BALL Digital Signal Processors (DSPs) 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS32C6414EGLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	105 Cel		4	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
ADSP-21569BBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
TMS320VC5402ZGU100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.98 V	16		20	16	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.71 V	100 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2		CMOS		1.8 V	6			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1	16
ADSP-21262SKBCZ200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.26 V	32		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm	65536	12 mm		YES	16	200 MHz		260	MULTIPLE	12 mm	3		CMOS		1.2 V	22			Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1	32
ADSP-21569KBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel			0 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	10		CMOS		1 V					FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-21569WCBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10		CMOS		1 V					FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-TS201SABPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V			32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	85 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm			CMOS		1.05 V				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP21262SKBCZ200R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm	65536	12 mm		YES	16	66.67 MHz		260	MULTIPLE	12 mm			CMOS		1.2 V				Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
TMS320VC5416GWS160	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	85 Cel		4	-40 Cel	TIN LEAD		BOTTOM	1.4 mm	131072	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1		CMOS		1.6 V	6				MROM	.8 mm	FIXED POINT	S-PBGA-B144	3			YES	YES	e0	16
TMS320C6412AZNZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			23	32	1.4,3.3	GRID ARRAY	BGA548,26X26,40	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.8 mm	262144	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	27 mm	3		CMOS		1.4 V	64			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320F2806NMFA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.89 V	16		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	1.71 V	85 Cel	C28X	3	-40 Cel	TIN SILVER COPPER	YES	BOTTOM	1.4 mm	10240	10 mm		YES	0	100 MHz	30	260	MULTIPLE	10 mm	3	20480	CMOS	230 mA	1.8 V	0	YES			FLASH	.8 mm	FLOATING POINT	S-PBGA-B100	3			YES	NO	e1	16
TMS320VC5509AZAYR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		21	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.55 V	85 Cel		5	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	128K	12 mm	ALSO OPERATES AT 1.2V AND 1.35V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2		CMOS	5.5 mA	1.6 V	6				FLASH	.8 mm	FIXED POINT	S-PBGA-B179	3			YES	NO	e1	16
ADSP-BF561SKBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	27 mm			CMOS		1.25 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e1
TMS320C6748EZCED4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			14			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE	YES	16	30 MHz	30	260	MULTIPLE	13 mm			CMOS		1 V						.65 mm	FIXED POINT	S-PBGA-B361	3			YES	NO	e1
VCBUSAM648T9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			14			GRID ARRAY		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM					YES	32	900 MHz	30	245	MULTIPLE				CMOS		1.2 V							FIXED POINT	S-PBGA-B520	4			YES	NO	e1
OMAP5910JZZG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.675 V			25	16	1.6,1.8/2.75/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,21X21,20	1.525 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	163840	12 mm	ALSO REQUIRES 2.75V OR 3.3V SUPPLY	YES	16	13 MHz	30	260	MULTIPLE	12 mm	8		CMOS		1.6 V	6			Digital Signal Processors	MROM	.5 mm	FIXED POINT	S-PBGA-B289	4	Not Qualified		YES	NO	e1	16
TMS320C5535AZHHA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8		0	16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA144,14X14,32	1.24 V	85 Cel		2	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	163840	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4		CMOS		1.3 V	16			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	NO	e1	8
TMS320DM6435ZWT6CX	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	EMIF ADDRESS BUS 22 AND DATA BUS 8 AVAILABLE	YES	32		30	260	MULTIPLE	16 mm			CMOS		1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3			YES	NO	e1
ADSP-21160NCB-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V			32	32	1.8/2,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V					TIN LEAD SILVER		BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz		225	MULTIPLE	27 mm			CMOS		1.9 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		NO	YES	e0
ADSP-BF561SBBZ600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	27 mm			CMOS		1.35 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e1
TMS320C6678ACYP4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	841	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.95 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.39 mm		24 mm		YES	16		30	245	MULTIPLE	24 mm	16		CMOS		1 V	80					.8 mm	FIXED POINT	S-PBGA-B841	4			NO	NO	e1
TMS320C6747DZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			15	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4		CMOS		1.2 V	40			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6748EZWTD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			14			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE	YES	16	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1 V						.8 mm	FIXED POINT	S-PBGA-B361	3			YES	NO	e1
ADSP-21161NCCA-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	105 Cel			-40 Cel	TIN LEAD SILVER		BOTTOM	1.85 mm	32768	17 mm		YES	48	27.5 MHz		240	MULTIPLE	17 mm			CMOS		1.8 V				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e0
ADSP-21479KBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40	1.1,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1		CMOS		1.2 V	65		1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-BF538BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	40	260	MULTIPLE	17 mm			CMOS		1.2 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF703BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V						.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
OMAP5910JZVL2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.675 V	16		25	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,21X21,20	1.525 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	81920	12 mm		YES	16	13 MHz	30	260	MULTIPLE	12 mm	7		CMOS		1.6 V	15				MROM	.5 mm	FIXED POINT	S-PBGA-B289	3		192 rpm	YES	NO	e1	16
TMS320C6655CZH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8		24	32	1,1.5,1.8	GRID ARRAY, FINE PITCH	BGA625,25X25,32		85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.99 mm	8192	21 mm		YES	16		30	245	MULTIPLE	21 mm	8		CMOS			72			Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B625	3	Not Qualified		YES	NO	e1	8
TMS320C6747BZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			16	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320F2812GHHS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2 V	16	AEC-Q100	19	32	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.81 V	125 Cel	C28X	3	-40 Cel	TIN LEAD		BOTTOM	1.4 mm	18432	12 mm	ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ	YES	16	150 MHz	20	220	MULTIPLE	12 mm	8	36864	CMOS	230 mA	1.9 V		YES		Digital Signal Processors	OTPROM	.8 mm	FIXED POINT	S-PBGA-B179	3	Not Qualified		YES	NO	e0	16
ADSP-BF532SBBZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	19 mm			CMOS		1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B169	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-TS202SABPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V			32			GRID ARRAY		1 V	85 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm			CMOS		1.05 V						1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
TMS320C6416TBGLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V			23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		4	0 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS		1.2 V	64			Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0	8
ADSP-21061LKB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V			32	32	3.3	GRID ARRAY	PGA225,15X15	3.15 V	85 Cel			0 Cel	TIN LEAD SILVER		BOTTOM	2.57 mm	32768	23 mm		YES	48	40 MHz	30	225	MULTIPLE	23 mm			CMOS	480 mA	3.3 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e0
TMS32C6713BZDPA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.14 V	105 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	2.57 mm	65536	27 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	32	200 MHz	30	260	MULTIPLE	27 mm	2		CMOS		1.2 V	16			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified		YES	NO	e1
ADSP-BF536BBCZ-3B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz		260	MULTIPLE	17 mm			CMOS		1.2 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF561SKB600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel			0 Cel	TIN LEAD SILVER		BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		225	MULTIPLE	27 mm			CMOS		1.35 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e0
TMS320F28235ZJZQR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	BGA	SQUARE	PLASTIC/EPOXY		YES	1.995 V		AEC-Q100	16			GRID ARRAY		1.805 V	125 Cel	C28X		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	YES	BOTTOM	2.05 mm		15 mm		YES	32	35 MHz	30	260	MULTIPLE	15 mm		69632	CMOS		1.9 V	6	YES				1 mm	FIXED POINT	S-PBGA-B176	3			YES	NO	e1
ADSP-21060LABZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V			32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.7 mm	4194304	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm			CMOS		3.3 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-BF561SBBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm			CMOS		1.25 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
PIC24EP256GU810T-E/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8		0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	125 Cel		5	-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz				10 mm	9		CMOS	320 mA	3.3 V	15		0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
TMS320VC5416ZWS160	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	85 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	131072	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1		CMOS		1.6 V	6				MROM	.8 mm	FIXED POINT	S-PBGA-B144	3			YES	YES	e1	16
ADSP-21060KBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V			32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.7 mm	4194304	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm			CMOS		5 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-BF703KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V						.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
OMAP5912ZDY	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			26	16	1.6,1.8/2.75/3.3	GRID ARRAY	BGA289,17X17,40	1.525 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.32 mm	163840	19 mm	ALSO REQUIRES 2.75V OR 3.3V SUPPLY	YES	16	19.2 MHz	30	260	MULTIPLE	19 mm	8		CMOS		1.6 V	6			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	192 rpm	YES	NO	e1
TMS320C6413ZTSA500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			23	32	1.2,3.3	GRID ARRAY	BGA288,22X22,40	1.14 V	105 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	30 MHz	30	260	MULTIPLE	23 mm	3		CMOS		1.2 V	64			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B288	4	Not Qualified		YES	NO	e1
TMS320DM640ZDK400	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V							BOTTOM	2.5 mm	16384	23 mm		YES	32	75 MHz			MULTIPLE	23 mm			CMOS		1.2 V				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548		Not Qualified		NO	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.