Renesas Electronics Other Function Memory ICs 824

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
MC-424000AC72F-60	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1684 mA	4194304 words		COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	301989888 bit					.082 Amp		60 ns
MC-452AA725F-A80	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1440 mA	2097152 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			29.21 mm	125 MHz		Not Qualified	150994944 bit					.018 Amp		6 ns
UPD487000GC-40	Renesas Electronics		COMMERCIAL	100	QFP		SQUARE	PLASTIC/EPOXY	YES		CMOS	GULL WING						3.3		3.3		FLATPACK	QFP100,.63SQ,20	Other Memory ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100						Not Qualified				e0				45 ns
UPD4216102LE60	Renesas Electronics
MC-22005F1-DB1-B10	Renesas Electronics	MEMORY CIRCUIT	OTHER	48	BGA			PLASTIC/EPOXY	YES		HYBRID	BALL		75 mA					FLASH+SRAM	3/3.3		GRID ARRAY	BGA48(UNSPEC)	Other Memory ICs		85 Cel				-20 Cel	Tin/Lead (Sn/Pb)	BOTTOM							Not Qualified				e0		.00002 Amp		100 ns
M66307SP	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	SDIP		RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SYNCHRONOUS	110 mA	320 words			5		5	16	IN-LINE, SHRINK PITCH	SDIP32,.4	Other Memory ICs	1.778 mm	70 Cel		320X16	320	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32		5.5 V	5.08 mm		10.16 mm	Not Qualified	5120 bit	4.5 V		e0			28 mm	120 ns
MC-424000AB72F-70	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1864 mA	4194304 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	301989888 bit					.082 Amp		70 ns
UPD482444G5M-60	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		155 mA	262144 words			5		5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70						Not Qualified	4194304 bit			e0		.0002 Amp		60 ns
M30082040054X0ISAR	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		1048576 words			3			8	SMALL OUTLINE	SOP8,.3		1.27 mm	85 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-G8	3	3.6 V	2.16 mm		5.18 mm		8388608 bit	2.7 V		e3	260		5.23 mm
MC-458CA726LFA-A10	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1215 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M	0 Cel		DUAL	R-PDMA-N168				100 MHz		Not Qualified	603979776 bit					.0045 Amp		6 ns
UPD482445GW-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	64	SSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		115 mA	262144 words			5		5	16	SMALL OUTLINE, SHRINK PITCH	SOP64,.54,32	Other Memory ICs	.8 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G64						Not Qualified	4194304 bit			e0		.0002 Amp		80 ns
UPD442000LF1BS1C10X	Renesas Electronics
UPD4217102LE10	Renesas Electronics
M30042040108X0PWAY	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		524288 words			3			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	105 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-N8	3	3.6 V	.8 mm		5 mm		4194304 bit	2.7 V		e3	260		6 mm
M10162040054X0ISAY	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		2097152 words			1.8			8	SMALL OUTLINE	SOP8,.3		1.27 mm	85 Cel		2MX8	2M	-40 Cel	TIN	DUAL	R-PDSO-G8	3	2 V	2.16 mm		5.18 mm		16777216 bit	1.71 V		e3	260		5.23 mm
UPD411D-4	Renesas Electronics		COMMERCIAL	22	DIP	64	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			4096 words		SEPARATE				1	IN-LINE	DIP22,.4	Other Memory ICs	2.54 mm	70 Cel	3-STATE	4KX1	4K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T22						Not Qualified	4096 bit			e0				135 ns
MC-242443F9-B90-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77						Not Qualified						.00001 Amp		90 ns
MC-22212361F9-D80X-CD5	Renesas Electronics	MEMORY CIRCUIT	OTHER	85	LFBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS		4194304 words						16	GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		4MX16	4M	-25 Cel		BOTTOM	R-PBGA-B85		2.1 V	1.21 mm		8 mm	Not Qualified	67108864 bit	1.8 V	SRAM ORGANISATION IS 256K X 16; SRAM SUPPLY VOLTAGE IS 2.7 TO 3.1V				11 mm
UPD42832C-12	Renesas Electronics		COMMERCIAL	28	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		50 mA	32768 words		COMMON	5		5	8	IN-LINE	DIP28,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28						Not Qualified	262144 bit			e0		.0005 Amp		120 ns
UPD424800LG5M-A70	Renesas Electronics
M30082040108X0ISAR	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		1048576 words			3			8	SMALL OUTLINE	SOP8,.3		1.27 mm	85 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-G8	3	3.6 V	2.16 mm		5.18 mm		8388608 bit	2.7 V		e3	260		5.23 mm
MC-421000AD72F-80	Renesas Electronics		COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		800 mA	1048576 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	75497472 bit					.066 Amp		80 ns
UPD26401GU-XXX-9KH	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		7.5 mA					ROM+SRAM	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.56,20	Other Memory ICs	.5 mm	70 Cel				-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32						Not Qualified				e0		.00001 Amp
UPD461008LE12	Renesas Electronics
M30042040054X0PSAY	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		524288 words			3			8	SMALL OUTLINE	SOP8,.3		1.27 mm	105 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-G8	3	3.6 V	2.16 mm		5.18 mm		4194304 bit	2.7 V		e3	260		5.23 mm
MC-424LFC72FY-A50	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		850 mA	4194304 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168						Not Qualified	301989888 bit					.05 Amp		50 ns
UPD4217102LE60	Renesas Electronics
UPD424800LG5A70	Renesas Electronics
UPD482445G5-70	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		135 mA	262144 words			5		5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70						Not Qualified	4194304 bit			e0		.0002 Amp		70 ns
MC4582DA727LF-A75	Renesas Electronics
MC-428LFC72FH-A50	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1279 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M	0 Cel		DUAL	R-PDMA-N168						Not Qualified	603979776 bit					.0685 Amp		50 ns
MC-454AC725F-A10	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1422 mA	4194304 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168			29.21 mm	100 MHz		Not Qualified	301989888 bit					.036 Amp		7 ns
UPD23C16040ALGY-MKH	Renesas Electronics
CD4021AH	Renesas Electronics
MC-424000LAB72F-A70	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1630 mA	4194304 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	301989888 bit					.05 Amp		70 ns
AMB0480XXRJ	Renesas Electronics	MEMORY CIRCUIT
AMB0480XXHJG8	Renesas Electronics	MEMORY CIRCUIT
UPD42258G15	Renesas Electronics
MC-424000LFC72F-A60	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1450 mA	4194304 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168						Not Qualified	301989888 bit					.05 Amp		60 ns
UPD411D-1	Renesas Electronics		COMMERCIAL	22	DIP	64	RECTANGULAR	CERAMIC	NO		MOS	THROUGH-HOLE			4096 words		SEPARATE				1	IN-LINE	DIP22,.4	Other Memory ICs	2.54 mm	70 Cel	3-STATE	4KX1	4K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T22						Not Qualified	4096 bit			e0				250 ns
UPD4217102V60	Renesas Electronics
AMB0480XXRH	Renesas Electronics	MEMORY CIRCUIT
MC4516CB64S-A10BL	Renesas Electronics
MC-242452F9-B10-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	71	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA71,8X12,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B71						Not Qualified						.00001 Amp		100 ns
MC-22102F1-DE1-B10	Renesas Electronics	MEMORY CIRCUIT	OTHER	48	BGA			PLASTIC/EPOXY	YES		HYBRID	BALL		75 mA					FLASH+SRAM	3/3.3		GRID ARRAY	BGA48(UNSPEC)	Other Memory ICs		85 Cel				-20 Cel	Tin/Lead (Sn/Pb)	BOTTOM							Not Qualified				e0		.000002 Amp		100 ns
6177	Renesas Electronics
UPD42273V-10	Renesas Electronics	VIDEO DRAM	COMMERCIAL	28	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		160 mA	262144 words			5		5	4	IN-LINE	ZIP28,.1	Other Memory ICs	1.27 mm	70 Cel		256KX4	256K	0 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T28						Not Qualified	1048576 bit			e0		.004 Amp		100 ns
UPD42274LE-10	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	28	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND		160 mA	262144 words			5		5	4	SMALL OUTLINE	SOJ28,.44	Other Memory ICs	1.27 mm	70 Cel		256KX4	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J28						Not Qualified	1048576 bit			e0		.004 Amp		100 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.