Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
IN-LINE |
125 Cel |
256X8 |
256 |
-55 Cel |
DUAL |
R-PDIP-T22 |
5.25 V |
Not Qualified |
2048 bit |
4.75 V |
||||||||||||||||||||||||||||||
NXP Semiconductors |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
IN-LINE |
125 Cel |
256X8 |
256 |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T22 |
5.25 V |
Not Qualified |
2048 bit |
4.75 V |
e0 |
||||||||||||||||||||||||||||
NXP Semiconductors |
STANDARD SRAM |
MILITARY |
22 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
8 |
IN-LINE |
125 Cel |
256X8 |
256 |
-55 Cel |
DUAL |
R-CDIP-T22 |
5.25 V |
2048 bit |
4.75 V |
|||||||||||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
60 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
65536 bit |
e0 |
.001 Amp |
45 ns |
||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
NO |
.001 Amp |
27.2 mm |
25 ns |
||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
45 ns |
|||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
NO |
.00005 Amp |
27.2 mm |
70 ns |
|||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
55 ns |
|||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
35 ns |
|||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T22 |
5.5 V |
4.15 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
AUTOMATIC STANDBY MODE |
e0 |
55 ns |
||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.75 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
65536 bit |
e0 |
.001 Amp |
20 ns |
||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
OTHER |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
256 words |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
256X4 |
256 |
-30 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
1024 bit |
e0 |
.00001 Amp |
650 ns |
|||||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
NO |
.002 Amp |
27.2 mm |
45 ns |
|||||||||||||
Toshiba |
STANDARD SRAM |
OTHER |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
256 words |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
256X4 |
256 |
-30 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
1024 bit |
e0 |
.00001 Amp |
450 ns |
|||||||||||||||||||||||||||
Toshiba |
OTHER |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
4 |
IN-LINE |
2.54 mm |
85 Cel |
256X4 |
256 |
-30 Cel |
TIN LEAD |
DUAL |
R-PDIP-T22 |
5.5 V |
4.5 mm |
10.16 mm |
1024 bit |
4.5 V |
SEATED HGT CALCULATED |
e0 |
27.6 mm |
650 ns |
|||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
NO |
.00005 Amp |
27.2 mm |
55 ns |
|||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
65536 bit |
e0 |
.001 Amp |
35 ns |
||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
NO |
.001 Amp |
27.2 mm |
20 ns |
||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
NO |
.002 Amp |
27.2 mm |
35 ns |
|||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
NO |
.00005 Amp |
27.2 mm |
45 ns |
|||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
35 ns |
|||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
25 ns |
|||||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
NO |
.001 Amp |
27.2 mm |
15 ns |
||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
45 ns |
|||||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
NO |
.001 Amp |
27.2 mm |
35 ns |
||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
DUAL |
R-PDIP-T22 |
Not Qualified |
65536 bit |
.002 Amp |
45 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
20 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
256 words |
SEPARATE |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
-10 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
1024 bit |
e0 |
350 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
64KX1 |
64K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T22 |
1 |
5.5 V |
5.969 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
260 |
27.559 mm |
55 ns |
|||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
DUAL |
R-XDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
29.337 mm |
55 ns |
|||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
20 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
1024 bit |
e0 |
.00001 Amp |
450 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
12 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
SEPARATE |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
-10 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
1024 bit |
e0 |
250 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
1024 bit |
e0 |
.00001 Amp |
250 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.8 mm |
30 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
15 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
20k Rad(Si) |
CERAMIC |
NO |
CMOS |
38535V;38534K;883S |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
13 mA |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256X4 |
256 |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T22 |
Not Qualified |
1024 bit |
.0001 Amp |
315 ns |
|||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
10 mA |
64 words |
5 |
5 |
8 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
85 Cel |
64X8 |
64 |
2.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
e0 |
.000025 Amp |
1000 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
16KX4 |
16K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
30 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T22 |
5.5 V |
5.72 mm |
10.16 mm |
Not Qualified |
1024 bit |
4.5 V |
e0 |
220 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
6.3 mA |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256X4 |
256 |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-GDIP-T22 |
5.5 V |
Not Qualified |
1024 bit |
4.5 V |
ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
NO |
.00001 Amp |
300 ns |
||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
15 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
22 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
1024 words |
COMMON |
4 |
FLATPACK |
FL22,.4 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
1KX4 |
1K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDFP-F20 |
Not Qualified |
4096 bit |
e0 |
400 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
16KX4 |
16K |
0 Cel |
DUAL |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
27.08 mm |
15 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
256 words |
SEPARATE |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
-10 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
1024 bit |
e0 |
450 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
1024 bit |
e0 |
.00001 Amp |
650 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
1024 bit |
e0 |
.000015 Amp |
250 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.