Renesas Electronics Other Function Memory ICs 824

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
MC424512A36F70	Renesas Electronics
MC-428LFF72FH-A50	Renesas Electronics		COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1225 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M	0 Cel		DUAL	R-PDMA-N168						Not Qualified	603979776 bit					.05 Amp		50 ns
MC-24212361F9-E95X-CD5	Renesas Electronics	MEMORY CIRCUIT	OTHER	85	LFBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS		4194304 words						16	GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		4MX16	4M	-25 Cel		BOTTOM	R-PBGA-B85		1.95 V	1.21 mm		8 mm	Not Qualified	67108864 bit	1.65 V	SRAM ORGANISATION IS 1M X 16; SRAM SUPPLY VOLTAGE IS 2.6 TO 3.1V				11 mm
M10042040054X0PWAY	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		524288 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	105 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm		5 mm		4194304 bit	1.71 V		e3	260		6 mm
M10162040108X0PSAY	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		2097152 words			1.8			8	SMALL OUTLINE	SOP8,.3		1.27 mm	105 Cel		2MX8	2M	-40 Cel	TIN	DUAL	R-PDSO-G8	3	2 V	2.16 mm		5.18 mm		16777216 bit	1.71 V		e3	260		5.23 mm
UPD4616112F9-B85LX-BC2	Renesas Electronics		OTHER	48	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	BALL		35 mA	1048576 words		COMMON			2.7/3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,30	Other Memory ICs	.75 mm	85 Cel	3-STATE	1MX16	1M	-25 Cel		BOTTOM	R-PBGA-B48						Not Qualified	16777216 bit					.00001 Amp		85 ns
MC-242454F9-B90-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77						Not Qualified						.00001 Amp		80 ns
MC-428LFF72FB-A50	Renesas Electronics		COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1225 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M	0 Cel		DUAL	R-PDMA-N168						Not Qualified	603979776 bit					.05 Amp		50 ns
CDP1831CH	Renesas Electronics
UPD482444GW-70	Renesas Electronics	VIDEO DRAM	COMMERCIAL	64	SSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		135 mA	262144 words			5		5	16	SMALL OUTLINE, SHRINK PITCH	SOP64,.54,32	Other Memory ICs	.8 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G64						Not Qualified	4194304 bit			e0		.0002 Amp		70 ns
UPD42275LE-80	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND		140 mA	131072 words			5		5	8	SMALL OUTLINE	SOJ40,.44	Other Memory ICs	1.27 mm	70 Cel		128KX8	128K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J40						Not Qualified	1048576 bit			e0		.01 Amp		80 ns
UPD4217102G5-10	Renesas Electronics
UPD4632312-BX	Renesas Electronics
MC-22007F1-DB1-B10	Renesas Electronics	MEMORY CIRCUIT	OTHER	48	BGA			PLASTIC/EPOXY	YES		HYBRID	BALL		75 mA					FLASH+SRAM	3/3.3		GRID ARRAY	BGA48(UNSPEC)	Other Memory ICs		85 Cel				-20 Cel	Tin/Lead (Sn/Pb)	BOTTOM							Not Qualified				e0		.00002 Amp		100 ns
MC-422000LFB72F-60	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		910 mA	2097152 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	150994944 bit					.041 Amp		60 ns
UPD42102C-5	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		80 mA				5		5		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24						Not Qualified				e0		.08 Amp		18 ns
UPD4168C-25	Renesas Electronics		COMMERCIAL	28	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE		55 mA	8192 words		COMMON	5		5	8	IN-LINE	DIP28,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	8KX8	8K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28						Not Qualified	65536 bit			e0				250 ns
UPD482235G5-80L	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		200 mA	262144 words			5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP40/44,.46,32	Other Memory ICs	.8 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40						Not Qualified	2097152 bit			e0		.0002 Amp		80 ns
UPD4516421G5A12L	Renesas Electronics
MC-422000AB72F-70	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		964 mA	2097152 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	150994944 bit					.073 Amp		70 ns
MC-242443F9-B90-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	71	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA71,8X12,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B71						Not Qualified						.00001 Amp		80 ns
UPD485506G5-27	Renesas Electronics		COMMERCIAL	44	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		140 mA				5		5		SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	Other Memory ICs	.8 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G44						Not Qualified				e0		.14 Amp		18 ns
HM71V832FP-15	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	28	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		32768 words			3			8	SMALL OUTLINE			1.27 mm	70 Cel		32KX8	32K	0 Cel		DUAL	R-PDSO-G28		3.6 V	3 mm		8.4 mm	Not Qualified	262144 bit	2.7 V	10 YEAR DATA RETENTION				18.3 mm
UPD2364-35PC	Renesas Electronics
UPD461018LLE12	Renesas Electronics
MC-242453F9-B10-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77						Not Qualified						.00001 Amp		100 ns
MC-242454F9-B95-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77						Not Qualified						.00001 Amp		90 ns
HM530281RTT-20	Renesas Electronics		COMMERCIAL	44	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		135 mA				5		5		SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	Other Memory ICs	.8 mm	70 Cel				0 Cel		DUAL	R-PDSO-G44						Not Qualified						.025 Amp		18 ns
UPD424400GS70L	Renesas Electronics
UPD42832C-10	Renesas Electronics		COMMERCIAL	28	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		60 mA	32768 words		COMMON	5		5	8	IN-LINE	DIP28,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28						Not Qualified	262144 bit			e0		.001 Amp		100 ns
HD74HC670FP-ER	Renesas Electronics	MEMORY CIRCUIT	INDUSTRIAL	16	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		4 words			4.5			4	SMALL OUTLINE			1.27 mm	85 Cel		4X4	4	-40 Cel		DUAL	R-PDSO-G16		6 V	2.2 mm		5.5 mm	Not Qualified	16 bit	2 V					10.06 mm
MC424000AA40FH70	Renesas Electronics
UPD4216102LE80	Renesas Electronics
UPD4565323G5A10B9JH	Renesas Electronics
MC-454AA725F-A10	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2160 mA	4194304 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168				100 MHz		Not Qualified	301989888 bit					.036 Amp		7 ns
MC-458CA726F-A10	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1215 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M	0 Cel		DUAL	R-PDMA-N168				100 MHz		Not Qualified	603979776 bit					.0045 Amp		6 ns
M30042040108X0IWAY	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		524288 words			3			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	85 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-N8	3	3.6 V	.8 mm		5 mm		4194304 bit	2.7 V		e3	260		6 mm
UPD4516921G5A11L	Renesas Electronics
UPD4632312-BEX	Renesas Electronics
M10042040108X0PSAY	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		524288 words			1.8			8	SMALL OUTLINE	SOP8,.3		1.27 mm	105 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-G8	3	2 V	2.16 mm		5.18 mm		4194304 bit	1.71 V		e3	260		5.23 mm
UPD4217102G5M60	Renesas Electronics
UPD482444LGW-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	64	SSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		105 mA	262144 words			3.3		3.3	16	SMALL OUTLINE, SHRINK PITCH	SOP64,.54,32	Other Memory ICs	.8 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G64						Not Qualified	4194304 bit			e0		.00013 Amp		80 ns
IDT79R3020-12G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA		SQUARE	CERAMIC	NO		CMOS	PIN/PEG						5		5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel				0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68						Not Qualified				e0
UPD424100GS70L	Renesas Electronics
UPD42832GU-12L	Renesas Electronics		COMMERCIAL	28	SOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		50 mA	32768 words		COMMON	5		5	8	SMALL OUTLINE	SOP28,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28						Not Qualified	262144 bit			e0		.0001 Amp		120 ns
UPD4516161G5A11L	Renesas Electronics
CD40208BEX98	Renesas Electronics		INDUSTRIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE										IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24										e0
M66307FP	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	110 mA	320 words			5		5	16	SMALL OUTLINE	SOP32,.5	Other Memory ICs	1.27 mm	70 Cel		320X16	320	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32		5.5 V	2.4 mm		8.4 mm	Not Qualified	5120 bit	4.5 V		e0			20 mm	120 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.