096 bit |
e0 |
150 ns |
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Renesas Electronics |
VIDEO DRAM |
COMMERCIAL |
40 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
200 mA |
262144 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
2097152 bit |
e0 |
.0002 Amp |
80 ns |
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Renesas Electronics |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
80 mA |
5 |
5 |
SMALL OUTLINE |
SOP24,.5 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
.08 Amp |
18 ns |
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Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
64 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
262144 words |
3.3 |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP64,.54,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G64 |
Not Qualified |
4194304 bit |
e0 |
.00013 Amp |
70 ns |
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Renesas Electronics |
COMMERCIAL |
22 |
DIP |
64 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
4096 words |
SEPARATE |
1 |
IN-LINE |
DIP22,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
4096 bit |
e0 |
300 ns |
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Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
64 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
262144 words |
3.3 |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP64,.54,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G64 |
Not Qualified |
4194304 bit |
e0 |
.00013 Amp |
70 ns |
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Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
80 mA |
5 |
5 |
SMALL OUTLINE |
SOP24,.5 |
Other Memory ICs |
1.27 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
.08 Amp |
21 ns |
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Renesas Electronics |
COMMERCIAL |
44 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
140 mA |
5 |
5 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
Other Memory ICs |
.8 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
e0 |
.14 Amp |
25 ns |
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Renesas Electronics |
VIDEO DRAM |
COMMERCIAL |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
120 mA |
131072 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ40,.44 |
Other Memory ICs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J40 |
Not Qualified |
1048576 bit |
e0 |
.01 Amp |
100 ns |
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Renesas Electronics |
MEMORY CIRCUIT |
COMMERCIAL |
77 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
HYBRID |
BALL |
45 mA |
FLASH+SRAM |
2.6/3 |
GRID ARRAY, FINE PITCH |
BGA77,8X14,32 |
Other Memory ICs |
.8 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B77 |
Not Qualified |
.00001 Amp |
100 ns |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.