BALL Digital Signal Processors (DSPs) 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320VC5409AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel		4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		32768	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1		CMOS		1.6 V	6			MROM	.8 mm	FIXED POINT	S-PBGA-B144	3			YES	YES	e1	16
TMS320VC5410AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel		4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		65536	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1		CMOS		1.6 V	6			MROM	.8 mm	FIXED POINT	S-PBGA-B144	3			YES	YES	e1	16
TMS320VC5416GGU160	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	32	1.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	85 Cel		4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm		131072	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	20 MHz	20	220	MULTIPLE	12 mm	1		CMOS		1.6 V	6		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0	16
TMS320VC5416ZWS120	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	85 Cel		4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1		CMOS		1.5 V	6			MROM	.8 mm	FIXED POINT	S-PBGA-B144	3			YES	YES	e1	16
TMS32C6203BGNZA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,50	1.43 V	105 Cel		4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm		524288	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2		CMOS		1.5 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified		YES	NO	e0	8
ADSP-21161NYCAZ110	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.85 mm		32768	17 mm		YES	48	27.5 MHz			MULTIPLE	17 mm			CMOS	965 mA	1.8 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
MC56F8367VVFE	Freescale Semiconductor	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V			24	16	2.5,3.3	GRID ARRAY	BGA160,14X14,40	2.25 V	105 Cel	56800E		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm	524288		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	120 MHz	40	260	MULTIPLE	15 mm		36864	CMOS		2.5 V			Microcontrollers	FLASH	1 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	60 rpm	YES	YES	e1
TMS320C5505AZCH12	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8		27	16	1.05/1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.24 V	70 Cel		2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		163840	10 mm	ALSO OPERATES AT 60 MHZ WITH 1.05 V SUPPLY	YES	16	120 MHz	30	260	MULTIPLE	10 mm	3		CMOS		1.3 V	16		Digital Signal Processors	MROM	.65 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	NO	e1	8
TMS320C6412AGDK5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V	90 Cel		4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm		262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS		1.2 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6412AGNZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			23	32	1.4,3.3	GRID ARRAY	BGA548,26X26,40	1.36 V	90 Cel		4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm		262144	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	3		CMOS		1.4 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6424ZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		32	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		81920	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm	5		CMOS		1.2 V	64		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1	8
TMS320C6746EZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		23			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		327680	16 mm	ALSO OPEARTES AT 1.1V, 1.2V AND 1.3V SUPLLY	YES	16	30 MHz	30	260	SINGLE	16 mm	8		CMOS		1 V	80				.8 mm	FLOATING POINT	S-PBGA-B361	3			YES	NO	e1
TMS320C6747DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			15	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4		CMOS		1.2 V	40		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320DM642AZDK6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V	90 Cel		4	0 Cel	TIN/SILVER/COPPER (SN/AG/CU)	BOTTOM	2.5 mm		16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS		1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
ADSP-BF523BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm			17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF547BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-SC572KBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm			17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V					.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF537KBCZ-6AV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	12 mm			CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21369KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V			24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz			MULTIPLE	27 mm			CMOS		1.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21593KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel			0 Cel		BOTTOM	1.75 mm		655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	16		CMOS		1 V		6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-BF561SKBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm			17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	17 mm			CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
DSP56303VL100	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			18			GRID ARRAY, LOW PROFILE		3 V					TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm		YES	24	100 MHz	40	260	MULTIPLE	15 mm			CMOS		3.3 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1
DSP56321VF275	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V			18			GRID ARRAY, LOW PROFILE		1.5 V					TIN LEAD SILVER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	275 MHz	30	220	MULTIPLE	15 mm			CMOS		1.6 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e0
DSP56321VL240	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V			18			GRID ARRAY, LOW PROFILE		1.5 V					TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	240 MHz	40	260	MULTIPLE	15 mm			CMOS		1.6 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1
DSP56321VL220	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V			18			GRID ARRAY, LOW PROFILE		1.5 V					TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	220 MHz	40	260	MULTIPLE	15 mm			CMOS		1.6 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1
XC56311GC150	Motorola	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			18	24	1.8,3.3	GRID ARRAY	BGA196,14X14,40	1.7 V	100 Cel			0 Cel	TIN LEAD	BOTTOM	1.91 mm		98304	15 mm	ALSO REQUIRES 3.3V SUPPLY FOR I/O	YES	24	150 MHz			MULTIPLE	15 mm			CMOS		1.8 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196		Not Qualified		YES	YES	e0
DSP56303VF100	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			18			GRID ARRAY, LOW PROFILE		3 V					TIN LEAD	BOTTOM	1.6 mm			15 mm		YES	24	100 MHz	30	220	MULTIPLE	15 mm			CMOS		3.3 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e0
ADSP-BF707BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
TUSB1310AZAY	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	175	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.63 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			12 mm	ALSO OPERATES AT 1.8 V AND 1.1 V NOMINAL SUPPLY	YES	0	40 MHz	30	260	MULTIPLE	12 mm			CMOS		3.3 V					.8 mm	FIXED POINT	S-PBGA-B175	3			YES	NO	e1
XC56309VF100A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			18			GRID ARRAY, LOW PROFILE		3 V	100 Cel			-40 Cel		BOTTOM	1.6 mm			15 mm	ALSO HAVING 16-BIT ALU	YES	24	100 MHz			MULTIPLE	15 mm			CMOS		3.3 V					1 mm	FIXED POINT	S-PBGA-B196				YES	YES
ADSP-21160MKBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.49 mm		131072	27 mm		YES	64	80 MHz		260	MULTIPLE	27 mm			CMOS		2.5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		YES	YES	e1
ADSP-21262SBBC-150	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel			-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		65536	12 mm		YES	16	50 MHz		240	MULTIPLE	12 mm			CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0
ADSP-21262SKBC-200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.26 V	32		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel			0 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		65536	12 mm		YES	16	200 MHz		240	MULTIPLE	12 mm	3		CMOS		1.2 V	22		Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0	32
ADSP-2191MBCAZ-140	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		32768	10 mm		YES	16	100 MHz		260	MULTIPLE	10 mm			CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-BF512BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm			CMOS		1.225 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF518BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm		YES	16	400 MHz			MULTIPLE	12 mm			CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF525BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm			17 mm		YES	16	50 MHz		260	MULTIPLE	17 mm			CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF531SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF533SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF536BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		260	MULTIPLE	12 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF536BBCZ3BRL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm			17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF537KBCZ-6BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	17 mm			CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF547KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.3 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm			17 mm		YES	16	50 MHz			MULTIPLE	17 mm			CMOS					Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF561SBB600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel			-40 Cel	TIN LEAD SILVER	BOTTOM	2.43 mm			27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		225	MULTIPLE	27 mm			CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e0
ADSP-BF561SBBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm			27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	27 mm			CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm			17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm			CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-TS101SAB2Z100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32		GRID ARRAY, FINE PITCH		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm			19 mm		YES	64			260	SINGLE	19 mm			CMOS		1.2 V					.8 mm	FLOATING POINT	S-PBGA-B484	3			YES	YES	e1
DSPIC33EP128GM710-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel		5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		16384	10 mm		YES	0	60 MHz			MULTIPLE	10 mm	13		CMOS	60 mA	3.3 V	4	4	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B121		Not Qualified		YES	YES	e1	8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.