Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
136 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA136,14X14,32 |
1.14 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
98304 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
260 |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
3 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
208 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA208,20X20,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
17 mm |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.8 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B208 |
3 |
Not Qualified |
300 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
297 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.375 V |
23 |
32 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA297,26X26,40 |
.8 V |
70 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.43 mm |
27 mm |
ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY |
YES |
32 |
500 MHz |
225 |
MULTIPLE |
27 mm |
CMOS |
1.25 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B297 |
3 |
Not Qualified |
500 rpm |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.4185 V |
23 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,25 |
.8 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
12 mm |
ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY |
YES |
32 |
600 MHz |
260 |
MULTIPLE |
12 mm |
CMOS |
1.35 V |
Microprocessors |
.65 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
600 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
297 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.4185 V |
23 |
32 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA297,26X26,40 |
.8 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.43 mm |
27 mm |
ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY |
YES |
32 |
600 MHz |
260 |
MULTIPLE |
27 mm |
CMOS |
1.35 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B297 |
3 |
Not Qualified |
600 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
16 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
1.14 V |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
1.6 mm |
262144 |
17 mm |
YES |
0 |
300 MHz |
40 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
Not Qualified |
NO |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.99 V |
22 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA429,21X21,50 |
1.81 V |
115 Cel |
4 |
-55 Cel |
TIN LEAD |
BOTTOM |
3.3 mm |
16384 |
27 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
140 MHz |
MULTIPLE |
27 mm |
2 |
CMOS |
1.9 V |
4 |
Digital Signal Processors |
FLASH |
1.27 mm |
FLOATING POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
2.02 mm |
65536 |
17 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
NO |
32 |
250 MHz |
20 |
220 |
MULTIPLE |
17 mm |
1 |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
NO |
NO |
e0 |
|||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
8 |
0 |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA625,25X25,32 |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.99 mm |
8192 |
21 mm |
YES |
0 |
30 |
245 |
MULTIPLE |
21 mm |
16 |
CMOS |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
24 |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA841,29X29,32 |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.39 mm |
8192 |
24 mm |
YES |
16 |
30 |
245 |
MULTIPLE |
24 mm |
16 |
CMOS |
80 |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
22 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.14 V |
90 Cel |
4 |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.57 mm |
65536 |
27 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
225 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
27 mm |
2 |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA376,22X22,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
81920 |
23 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
27 MHz |
30 |
260 |
MULTIPLE |
23 mm |
5 |
CMOS |
1.2 V |
72 |
Digital Signal Processors |
MROM |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
BALL |
1031 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
15 |
32 |
1 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1031,37X37,25 |
.95 V |
95 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.31 mm |
16384 |
25 mm |
YES |
32 |
NOT SPECIFIED |
245 |
MULTIPLE |
25 mm |
8 |
CMOS |
1 V |
72 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B1031 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
BALL |
1031 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
15 |
32 |
1 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1031,37X37,25 |
.95 V |
95 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.31 mm |
16384 |
25 mm |
YES |
32 |
NOT SPECIFIED |
245 |
MULTIPLE |
25 mm |
8 |
CMOS |
1 V |
72 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B1031 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.89 V |
16 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.71 V |
85 Cel |
C28X |
3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
1.4 mm |
18432 |
10 mm |
YES |
0 |
100 MHz |
30 |
260 |
MULTIPLE |
10 mm |
3 |
36864 |
CMOS |
230 mA |
1.8 V |
0 |
YES |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
3 |
YES |
NO |
e1 |
16 |
|||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.89 V |
16 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.71 V |
125 Cel |
C28X |
3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
1.4 mm |
18432 |
10 mm |
YES |
0 |
100 MHz |
30 |
260 |
MULTIPLE |
10 mm |
3 |
36864 |
CMOS |
230 mA |
1.8 V |
0 |
YES |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
3 |
YES |
NO |
e1 |
16 |
|||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.995 V |
16 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA179,14X14,32 |
1.805 V |
85 Cel |
C28X |
8 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
1.4 mm |
34816 |
12 mm |
YES |
0 |
150 MHz |
30 |
260 |
MULTIPLE |
12 mm |
3 |
69632 |
CMOS |
.315 mA |
1.9 V |
6 |
YES |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B179 |
3 |
YES |
NO |
e1 |
16 |
|||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
201 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
16 |
20 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA201,17X17,32 |
1.2 V |
85 Cel |
4 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
32768 |
15 mm |
YES |
32 |
20 MHz |
30 |
260 |
MULTIPLE |
15 mm |
4 |
CMOS |
239 mA |
1.26 V |
6 |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B201 |
3 |
YES |
NO |
e1 |
16 |
|||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
16 |
21 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA179,14X14,32 |
1.55 V |
85 Cel |
5 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
128K |
12 mm |
ALSO OPERATES AT 1.2V AND 1.35V SUPPLY |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
12 mm |
2 |
CMOS |
5.5 mA |
1.6 V |
6 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B179 |
3 |
Not Qualified |
YES |
NO |
e1 |
16 |
|||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
16 |
21 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA179,14X14,32 |
1.55 V |
85 Cel |
5 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
128K |
12 mm |
ALSO OPERATES AT 1.2V AND 1.35V SUPPLY |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
12 mm |
2 |
CMOS |
5.5 mA |
1.6 V |
6 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B179 |
3 |
Not Qualified |
YES |
NO |
e1 |
16 |
|||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
240 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
16 |
22 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA240,17X17,32 |
1.55 V |
85 Cel |
6 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
163840 |
15 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
50 MHz |
30 |
260 |
MULTIPLE |
15 mm |
2 |
CMOS |
1.6 V |
6 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B240 |
3 |
Not Qualified |
YES |
NO |
e1 |
16 |
||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
1.4 mm |
10 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
0 |
20 MHz |
MULTIPLE |
10 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
14 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
YES |
32 |
720 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL EXTENDED |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
PGA225,15X15 |
3.15 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.57 mm |
32768 |
23 mm |
YES |
48 |
40 MHz |
40 |
260 |
MULTIPLE |
23 mm |
CMOS |
480 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
NO |
YES |
e1 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
24 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,20X20,50 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
65536 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
55.56 MHz |
260 |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
24 |
40 |
1.3,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.14 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
5242880 |
12 mm |
YES |
16 |
16.67 MHz |
MULTIPLE |
12 mm |
1 |
CMOS |
1.2 V |
65 |
1 |
Digital Signal Processors |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B196 |
3 |
Not Qualified |
YES |
YES |
e1 |
8 |
|||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
16 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
.95 V |
110 Cel |
0 Cel |
BOTTOM |
1.38 mm |
163840 |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
10 |
CMOS |
1 V |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B400 |
3 |
YES |
YES |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
208 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA208,20X20,32 |
1.7 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
17 mm |
YES |
16 |
50 MHz |
MULTIPLE |
17 mm |
CMOS |
1.8 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B208 |
3 |
Not Qualified |
600 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
316 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA316,20X20,32 |
.8 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B316 |
3 |
Not Qualified |
400 rpm |
YES |
YES |
e1 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.43 V |
22 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
1.188 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
17 mm |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.25 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
Not Qualified |
533 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
625 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA625,25X25,40 |
1.14 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
2.5 mm |
196608 |
27 mm |
YES |
64 |
100 MHz |
225 |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B625 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
32 |
GRID ARRAY |
1 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.1 mm |
25 mm |
ALSO REQUIRES 2.5V SUPPLY |
YES |
64 |
125 MHz |
MULTIPLE |
25 mm |
CMOS |
1.05 V |
1 mm |
FLOATING POINT |
S-PBGA-B576 |
3 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
384 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.57 V |
20 |
GRID ARRAY, FINE PITCH |
1.43 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.35 mm |
18 mm |
YES |
32 |
20 |
220 |
MULTIPLE |
18 mm |
CMOS |
1.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
4 |
YES |
NO |
e0 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
160 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
16 |
3.3 |
GRID ARRAY |
BGA160,14X14,40 |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
4096 |
15 mm |
YES |
16 |
80 MHz |
40 |
260 |
MULTIPLE |
15 mm |
CMOS |
220 mA |
3.3 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B160 |
3 |
Not Qualified |
YES |
YES |
e1 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.675 V |
24 |
16 |
1.6,1.8/2.75/3.3 |
GRID ARRAY |
BGA289,17X17,40 |
1.525 V |
85 Cel |
-40 Cel |
BOTTOM |
2.32 mm |
163840 |
19 mm |
YES |
16 |
13 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
19 mm |
CMOS |
1.6 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B289 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.675 V |
24 |
16 |
1.6,1.8/2.75/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,21X21,20 |
1.525 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
163840 |
12 mm |
YES |
16 |
13 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.6 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.15 V |
16 |
0 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,14X14,32 |
.998 V |
85 Cel |
2 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
163840 |
12 mm |
YES |
0 |
12 MHz |
30 |
260 |
MULTIPLE |
12 mm |
4 |
CMOS |
1.05 V |
16 |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B144 |
3 |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
532 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
23 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
1.36 V |
BOTTOM |
3.3 mm |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.75 MHz |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
3.25 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e0 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.155 V |
8 |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA841,29X29,32 |
1.045 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.39 mm |
16384 |
24 mm |
YES |
64 |
30 |
245 |
SINGLE |
24 mm |
10 |
CMOS |
1.1 V |
144 |
Digital Signal Processors |
MROM |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
14 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.95 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE |
YES |
16 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.14 V |
90 Cel |
4 |
0 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
16384 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
75 MHz |
20 |
220 |
MULTIPLE |
27 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.89 V |
16 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.71 V |
125 Cel |
C28X |
3 |
-40 Cel |
TIN LEAD |
YES |
BOTTOM |
1.4 mm |
18432 |
10 mm |
YES |
0 |
100 MHz |
20 |
220 |
MULTIPLE |
10 mm |
3 |
36864 |
CMOS |
230 mA |
1.8 V |
0 |
YES |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
3 |
YES |
NO |
e0 |
16 |
||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
176 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.995 V |
16 |
AEC-Q100 |
20 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA176,14X14,40 |
1.805 V |
85 Cel |
C28X |
8 |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
2.05 mm |
68 |
15 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
150 MHz |
NOT SPECIFIED |
260 |
MULTIPLE |
15 mm |
19 |
69632 |
CMOS |
315 mA |
1.9 V |
6 |
YES |
Digital Signal Processors |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B176 |
3 |
Not Qualified |
YES |
NO |
e1 |
16 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.