Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
STANDARD SRAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
700 mA |
4194304 words |
COMMON |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
300 MHz |
Not Qualified |
75497472 bit |
.45 ns |
|||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
Matte Tin (Sn) - annealed |
1 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
X-PBGA-B256 |
3.45 V |
9437184 bit |
3.15 V |
3.6 ns |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
370 mA |
131072 words |
COMMON |
2.5 |
2.5,2.5/3.3 |
36 |
GRID ARRAY |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
2.4 V |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
2.6 V |
133 MHz |
Not Qualified |
4718592 bit |
2.4 V |
e1 |
30 |
260 |
.015 Amp |
4.2 ns |
|||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
200k Rad(Si) |
CMOS |
PARALLEL |
ASYNCHRONOUS |
41.6 mA |
16384 words |
SEPARATE |
5 |
5 |
1 |
DIE OR CHIP |
SRAMs |
70 Cel |
3-STATE |
16KX1 |
16K |
3 V |
0 Cel |
Not Qualified |
16384 bit |
.0001 Amp |
150 ns |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
200 mA |
8192 words |
COMMON |
3.3 |
3.3 |
8 |
CHIP CARRIER |
LDCC68,1.0SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
3 V |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQCC-N68 |
1 |
3.6 V |
4.572 mm |
24.2062 mm |
Not Qualified |
65536 bit |
3 V |
e3 |
30 |
260 |
.005 Amp |
24.2062 mm |
20 ns |
|||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
110 mA |
8192 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
FL28,.4 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.0003 Amp |
18.288 mm |
25 ns |
|||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
185 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC48,.56SQ,40 |
SRAMs |
1.016 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
QUAD |
2 |
S-CQCC-N48 |
1 |
5.5 V |
3.048 mm |
14.3002 mm |
Qualified |
16384 bit |
4.5 V |
e0 |
240 |
.004 Amp |
14.3002 mm |
45 ns |
||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
4096 words |
5 |
9 |
CHIP CARRIER |
.5 mm |
70 Cel |
4KX9 |
4K |
0 Cel |
QUAD |
S-PQCC-J68 |
5.5 V |
4.572 mm |
24.13 mm |
36864 bit |
4.5 V |
24.13 mm |
12 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3.6 V |
1.4 mm |
14 mm |
524288 bit |
3 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
14 mm |
6.5 ns |
||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
285 mA |
2048 words |
5 |
16 |
CHIP CARRIER |
125 Cel |
2KX16 |
2K |
-55 Cel |
QUAD |
S-PQCC-N68 |
5.5 V |
32768 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Qualified |
65536 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.211 mm |
55 ns |
|||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
415 mA |
32768 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
32KX18 |
32K |
3.15 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
3.45 V |
1.7 mm |
100 MHz |
17 mm |
Not Qualified |
589824 bit |
3.15 V |
PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE |
e1 |
30 |
260 |
.03 Amp |
17 mm |
5 ns |
|||||||||
|
Renesas Electronics |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
700 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.35 Amp |
17 mm |
.45 ns |
||||||||||||||
Renesas Electronics |
PSEUDO STATIC RAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
5.7 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
ACCESS TIME IN STATIC COLUMN MODE =50NS |
35.6 mm |
100 ns |
|||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
13 mm |
37748736 bit |
1.7 V |
15 mm |
.45 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
14 mA |
1024 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
1KX4 |
1K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T18 |
4096 bit |
e0 |
.000015 Amp |
320 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
52 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
CHIP CARRIER |
1.016 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-N52 |
5.5 V |
4.58 mm |
14.3002 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
14.3002 mm |
90 ns |
|||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1110 mA |
2097152 words |
COMMON |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
533 MHz |
Not Qualified |
75497472 bit |
.96 Amp |
.45 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
68 |
SPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
300 mA |
16384 words |
COMMON |
5 |
5 |
8 |
GRID ARRAY, SHRINK PITCH |
PGA68,11X11 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
4.5 V |
-40 Cel |
TIN LEAD |
PERPENDICULAR |
2 |
S-CPGA-P68 |
5.5 V |
5.207 mm |
29.464 mm |
Not Qualified |
131072 bit |
4.5 V |
e0 |
.03 Amp |
29.464 mm |
55 ns |
|||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.55 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
CACHE TAG SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
500 mA |
32768 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX64 |
32K |
3.14 V |
0 Cel |
DUAL |
R-PDMA-N144 |
Not Qualified |
262144 bit |
.012 Amp |
12 ns |
||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
84 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
16 |
GRID ARRAY |
70 Cel |
16KX16 |
16K |
0 Cel |
PERPENDICULAR |
S-CPGA-P84 |
5.5 V |
262144 bit |
4.5 V |
15 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
750 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1 |
1.9 V |
1.46 mm |
300 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
.38 Amp |
17 mm |
.3 ns |
||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
370 mA |
16384 words |
COMMON |
5 |
5 |
8 |
GRID ARRAY |
PGA68,11X11 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX8 |
16K |
4.5 V |
-55 Cel |
MATTE TIN |
PERPENDICULAR |
2 |
S-CPGA-P68 |
5.5 V |
2.413 mm |
27.889 mm |
Not Qualified |
131072 bit |
4.5 V |
e3 |
.03 Amp |
27.889 mm |
20 ns |
|||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
250 mA |
2048 words |
5 |
16 |
GRID ARRAY |
2.54 mm |
70 Cel |
2KX16 |
2K |
0 Cel |
PERPENDICULAR |
S-CPGA-P68 |
5.5 V |
29.464 mm |
32768 bit |
4.5 V |
29.464 mm |
90 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
16KX36 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
3.45 V |
1.5 mm |
17 mm |
Not Qualified |
589824 bit |
3.15 V |
e1 |
17 mm |
6 ns |
||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
290 mA |
16384 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
16KX8 |
16K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J68 |
5.5 V |
4.572 mm |
24.2062 mm |
Not Qualified |
131072 bit |
4.5 V |
INTERRUPT FLAG; ARBITER; SEMAPHORE |
e3 |
24.2062 mm |
45 ns |
|||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
37748736 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1130 mA |
2097152 words |
SEPARATE |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
450 MHz |
Not Qualified |
75497472 bit |
.81 Amp |
.45 ns |
||||||||||||||||||||||
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
37748736 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
75497472 bit |
1.7 V |
17 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
.08 Amp |
55 ns |
||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
60 mA |
16384 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP20,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX1 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T20 |
Not Qualified |
16384 bit |
e0 |
70 ns |
||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16384 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
16KX8 |
16K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J68 |
3.6 V |
4.57 mm |
24.2062 mm |
Not Qualified |
131072 bit |
3 V |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
e3 |
24.2062 mm |
25 ns |
||||||||||||||||||||||
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
230 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC48,.56SQ,40 |
SRAMs |
1.016 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
TIN LEAD |
QUAD |
2 |
S-CQCC-N48 |
1 |
5.5 V |
3.048 mm |
14.3002 mm |
Qualified |
16384 bit |
4.5 V |
e0 |
240 |
.03 Amp |
14.3002 mm |
55 ns |
||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
225 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
TIN LEAD |
DUAL |
2 |
R-GDIP-T48 |
1 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
240 |
.03 Amp |
70 ns |
|||||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
19 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
25 mA |
16384 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY |
BGA100,10X10,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
16KX16 |
16K |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
X-PBGA-B100 |
3 |
1.9 V |
50 MHz |
Not Qualified |
262144 bit |
1.7 V |
FLOW-THROUGH |
e1 |
30 |
260 |
.000008 Amp |
10 ns |
||||||||||||
Renesas Electronics |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
15 mm |
.45 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
16 |
GRID ARRAY |
2.54 mm |
125 Cel |
2KX16 |
2K |
-55 Cel |
PERPENDICULAR |
S-CPGA-P68 |
5.5 V |
5.207 mm |
29.464 mm |
Qualified |
32768 bit |
4.5 V |
ARBITER |
NOT SPECIFIED |
NOT SPECIFIED |
29.464 mm |
70 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T48 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
45 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.