Renesas Electronics Other Function Memory ICs 824

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MC-222242AF9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

M66305AP

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SYNCHRONOUS

5120 words

5

1

IN-LINE

2.54 mm

70 Cel

5KX1

5K

-10 Cel

DUAL

R-PDIP-T20

5.5 V

4.5 mm

7.62 mm

Not Qualified

5120 bit

4.5 V

24 mm

MC-242443F9-B10-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

100 ns

UPD4217902L

Renesas Electronics

MC-428LFF72FH-A60

Renesas Electronics

COMMERCIAL

168

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1045 mA

8388608 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

8MX72

8M

0 Cel

DUAL

R-PDMA-N168

Not Qualified

603979776 bit

.05 Amp

60 ns

UPD4216102LE10

Renesas Electronics

79R3020-16J

Renesas Electronics

COMMERCIAL

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

J BEND

50 mA

5

5

CHIP CARRIER

LDCC68,1.0SQ

Other Memory ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J68

1

Not Qualified

e0

20

225

MC-482235A32F-70

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

112

DIMM

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

820 mA

262144 words

5

5

32

MICROELECTRONIC ASSEMBLY

DIMM112

Other Memory ICs

1.27 mm

70 Cel

256KX32

256K

0 Cel

DUAL

R-PDMA-N112

Not Qualified

8388608 bit

.008 Amp

70 ns

UPD42116420

Renesas Electronics

UPD482445LG5M-70

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

70

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

125 mA

262144 words

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP70,.46

Other Memory ICs

.635 mm

70 Cel

256KX16

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G70

Not Qualified

4194304 bit

e0

.00013 Amp

70 ns

UPD42274LE-12

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

28

SOJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

140 mA

262144 words

5

5

4

SMALL OUTLINE

SOJ28,.44

Other Memory ICs

1.27 mm

70 Cel

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J28

Not Qualified

1048576 bit

e0

.004 Amp

120 ns

UPD411C-2

Renesas Electronics

COMMERCIAL

22

DIP

64

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

4096 words

SEPARATE

1

IN-LINE

DIP22,.4

Other Memory ICs

2.54 mm

70 Cel

3-STATE

4KX1

4K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T22

Not Qualified

4096 bit

e0

200 ns

M30042040054X0ISAR

Renesas Electronics

MEMORY CIRCUIT

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

524288 words

3

8

SMALL OUTLINE

SOP8,.3

1.27 mm

85 Cel

512KX8

512K

-40 Cel

TIN

DUAL

R-PDSO-G8

3

3.6 V

2.16 mm

5.18 mm

4194304 bit

2.7 V

e3

260

5.23 mm

AMB0480XXBJG8

Renesas Electronics

MEMORY CIRCUIT

UPD4516181G5A10L

Renesas Electronics

72055

Renesas Electronics

MWS5101E

Renesas Electronics

UPD23C16040AGZ

Renesas Electronics

UPD42102G-5

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

80 mA

5

5

SMALL OUTLINE

SOP24,.5

Other Memory ICs

1.27 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

.08 Amp

18 ns

UPD4216102G5M10

Renesas Electronics

UPD4516161G5A13L

Renesas Electronics

UPD46128512F9-E9X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

60 mA

8388608 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

8MX16

8M

-30 Cel

BOTTOM

R-PBGA-B93

Not Qualified

134217728 bit

.00025 Amp

70 ns

UPD488385FB-C60-45BF1

Renesas Electronics

MC-42512AA40F-70

Renesas Electronics

COMMERCIAL

72

SIMM

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

960 mA

524288 words

COMMON

5

5

40

MICROELECTRONIC ASSEMBLY

SSIM72

Other Memory ICs

1.27 mm

70 Cel

3-STATE

512KX40

512K

0 Cel

SINGLE

R-PSMA-N72

25.4 mm

Not Qualified

20971520 bit

.02 Amp

70 ns

UPD4516161G5A12L

Renesas Electronics

UPD42505V-75H

Renesas Electronics

COMMERCIAL

28

ZIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

60 mA

5

5

IN-LINE

ZIP28,.1

Other Memory ICs

1.27 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T28

Not Qualified

e0

.06 Amp

55 ns

CD54ACT7201E

Renesas Electronics

UPD4516921G5A12L

Renesas Electronics

UPD4632312F9-C95X-BT3

Renesas Electronics

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

2097152 words

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

33554432 bit

.0001 Amp

95 ns

UPD41264C-12

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

65536 words

5

5

4

IN-LINE

DIP24,.4

Other Memory ICs

2.54 mm

70 Cel

64KX4

64K

0 Cel

TIN LEAD

DUAL

R-PDIP-T24

Not Qualified

262144 bit

e0

120 ns

61592

Renesas Electronics

UPD482444GW-60

Renesas Electronics

VIDEO DRAM

COMMERCIAL

64

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

155 mA

262144 words

5

5

16

SMALL OUTLINE, SHRINK PITCH

SOP64,.54,32

Other Memory ICs

.8 mm

70 Cel

256KX16

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G64

Not Qualified

4194304 bit

e0

.0002 Amp

60 ns

UPD41101G-3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

90 mA

+-5,12

SMALL OUTLINE

SOP24,.5

Other Memory ICs

1.27 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

.09 Amp

27 ns

M10042040108X0IWAY

Renesas Electronics

MEMORY CIRCUIT

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

1.27 mm

85 Cel

512KX8

512K

-40 Cel

TIN

DUAL

R-PDSO-N8

3

2 V

.8 mm

5 mm

4194304 bit

1.71 V

e3

260

6 mm

M66305AFP

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

5120 words

5

1

SMALL OUTLINE

1.27 mm

70 Cel

5KX1

5K

-10 Cel

DUAL

R-PDSO-G24

5.5 V

2.4 mm

8.4 mm

Not Qualified

5120 bit

4.5 V

15 mm

UPD42280V-60

Renesas Electronics

COMMERCIAL

28

ZIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

90 mA

5

5

IN-LINE

ZIP28,.1

Other Memory ICs

1.27 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

ZIG-ZAG

R-PZIP-T28

Not Qualified

e0

40 ns

M30162040054X0PWAY

Renesas Electronics

MEMORY CIRCUIT

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

2097152 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

1.27 mm

105 Cel

2MX8

2M

-40 Cel

TIN

DUAL

R-PDSO-N8

3

3.6 V

.8 mm

5 mm

16777216 bit

2.7 V

e3

260

6 mm

UPD482235LE-70

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

40

SOJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

205 mA

262144 words

5

5

8

SMALL OUTLINE

SOJ40,.44

Other Memory ICs

1.27 mm

70 Cel

256KX8

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J40

Not Qualified

2097152 bit

e0

.001 Amp

70 ns

MC424000A8AA60

Renesas Electronics

UPD4216805LE80

Renesas Electronics

M10082040108X0PWAR

Renesas Electronics

MEMORY CIRCUIT

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

1048576 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

1.27 mm

105 Cel

1MX8

1M

-40 Cel

TIN

DUAL

R-PDSO-N8

3

2 V

.8 mm

5 mm

8388608 bit

1.71 V

e3

260

6 mm

X5325S8Z-2.7A-T1

Renesas Electronics

Matte Tin (Sn) - annealed

1

e3

30

260

UPD482445G5M-80

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

70

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

115 mA

262144 words

5

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP70,.46

Other Memory ICs

.635 mm

70 Cel

256KX16

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G70

Not Qualified

4194304 bit

e0

.0002 Amp

80 ns

MC-4216LFF72FH-A60

Renesas Electronics

COMMERCIAL

168

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

2044 mA

16777216 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

R-PDMA-N168

31.75 mm

Not Qualified

1207959552 bit

.073 Amp

60 ns

M30082040054X0PWAY

Renesas Electronics

MEMORY CIRCUIT

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

1048576 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

1.27 mm

105 Cel

1MX8

1M

-40 Cel

TIN

DUAL

R-PDSO-N8

3

3.6 V

.8 mm

5 mm

8388608 bit

2.7 V

e3

260

6 mm

M30162040054X0PSAY

Renesas Electronics

MEMORY CIRCUIT

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

2097152 words

3

8

SMALL OUTLINE

SOP8,.3

1.27 mm

105 Cel

2MX8

2M

-40 Cel

TIN

DUAL

R-PDSO-G8

3

3.6 V

2.16 mm

5.18 mm

16777216 bit

2.7 V

e3

260

5.23 mm

UPD41416C12

Renesas Electronics

UPD482234G5M-70

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

40

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

205 mA

262144 words

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

Other Memory ICs

.8 mm

70 Cel

256KX8

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G40

Not Qualified

2097152 bit

e0

.001 Amp

70 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.