COMMERCIAL Other Function Memory ICs 1,473

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	Technology	Terminal Form	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Standby Voltage	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Qualification	Memory Density	JESD-609 Code	Maximum Standby Current	Maximum Access Time
UPD485505GU-35	Renesas Electronics		COMMERCIAL	24	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	GULL WING	80 mA				5		5		SMALL OUTLINE	SOP24,.5	Other Memory ICs	1.27 mm	70 Cel					0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G24			Not Qualified		e0	.08 Amp	25 ns
79R3020-16G	Renesas Electronics		COMMERCIAL	68	PGA		SQUARE	CERAMIC	NO	CMOS	PIN/PEG	50 mA				5		5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel					0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR	S-XPGA-P68			Not Qualified		e0
UPD487000GC-30	Renesas Electronics		COMMERCIAL	100	QFP		SQUARE	PLASTIC/EPOXY	YES	CMOS	GULL WING					3.3		3.3		FLATPACK	QFP100,.63SQ,20	Other Memory ICs	.5 mm	70 Cel					0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100			Not Qualified		e0		35 ns
UPD42264C-10	Renesas Electronics	VIDEO DRAM	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	THROUGH-HOLE	125 mA	65536 words			5		5	4	IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	70 Cel		64KX4	64K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24			Not Qualified	262144 bit	e0	.005 Amp	100 ns
MC-4216LFF72FH-A50	Renesas Electronics		COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2404 mA	16777216 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		0 Cel		DUAL	R-PDMA-N168	31.75 mm		Not Qualified	1207959552 bit		.073 Amp	50 ns
MC-424000AB72F-80	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1684 mA	4194304 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		0 Cel		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	301989888 bit		.082 Amp	80 ns
UPD411A-EC	Renesas Electronics		COMMERCIAL	22	DIP	64	RECTANGULAR	CERAMIC	NO	MOS	THROUGH-HOLE		4096 words		SEPARATE				1	IN-LINE	DIP22,.4	Other Memory ICs	2.54 mm	70 Cel	3-STATE	4KX1	4K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T22			Not Qualified	4096 bit	e0		350 ns
MC-4216LFC72FB-A50	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2404 mA	16777216 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		0 Cel		DUAL	R-PDMA-N168	31.75 mm		Not Qualified	1207959552 bit		.073 Amp	50 ns
MC-458DA724F-A10	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1140 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		0 Cel		DUAL	R-PDMA-N168		100 MHz	Not Qualified	603979776 bit		.018 Amp	8.5 ns
UPD42273LE-12	Renesas Electronics	VIDEO DRAM	COMMERCIAL	28	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	J BEND	140 mA	262144 words			5		5	4	SMALL OUTLINE	SOJ28,.44	Other Memory ICs	1.27 mm	70 Cel		256KX4	256K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J28			Not Qualified	1048576 bit	e0	.004 Amp	120 ns
UPD42275LE-12	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	J BEND	95 mA	131072 words			5		5	8	SMALL OUTLINE	SOJ40,.44	Other Memory ICs	1.27 mm	70 Cel		128KX8	128K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J40			Not Qualified	1048576 bit	e0	.01 Amp	120 ns
79R3020-20G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA		SQUARE	CERAMIC	NO	CMOS	PIN/PEG	60 mA				5		5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel					0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68			Not Qualified		e0
UPD42505C-50	Renesas Electronics		COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	THROUGH-HOLE	60 mA				5		5		IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	70 Cel					-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24			Not Qualified		e0	.06 Amp	40 ns
MC-242444F9-B10-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	HYBRID	BALL	45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel					-20 Cel		BOTTOM	R-PBGA-B77			Not Qualified			.00001 Amp	100 ns
UPD482234V-80L	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	THROUGH-HOLE	200 mA	262144 words			5		5	8	IN-LINE	ZIP40,.1	Other Memory ICs	1.27 mm	70 Cel		256KX8	256K		0 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T40			Not Qualified	2097152 bit	e0	.0002 Amp	80 ns
MC-242444F9-B95-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	HYBRID	BALL	45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel					-20 Cel		BOTTOM	R-PBGA-B77			Not Qualified			.00001 Amp	90 ns
MC-422000FB72F-60	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1050 mA	2097152 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M		0 Cel		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	150994944 bit		.07 Amp	60 ns
MC-242442F9-B95-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	71	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	HYBRID	BALL	45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA71,8X12,32	Other Memory ICs	.8 mm	70 Cel					-20 Cel		BOTTOM	R-PBGA-B71			Not Qualified			.00001 Amp	90 ns
MC-242452F9-B95-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	HYBRID	BALL	45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel					-20 Cel		BOTTOM	R-PBGA-B77			Not Qualified			.00001 Amp	90 ns
79R3020-12G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA		SQUARE	CERAMIC	NO	CMOS	PIN/PEG					5		5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel					0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68			Not Qualified		e0
UPD411C-1	Renesas Electronics		COMMERCIAL	22	DIP	64	RECTANGULAR	PLASTIC/EPOXY	NO	MOS	THROUGH-HOLE		4096 words		SEPARATE				1	IN-LINE	DIP22,.4	Other Memory ICs	2.54 mm	70 Cel	3-STATE	4KX1	4K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T22			Not Qualified	4096 bit	e0		250 ns
UPD42832G-15	Renesas Electronics		COMMERCIAL	28	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	GULL WING	40 mA	32768 words		COMMON	5		5	8	SMALL OUTLINE	SOP28,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32KX8	32K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28			Not Qualified	262144 bit	e0	.001 Amp	150 ns
UPD482445G5-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	GULL WING	115 mA	262144 words			5		5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70			Not Qualified	4194304 bit	e0	.0002 Amp	80 ns
MC-458CA726PFB-A10	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1150 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		0 Cel		DUAL	R-PDMA-N168		100 MHz	Not Qualified	603979776 bit		.005 Amp	6 ns
UPD482444LG5-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	GULL WING	105 mA	262144 words			3.3		3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70			Not Qualified	4194304 bit	e0	.00013 Amp	80 ns
MC-242454F9-B10-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	HYBRID	BALL	45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel					-20 Cel		BOTTOM	R-PBGA-B77			Not Qualified			.00001 Amp	100 ns
MC-242453F9-B10-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	HYBRID	BALL	45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel					-20 Cel		BOTTOM	R-PBGA-B77			Not Qualified			.00001 Amp	100 ns
UPD41101C-1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	THROUGH-HOLE	90 mA						+-5,12		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel					-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24			Not Qualified		e0	.09 Amp	49 ns
MC-452AA725F-A10	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1170 mA	2097152 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M		0 Cel		DUAL	R-PDMA-N168	29.21 mm	100 MHz	Not Qualified	150994944 bit		.018 Amp	7 ns
MC-482235A32B-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	112	DIMM		RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	800 mA	262144 words			5		5	32	MICROELECTRONIC ASSEMBLY	DIMM112	Other Memory ICs	1.27 mm	70 Cel		256KX32	256K		0 Cel		DUAL	R-PDMA-N112			Not Qualified	8388608 bit		.008 Amp	80 ns
UPD411C	Renesas Electronics		COMMERCIAL	22	DIP	64	RECTANGULAR	PLASTIC/EPOXY	NO	MOS	THROUGH-HOLE		4096 words		SEPARATE				1	IN-LINE	DIP22,.4	Other Memory ICs	2.54 mm	70 Cel	3-STATE	4KX1	4K		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T22			Not Qualified	4096 bit	e0		300 ns
MC-424LFC72FW-A60	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	700 mA	4194304 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		0 Cel		DUAL	R-PDMA-N168			Not Qualified	301989888 bit		.05 Amp	60 ns
LR3220GC-25	Broadcom	MEMORY CIRCUIT	COMMERCIAL	180	PGA		SQUARE	CERAMIC	NO	CMOS	PIN/PEG	160 mA				5		5		GRID ARRAY	PGA180M,15X15	Other Memory ICs	2.54 mm	70 Cel					0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P180			Not Qualified		e0
LR3220QC-25	Broadcom	MEMORY CIRCUIT	COMMERCIAL	184	QFP		SQUARE	PLASTIC/EPOXY	YES	CMOS	GULL WING	160 mA				5		5		FLATPACK	QFP184,1.26SQ,20	Other Memory ICs	.5 mm	70 Cel					0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G184			Not Qualified		e0
LR3220QC-33	Broadcom		COMMERCIAL	184	QFP		SQUARE	PLASTIC/EPOXY	YES	CMOS	GULL WING	170 mA				5		5		FLATPACK	QFP184,1.26SQ,20	Other Memory ICs	.5 mm	70 Cel					0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G184			Not Qualified		e0
KMM372V3280AS2-5	Samsung		COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		0 Cel		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit		.03 Amp	50 ns
KMM372V3280AS3-7	Samsung		COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		0 Cel		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit		.03 Amp	70 ns
KMM372F3200AS2-5	Samsung		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		0 Cel		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit		.03 Amp	50 ns
KMM372F3200AK3-6	Samsung		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2620 mA	33554432 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		0 Cel		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit		.03 Amp	60 ns
M374S1603AT0-C100	Samsung		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1485 mA	16777216 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		0 Cel		DUAL	R-PDMA-N168		100 MHz	Not Qualified	1207959552 bit		.036 Amp	7 ns
M372E0883BT0-C6	Samsung		COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	810 mA	8388608 words		COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		0 Cel		DUAL	R-PDMA-N168			Not Qualified	603979776 bit		.03 Amp	60 ns
KMM372F124BJ7	Samsung		COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	670 mA	1048576 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M		0 Cel		DUAL	R-PDMA-N168			Not Qualified	75497472 bit		.03 Amp	70 ns
M372V0803CJT-C60	Samsung		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	900 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		0 Cel		DUAL	R-PDMA-N168	31.75 mm		Not Qualified	603979776 bit		.03 Amp	60 ns
M372F0410CW0-50	Samsung		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1980 mA	4194304 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		0 Cel		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	301989888 bit		.03 Amp	50 ns
M312L6523CZ0-LCC	Samsung		COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	4220 mA	67108864 words		COMMON	2.6		2.6	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	64MX72	64M		0 Cel		DUAL	R-PDMA-N184		200 MHz	Not Qualified	4831838208 bit		.42 Amp	.65 ns
KMM374S203BTN-G8	Samsung		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1620 mA	2097152 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	65 Cel	3-STATE	2MX72	2M	3 V	0 Cel		DUAL	R-PDMA-N168		125 MHz	Not Qualified	150994944 bit		.0045 Amp	6 ns
KM658128ASG-8	Samsung		COMMERCIAL	32	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	GULL WING	70 mA	131072 words		COMMON	5		5	8	SMALL OUTLINE	SOP32,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32			Not Qualified	1048576 bit	e0	.001 Amp	80 ns
KMM374S400BTN-G8	Samsung		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	3060 mA	4194304 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		0 Cel		DUAL	R-PDMA-N168		125 MHz	Not Qualified	301989888 bit		.009 Amp	6 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.