Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-N34 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
70 ns |
||||||||||||||||||||||||||||
Analog Devices |
MULTI-PORT SRAM |
INDUSTRIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
256 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256X8 |
256 |
4.5 V |
-40 Cel |
TIN LEAD |
DUAL |
2, (MUXED) |
R-PDSO-G24 |
1 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2048 bit |
2.5 V |
MUX ADDRESS DATA LATCH |
e0 |
.0003 Amp |
15.4 mm |
35 ns |
|||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-N34 |
5.25 V |
Not Qualified |
262144 bit |
4.75 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
70 ns |
||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
34 |
PLASTIC/EPOXY |
CMOS |
40 mA |
524288 words |
3/3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
70 Cel |
512KX8 |
512K |
0 Cel |
Not Qualified |
4194304 bit |
.004 Amp |
200 ns |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
34 |
SOJ-I |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J INVERTED |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-U34 |
5.25 V |
6.35 mm |
21.5265 mm |
Not Qualified |
1048576 bit |
4.75 V |
OVER 10 YEARS DATA RETENTION |
e0 |
24.5745 mm |
100 ns |
|||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-N34 |
Not Qualified |
1048576 bit |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
150 ns |
||||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
70 ns |
||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
2048 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P24 |
5.5 V |
10.668 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
33.02 mm |
100 ns |
||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
34 |
PLASTIC/EPOXY |
CMOS |
50 mA |
32768 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
70 Cel |
32KX8 |
32K |
0 Cel |
Not Qualified |
262144 bit |
.00015 Amp |
100 ns |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
J INVERTED |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
70 Cel |
512KX8 |
512K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-U34 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.0006 Amp |
70 ns |
||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P28 |
5.25 V |
Not Qualified |
65536 bit |
4.75 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
150 ns |
||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
150 ns |
||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
J INVERTED |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-U34 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
120 ns |
||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
120 ns |
|||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
75 mA |
2048 words |
8 |
CARD30 |
SRAMs |
70 Cel |
2KX8 |
2K |
0 Cel |
Not Qualified |
16384 bit |
.01 Amp |
250 ns |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32KX8 |
32K |
0 Cel |
DUAL |
R-XDMA-X28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
100 ns |
|||||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
4194304 bit |
3 V |
e3 |
.00025 Amp |
100 ns |
|||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-N34 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
70 ns |
||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
INDUSTRIAL |
34 |
PLASTIC/EPOXY |
CMOS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
85 Cel |
32KX8 |
32K |
-40 Cel |
Not Qualified |
262144 bit |
.005 Amp |
100 ns |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
5.25 V |
Not Qualified |
262144 bit |
4.75 V |
e3 |
.0006 Amp |
200 ns |
|||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T28 |
5.5 V |
9.398 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
DATA RETENTION > 10 YEARS |
e3 |
38.862 mm |
170 ns |
||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-N34 |
5.25 V |
Not Qualified |
4194304 bit |
4.75 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
70 ns |
||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
9.27 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.5 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
53.085 mm |
70 ns |
|||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.25 V |
9.398 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
BATTERY BACK-UP |
e0 |
33.782 mm |
200 ns |
|||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
34 |
PLASTIC/EPOXY |
CMOS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
70 Cel |
32KX8 |
32K |
0 Cel |
Not Qualified |
262144 bit |
.005 Amp |
150 ns |
||||||||||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
INDUSTRIAL |
34 |
PLASTIC/EPOXY |
CMOS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
85 Cel |
32KX8 |
32K |
-40 Cel |
Not Qualified |
262144 bit |
.005 Amp |
200 ns |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
36 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
2MX8 |
2M |
0 Cel |
DUAL |
R-PDMA-P36 |
5.25 V |
Not Qualified |
16777216 bit |
4.75 V |
5 YEAR DATA RETENTION |
NOT SPECIFIED |
NOT SPECIFIED |
100 ns |
|||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.25 V |
9.398 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
BATTERY BACK-UP |
e0 |
33.782 mm |
200 ns |
|||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
DUAL |
R-XDIP-P32 |
5.5 V |
10.922 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.5 V |
10 YEAR DATA RETENTION |
NOT SPECIFIED |
NOT SPECIFIED |
43.053 mm |
70 ns |
||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
70 ns |
||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
C BEND |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-C34 |
5.5 V |
6.85 mm |
23.495 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0006 Amp |
25.019 mm |
70 ns |
|||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
9.27 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
DATA RETENTION = 10 YRS |
e0 |
53.085 mm |
100 ns |
|||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
1048576 bit |
3 V |
10 YEAR DATA RETENTION |
e3 |
.00025 Amp |
100 ns |
||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.25 V |
9.27 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.75 V |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
53.085 mm |
70 ns |
|||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-N28 |
5.25 V |
Not Qualified |
262144 bit |
4.75 V |
BATTERY BACK-UP |
e0 |
200 ns |
||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-T32 |
1 |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0006 Amp |
100 ns |
||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
2048 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP24,.6 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P24 |
5.25 V |
10.668 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
e3 |
.01 Amp |
33.02 mm |
100 ns |
||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
J INVERTED |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
85 Cel |
512KX8 |
512K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-U34 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.0006 Amp |
70 ns |
||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
10 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
6 mA |
128 words |
8 |
IN-LINE |
DIP10,.3 |
SRAMs |
2.54 mm |
70 Cel |
128X8 |
128 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T10 |
Not Qualified |
1024 bit |
e0 |
.0025 Amp |
||||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDIP-P32 |
5.25 V |
10.922 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0006 Amp |
43.053 mm |
70 ns |
||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
34 |
SOJ-I |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J INVERTED |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
SMALL OUTLINE |
MODULE,34LEAD,1.0 |
SRAMs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-U34 |
5.25 V |
6.35 mm |
21.5265 mm |
Not Qualified |
1048576 bit |
4.75 V |
DATA RETENTION > 10 YEARS |
e0 |
.005 Amp |
24.5745 mm |
100 ns |
||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
36 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
1048576 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP36,.6 |
SRAMs |
2.54 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P36 |
5.5 V |
Not Qualified |
8388608 bit |
4.5 V |
e3 |
.0002 Amp |
100 ns |
|||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
INDUSTRIAL |
34 |
PLASTIC/EPOXY |
CMOS |
85 mA |
524288 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
MODULE,34LEAD,1.0 |
SRAMs |
85 Cel |
512KX8 |
512K |
-40 Cel |
Not Qualified |
4194304 bit |
.005 Amp |
100 ns |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
262144 words |
3.3 |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T28 |
3.6 V |
10.668 mm |
15.24 mm |
Not Qualified |
2097152 bit |
3 V |
10 YEAR DATA RETENTION |
e3 |
.00025 Amp |
38.225 mm |
150 ns |
|||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T24 |
5.25 V |
9.398 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
10 YEAR DATA RETENTION PERIOD |
e3 |
33.782 mm |
150 ns |
||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P28 |
5.25 V |
Not Qualified |
65536 bit |
4.75 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
200 ns |
||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-N32 |
Not Qualified |
4194304 bit |
10 YEARS OF DATA RETENTION PERIOD |
e0 |
150 ns |
||||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
120 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
Not Qualified |
262144 bit |
e0 |
.005 Amp |
45 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.