Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
37748736 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
37748736 bit |
1.7 V |
15 mm |
.55 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
CMOS |
MIL-STD-883 Class B (Modified) |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
65 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC28,.45SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-N28 |
Not Qualified |
16384 bit |
e0 |
.0001 Amp |
100 ns |
|||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
Matte Tin (Sn) - annealed |
1 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
37748736 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
4096 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
4096 bit |
e0 |
.0008 Amp |
35 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
256KX18 |
256K |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
3.45 V |
1.5 mm |
17 mm |
4718592 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
17 mm |
12 ns |
||||||||||||||||||||||||||
Renesas Electronics |
DUAL-PORT SRAM |
MILITARY |
84 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
250 mA |
4096 words |
COMMON |
5 |
5 |
16 |
GRID ARRAY |
PGA84M,11X11 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
4KX16 |
4K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
2 |
S-CPGA-P84 |
1 |
5.5 V |
5.207 mm |
27.94 mm |
Not Qualified |
65536 bit |
4.5 V |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
NOT SPECIFIED |
240 |
.004 Amp |
27.94 mm |
35 ns |
||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
4MX36 |
4M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
150994944 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX36 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
150994944 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
700 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
.35 Amp |
17 mm |
.45 ns |
||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
37748736 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
800 mA |
1048576 words |
SEPARATE |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
200 MHz |
Not Qualified |
18874368 bit |
e1 |
30 |
260 |
.37 Amp |
.45 ns |
||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
524288 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G44 |
1 |
Not Qualified |
8388608 bit |
.00001 Amp |
55 ns |
|||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.211 mm |
25 ns |
|||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
37748736 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQFP-G120 |
5.5 V |
1.6 mm |
14 mm |
16384 bit |
4.5 V |
14 mm |
35 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16384 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
16KX8 |
16K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J68 |
3.6 V |
4.57 mm |
24.2062 mm |
Not Qualified |
131072 bit |
3 V |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
e3 |
24.2062 mm |
35 ns |
||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
16 |
FLATPACK |
85 Cel |
32KX16 |
32K |
-40 Cel |
QUAD |
S-PQFP-G100 |
5.5 V |
524288 bit |
4.5 V |
25 ns |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
460 mA |
65536 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.15 V |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
R-PQFP-G128 |
3 |
3.45 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
1179648 bit |
3.15 V |
PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE |
e3 |
30 |
260 |
.015 Amp |
20 mm |
4.2 ns |
|||||||||
|
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
8MX18 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
150994944 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
.45 ns |
||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16384 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
16KX8 |
16K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J68 |
3.6 V |
4.57 mm |
24.2062 mm |
Not Qualified |
131072 bit |
3 V |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
e3 |
24.2062 mm |
35 ns |
||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
8MX18 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
150994944 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
J BEND |
PARALLEL |
ASYNCHRONOUS |
270 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
PGA68,11X11 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQCC-J68 |
1 |
5.5 V |
4.572 mm |
24.2062 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
24.2062 mm |
55 ns |
||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
19 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
128 |
QFF |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
.5 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-F128 |
3 |
5.5 V |
1.6 mm |
14 mm |
32768 bit |
4.5 V |
e0 |
20 mm |
20 ns |
||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
DDR II PLUS SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
||||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
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Renesas Electronics |
STANDARD SRAM |
COMMERCIAL EXTENDED |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
ECL |
-5.2 V |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
220 mA |
1024 words |
SEPARATE |
-5.2 |
4 |
IN-LINE |
DIP24,.4 |
SRAMs |
2.54 mm |
75 Cel |
OPEN-EMITTER |
1KX4 |
1K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-CDIP-T24 |
Not Qualified |
4096 bit |
e0 |
15 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-CDIP-T48 |
5.5 V |
4.826 mm |
15.24 mm |
Qualified |
32768 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
60.96 mm |
55 ns |
|||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
37748736 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 Class B |
J BEND |
PARALLEL |
ASYNCHRONOUS |
370 mA |
4096 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC84,1.2SQ |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
4KX16 |
4K |
4.5 V |
-55 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J84 |
3 |
5.5 V |
4.572 mm |
29.3116 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
40 |
260 |
.00003 Amp |
29.3116 mm |
20 ns |
||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
910 mA |
1048576 words |
COMMON |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
400 MHz |
Not Qualified |
37748736 bit |
.79 Amp |
.55 ns |
|||||||||||||||||||||||
|
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
460 mA |
65536 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.15 V |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
3.45 V |
133 MHz |
Not Qualified |
1179648 bit |
3.15 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.015 Amp |
4 ns |
||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
84 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class B |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
16 |
GRID ARRAY |
PGA84M,11X11 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
4KX16 |
4K |
2 V |
-55 Cel |
MATTE TIN |
PERPENDICULAR |
2 |
S-CPGA-P84 |
5.5 V |
5.207 mm |
27.94 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.004 Amp |
27.94 mm |
25 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.