Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDIP-T28 |
3.6 V |
15.24 mm |
Not Qualified |
262144 bit |
2.7 V |
36.83 mm |
80 ns |
|||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
24 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
Not Qualified |
262144 bit |
e0 |
.00001 Amp |
250 ns |
12.5 |
|||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
1048576 words |
COMMON |
3/3.3 |
8 |
IN-LINE |
DIP42,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T42 |
Not Qualified |
8388608 bit |
e0 |
.000015 Amp |
120 ns |
|||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP42,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T42 |
Not Qualified |
16777216 bit |
e0 |
.00002 Amp |
110 ns |
||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
8388608 bit |
3 V |
41.91 mm |
180 ns |
||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
IN-LINE |
2.54 mm |
70 Cel |
256KX16 |
256K |
-20 Cel |
DUAL |
R-PDIP-T40 |
3.63 V |
15.24 mm |
Not Qualified |
4194304 bit |
2.97 V |
52.18 mm |
120 ns |
|||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
15 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
8388608 bit |
e0 |
.00002 Amp |
180 ns |
||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP42,.6 |
8 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T42 |
3.465 V |
5.08 mm |
15.24 mm |
Not Qualified |
16777216 bit |
3.135 V |
e3 |
.00006 Amp |
52.455 mm |
120 ns |
|||||||||||||||
STMicroelectronics |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
65536 bit |
e0 |
300 ns |
12.5 |
|||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.25 V |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
e0 |
.0002 Amp |
36.83 mm |
150 ns |
||||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
16 |
IN-LINE |
2.54 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
DUAL |
R-PDIP-T40 |
3.6 V |
15.24 mm |
Not Qualified |
2097152 bit |
2.7 V |
52.18 mm |
100 ns |
|||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
8 |
IN-LINE |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDIP-T32 |
3.6 V |
15.24 mm |
2097152 bit |
2.7 V |
42.035 mm |
100 ns |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
41.91 mm |
100 ns |
|||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
105 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
65536 bit |
e0 |
200 ns |
12.5 |
|||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
.00002 Amp |
41.91 mm |
90 ns |
|||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
.00002 Amp |
41.91 mm |
90 ns |
|||||||||||||||||
STMicroelectronics |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
262144 bit |
e0 |
250 ns |
12.5 |
||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP40,.6 |
8 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T40 |
3.6 V |
15.24 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.00002 Amp |
52.18 mm |
100 ns |
|||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
10 mA |
65536 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
524288 bit |
3 V |
e0 |
.00001 Amp |
37.085 mm |
150 ns |
|||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
8 |
IN-LINE |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDIP-T28 |
3.6 V |
Not Qualified |
262144 bit |
3 V |
100 ns |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP42,.6 |
8 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T42 |
3.63 V |
5.08 mm |
15.24 mm |
Not Qualified |
16777216 bit |
2.97 V |
e3 |
.00006 Amp |
52.455 mm |
150 ns |
|||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T40 |
3.63 V |
15.24 mm |
Not Qualified |
4194304 bit |
2.97 V |
e0 |
.00002 Amp |
52.18 mm |
200 ns |
||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
524288 words |
COMMON |
3 |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3 |
.000015 Amp |
41.91 mm |
120 ns |
||||||||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP42,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T42 |
3.63 V |
5.08 mm |
15.24 mm |
Not Qualified |
33554432 bit |
2.97 V |
e3 |
.00006 Amp |
52.455 mm |
150 ns |
||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
10 mA |
32768 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
262144 bit |
3 V |
e0 |
.00001 Amp |
37.085 mm |
120 ns |
12.75 |
||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
131072 words |
COMMON |
3.3 |
3/3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX16 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T40 |
3.6 V |
15.24 mm |
Not Qualified |
2097152 bit |
2.7 V |
e3 |
.000015 Amp |
52.18 mm |
100 ns |
|||||||||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
262144 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
2097152 bit |
3 V |
e3 |
.00002 Amp |
41.91 mm |
150 ns |
||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
8 |
IN-LINE |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDIP-T32 |
3.6 V |
15.24 mm |
2097152 bit |
2.7 V |
42.035 mm |
100 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL EXTENDED |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
IN-LINE |
2.54 mm |
85 Cel |
256KX16 |
256K |
-20 Cel |
DUAL |
R-PDIP-T40 |
3.63 V |
15.24 mm |
Not Qualified |
4194304 bit |
2.97 V |
52.18 mm |
200 ns |
|||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
41.91 mm |
100 ns |
|||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
4194304 bit |
3 V |
41.91 mm |
150 ns |
||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
COMMON |
3 |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
.000015 Amp |
41.91 mm |
80 ns |
||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
65536 words |
COMMON |
3 |
3/3.3 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
524288 bit |
2.7 V |
ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V |
e3 |
.000015 Amp |
36.83 mm |
80 ns |
|||||||||||||||
STMicroelectronics |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
35.8 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
262144 bit |
e0 |
.00001 Amp |
170 ns |
12.5 |
|||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
3.3 |
16 |
IN-LINE |
70 Cel |
64KX16 |
64K |
0 Cel |
DUAL |
R-PDIP-T28 |
3.6 V |
Not Qualified |
1048576 bit |
3 V |
120 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
131072 bit |
e0 |
150 ns |
12.5 |
|||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T40 |
3.63 V |
15.24 mm |
Not Qualified |
1048576 bit |
2.97 V |
e0 |
.00002 Amp |
52.18 mm |
90 ns |
||||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T40 |
3.63 V |
15.24 mm |
Not Qualified |
1048576 bit |
2.97 V |
e0 |
.00002 Amp |
52.18 mm |
100 ns |
||||||||||||||||||
STMicroelectronics |
OTP ROM |
OTHER |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T40 |
3.63 V |
15.24 mm |
Not Qualified |
4194304 bit |
2.97 V |
e0 |
.00002 Amp |
52.18 mm |
150 ns |
||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
DIP42,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T42 |
3.63 V |
5.08 mm |
15.24 mm |
Not Qualified |
33554432 bit |
2.97 V |
e3 |
.00006 Amp |
52.455 mm |
120 ns |
||||||||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
262144 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
2097152 bit |
3 V |
e3 |
.00002 Amp |
41.91 mm |
200 ns |
||||||||||||||||
STMicroelectronics |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T24 |
Not Qualified |
32768 bit |
e0 |
450 ns |
||||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
262144 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
2097152 bit |
3 V |
e3 |
.00002 Amp |
41.91 mm |
120 ns |
||||||||||||||||
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDIP-T28 |
3.6 V |
15.24 mm |
Not Qualified |
262144 bit |
2.7 V |
36.83 mm |
80 ns |
|||||||||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
262144 words |
COMMON |
3 |
3/3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T40 |
3.6 V |
15.24 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3 |
.000015 Amp |
52.18 mm |
120 ns |
|||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
262144 words |
COMMON |
3 |
3/3.3 |
16 |
IN-LINE |
DIP40,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
TIN |
DUAL |
R-PDIP-T40 |
3.6 V |
15.24 mm |
Not Qualified |
4194304 bit |
2.7 V |
ACCESS TIME 80 NANO SECS AT VCC 3V TO 3.6V |
e3 |
245 |
.000015 Amp |
52.18 mm |
100 ns |
|||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
.00002 Amp |
41.91 mm |
200 ns |
|||||||||||||||||
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
3 V |
41.91 mm |
150 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.