BALL Digital Signal Processors (DSPs) 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-TS201SABP-060

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

32

1.2,1.6,2.5

GRID ARRAY

BGA576,24X24,40

1.14 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

3.1 mm

786432

25 mm

ALSO REQUIRES 2.5V SUPPLY

YES

64

125 MHz

225

MULTIPLE

25 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B576

3

Not Qualified

NO

YES

e0

DSP56311VF150

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

18

GRID ARRAY, LOW PROFILE

1.7 V

TIN LEAD SILVER

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

24

150 MHz

30

220

MULTIPLE

15 mm

CMOS

1.8 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e0

PIC24EP512GU810-E/BG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

BALL

121

TFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

3.3

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA121,11X11,32

3 V

125 Cel

5

-40 Cel

TIN SILVER COPPER

BOTTOM

1.2 mm

53248

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

Microcontrollers

FLASH

.8 mm

FLOATING POINT

S-PBGA-B121

Not Qualified

YES

e1

8

TMS320F2812GBBA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

179

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

2 V

16

19

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA179,14X14,32

1.81 V

85 Cel

C28X

3

-40 Cel

TIN LEAD

YES

BOTTOM

1.4 mm

18432

12 mm

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

YES

16

150 MHz

20

220

MULTIPLE

12 mm

7

36864

CMOS

230 mA

1.9 V

0

YES

FLASH

.8 mm

FIXED POINT

S-PBGA-B179

3

YES

NO

e0

16

ADSP-21479KBCZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

5242880

12 mm

YES

16

16.67 MHz

30

260

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

8

TMS320C6748EZWTD4E

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

14

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE

YES

16

30 MHz

30

260

MULTIPLE

16 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B361

3

YES

NO

e1

ADSP-TS101SAB1Z000

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

625

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

GRID ARRAY

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

27 mm

YES

64

260

SINGLE

27 mm

CMOS

1.25 V

1 mm

FLOATING POINT

S-PBGA-B625

3

YES

YES

e1

PIC24EP512GU810T-I/BG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

BALL

121

TFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

3.3

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA121,11X11,32

3 V

85 Cel

5

-40 Cel

TIN SILVER COPPER

BOTTOM

1.2 mm

53248

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

Microcontrollers

FLASH

.8 mm

FLOATING POINT

S-PBGA-B121

Not Qualified

YES

e1

8

TMS320C6414TBCLZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.16 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.05 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.18 MHz

30

260

MULTIPLE

23 mm

3

CMOS

1.1 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

8

TMS320C6414TBCLZ1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.24 V

20

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

4096

23 mm

YES

64

75 MHz

30

260

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

8

ADSP-21469KBCZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

24

32

1.05,1.8,3.3

GRID ARRAY

BGA324,18X18,40

1 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.8 mm

163840

19 mm

YES

8

66.66 MHz

30

260

MULTIPLE

19 mm

CMOS

10 mA

1.05 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B324

3

Not Qualified

NO

YES

e1

TMS320VC5416ZGU160

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.65 V

16

23

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

1.55 V

85 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

20 MHz

30

260

MULTIPLE

12 mm

1

CMOS

1.6 V

6

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B144

3

Not Qualified

YES

YES

e1

16

PIC24EP256GU810-E/BG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

BALL

121

TFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

3.3

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA121,11X11,32

3 V

125 Cel

5

-40 Cel

TIN SILVER COPPER

BOTTOM

1.2 mm

28672

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

Microcontrollers

FLASH

.8 mm

FLOATING POINT

S-PBGA-B121

Not Qualified

YES

e1

8

TMS320C6748EZWT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

14

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE

YES

16

30 MHz

30

260

MULTIPLE

16 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B361

3

YES

NO

e1

OMAP5910JGVL2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

289

TFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.675 V

16

25

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA289,21X21,20

1.525 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.2 mm

81920

12 mm

YES

16

13 MHz

20

220

MULTIPLE

12 mm

7

CMOS

1.6 V

15

MROM

.5 mm

FIXED POINT

S-PBGA-B289

3

192 rpm

YES

NO

e0

16

TMS320C5517AZCH20

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.15 V

16

21

GRID ARRAY, LOW PROFILE, FINE PITCH

.998 V

70 Cel

2

-10 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

163840

10 mm

YES

16

30

260

MULTIPLE

10 mm

3

CMOS

1.05 V

16

MROM

.65 mm

FIXED POINT

S-PBGA-B196

3

YES

NO

e1

16

TMS320DM642AGNZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.36 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

3

CMOS

1.4 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e0

ADSP-21569KBCZ10

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

110 Cel

0 Cel

BOTTOM

1.38 mm

163840

17 mm

YES

16

30

260

MULTIPLE

17 mm

10

CMOS

1 V

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

3

YES

YES

TMS320F28235ZJZQ

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

176

BGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.995 V

16

AEC-Q100

20

32

1.9,3.3

GRID ARRAY

BGA176,14X14,40

1.805 V

125 Cel

C28X

8

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

2.05 mm

68

15 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

32

150 MHz

NOT SPECIFIED

260

MULTIPLE

15 mm

21

69632

CMOS

315 mA

1.9 V

6

YES

Digital Signal Processors

FLASH

1 mm

FIXED POINT

S-PBGA-B176

3

Not Qualified

YES

NO

e1

16

SM320F28335GJZMEP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

BALL

176

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.995 V

20

GRID ARRAY, FINE PITCH

1.805 V

125 Cel

C28X

-55 Cel

TIN LEAD

YES

BOTTOM

2.05 mm

15 mm

YES

32

150 MHz

20

235

MULTIPLE

15 mm

69632

CMOS

1.9 V

6

YES

.5 mm

FLOATING POINT

S-PBGA-B176

3

YES

NO

e0

PIC24EP512GU810-I/BG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

BALL

121

TFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

3.3

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA121,11X11,32

3 V

85 Cel

5

-40 Cel

TIN SILVER COPPER

BOTTOM

1.2 mm

53248

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

Microcontrollers

FLASH

.8 mm

FLOATING POINT

S-PBGA-B121

Not Qualified

YES

e1

8

TMS320F2806NMFAR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.89 V

16

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA100,10X10,32

1.71 V

85 Cel

3

-40 Cel

TIN SILVER COPPER

YES

BOTTOM

1.4 mm

10240

10 mm

YES

0

100 MHz

30

260

MULTIPLE

10 mm

3

20480

CMOS

230 mA

1.8 V

0

YES

3

FLASH

.8 mm

FLOATING POINT

S-PBGA-B100

3

YES

NO

e1

16

TMS32C6414EGLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

ADSP-BF703BBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

184

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

12 mm

IT ALSO OPERATES AT 3.3V NOM SUPPLY

YES

0

400 MHz

260

MULTIPLE

12 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B184

3

YES

YES

e1

DSP56311VL150R2

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

18

GRID ARRAY, LOW PROFILE

1.7 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

24

150 MHz

40

260

MULTIPLE

15 mm

CMOS

1.8 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

DSP56321VL200

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.7 V

18

GRID ARRAY, LOW PROFILE

1.5 V

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

24

200 MHz

40

260

MULTIPLE

15 mm

CMOS

1.6 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

PIC24EP256GU810T-I/BG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

BALL

121

TFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

3.3

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA121,11X11,32

3 V

85 Cel

5

-40 Cel

TIN SILVER COPPER

BOTTOM

1.2 mm

28672

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

Microcontrollers

FLASH

.8 mm

FLOATING POINT

S-PBGA-B121

Not Qualified

YES

e1

8

ADSP-21569BBCZ10

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

AEC-Q100

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

125 Cel

-40 Cel

BOTTOM

1.38 mm

163840

17 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

10

CMOS

1 V

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

ADSP-BF561SBBCZ-6A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.4185 V

26

32

1.2,2.5/3.3

GRID ARRAY

BGA256,16X16,25

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.9 mm

17 mm

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

YES

32

133 MHz

MULTIPLE

17 mm

CMOS

1.35 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

600 rpm

YES

YES

e1

TMS320DM6435ZWT6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

81920

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

NO

NO

e1

8

ADSP-21161NCCAZ100

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

225

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

24

32

1.8,3.3

GRID ARRAY

BGA225,15X15,40

1.71 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.85 mm

32768

17 mm

YES

48

27.5 MHz

260

MULTIPLE

17 mm

CMOS

965 mA

1.8 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B225

3

Not Qualified

NO

YES

e1

ADSP-21161NKCAZ100

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

225

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

24

32

1.8,3.3

GRID ARRAY

BGA225,15X15,40

1.71 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.85 mm

32768

17 mm

YES

48

27.5 MHz

260

MULTIPLE

17 mm

CMOS

1.8 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B225

3

Not Qualified

NO

YES

e1

ADSP-BF548BBCZ-5AA

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.43 V

13

GRID ARRAY, LOW PROFILE, FINE PITCH

1.188 V

85 Cel

-40 Cel

BOTTOM

1.7 mm

17 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

CMOS

1.25 V

.8 mm

FIXED POINT

S-PBGA-B400

YES

YES

DSP56311VL150B1

Freescale Semiconductor

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

18

GRID ARRAY, LOW PROFILE

1.7 V

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

24

150 MHz

40

260

MULTIPLE

15 mm

CMOS

1.8 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

TMS320C6416TBGLZ1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

8

TMS320C6748EZWT4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

23

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

YES

16

30 MHz

30

260

SINGLE

16 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B361

3

YES

NO

e1

TMS320C6748EZWTA3E

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

14

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE

YES

16

30 MHz

30

260

MULTIPLE

16 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B361

3

YES

NO

e1

TMS320DM648CUT7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

520

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

14

32

1.2,1.8,3.3

GRID ARRAY

BGA529,23X23,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

8192

19 mm

YES

32

720 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B520

4

Not Qualified

YES

NO

e1

8

OMAPL138BGWTMEP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

23

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

125 Cel

-55 Cel

TIN LEAD

BOTTOM

1.4 mm

8192

16 mm

YES

16

30 MHz

20

220

SINGLE

16 mm

8

CMOS

1.2 V

80

Other Microprocessor ICs

MROM

.8 mm

FLOATING POINT

S-PBGA-B361

3

345 rpm

YES

NO

e0

8

TMS320C6414TBCLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.16 V

20

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

4096

23 mm

YES

64

75 MHz

30

260

MULTIPLE

23 mm

3

CMOS

1.1 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

8

TMS32C6713BGDPA200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

22

32

1.2,3.3

GRID ARRAY

BGA272,20X20,50

1.14 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

65536

27 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

32

200 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

1.2 V

16

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

TUSB1310AZAYR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

175

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

3.63 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

2.97 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

ALSO OPERATES AT 1.8 V AND 1.1 V NOMINAL SUPPLY

YES

0

40 MHz

30

260

MULTIPLE

12 mm

CMOS

3.3 V

.8 mm

FIXED POINT

S-PBGA-B175

3

YES

NO

e1

ADSP-BF703KBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

184

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

12 mm

IT ALSO OPERATES AT 3.3V NOM SUPPLY

YES

0

400 MHz

260

MULTIPLE

12 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B184

3

YES

YES

e1

TMS320F28235ZJZA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

176

BGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.995 V

16

AEC-Q100

20

32

1.9,3.3

GRID ARRAY

BGA176,14X14,40

1.805 V

85 Cel

C28X

8

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

2.05 mm

68

15 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

32

150 MHz

NOT SPECIFIED

260

MULTIPLE

15 mm

21

69632

CMOS

315 mA

1.9 V

6

YES

Digital Signal Processors

FLASH

1 mm

FIXED POINT

S-PBGA-B176

3

Not Qualified

YES

NO

e1

16

TMS320C5517AZCHA20

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.15 V

16

21

GRID ARRAY, LOW PROFILE, FINE PITCH

.998 V

85 Cel

2

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

163840

10 mm

YES

16

30

260

MULTIPLE

10 mm

3

CMOS

1.05 V

16

MROM

.65 mm

FIXED POINT

S-PBGA-B196

3

YES

NO

e1

16

TMS320C6414EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6672ACYP25

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

8

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

1.045 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

16384

24 mm

YES

64

30

245

SINGLE

24 mm

10

CMOS

1.1 V

144

Digital Signal Processors

MROM

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

8

TMS320C6746EZWT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

23

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

327680

16 mm

ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY

YES

16

30 MHz

30

260

SINGLE

16 mm

8

CMOS

1 V

80

.8 mm

FLOATING POINT

S-PBGA-B361

3

YES

NO

e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.