NXP Semiconductors Digital Signal Processors (DSPs) 658

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
SAA8110GBE	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V		0			FLATPACK, LOW PROFILE, FINE PITCH		3 V	75 Cel	0 Cel		QUAD	1.6 mm		12 mm		NO	0	28.6 MHz			SINGLE	12 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G80		Not Qualified	YES	NO
MSC8256SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8144EVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1.2,2.5,3.3	GRID ARRAY	BGA783,28X28,40	.97 V	90 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm	32768	29 mm		YES		133 MHz	30	245	MULTIPLE	29 mm		CMOS		1 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8101M1375F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	332	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA357,19X19,50	1.5 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.18 mm	262144	17 mm		YES	64	68.75 MHz	30	220	SINGLE	17 mm		CMOS		1.6 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified	YES	NO	e0
MSC8252TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES	0				MULTIPLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			YES	NO
XCD56366PV120	NXP Semiconductors			GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES				24	3.3	FLATPACK	QFP144,.87SQ,20					QUAD		20480											CMOS	200 mA	3.3 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified
PC56F8006VWL	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	16	0	16		SMALL OUTLINE	SOP28,.4	1.8 V	105 Cel	-40 Cel		DUAL	2.65 mm	512	7.5 mm		YES	0	64 MHz	40	260	MULTIPLE	17.925 mm	3	CMOS	53 mA	3.3 V		1		FLASH	1.27 mm	FLOATING POINT	R-PDSO-G28	3		YES	YES		16
935322563557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
MSC8154ETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
935311605557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	8	0	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	-40 Cel	TIN	QUAD	1.6 mm	24K	10 mm		YES	0	100 MHz	40	260	MULTIPLE	10 mm	4	CMOS	101 mA	3.3 V	4	2		FLASH	.5 mm	FLOATING POINT	S-PQFP-G64	3		YES	YES	e3	8
MSC8157ETVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm		29 mm		YES	0	667 MHz	30	245	SINGLE	29 mm		CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B783	3		YES	NO
MSC8144TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm		YES		133 MHz			MULTIPLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8144SVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm		YES		133 MHz			MULTIPLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8144EC	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	3.215 mm		29 mm		YES	0	133 MHz			MULTIPLE	29 mm		CMOS		1 V					.5 mm	FIXED POINT	S-PBGA-B783		Not Qualified	YES	NO
935313462557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
935256670557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V		0			FLATPACK, LOW PROFILE, FINE PITCH		3 V	75 Cel	0 Cel		QUAD	1.6 mm		12 mm		NO	0	28.6 MHz			SINGLE	12 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G80		Not Qualified	YES	NO
MSC8254SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
935309292557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
MSC8122TVT6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm		YES	32	400 MHz	30	250	MULTIPLE	20 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e2
S56F8013W3MFAE	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
MSC8156ETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40				TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS					Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified			e1
SAA8110G	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V		0			FLATPACK, LOW PROFILE, FINE PITCH		3 V	75 Cel	0 Cel	TIN	QUAD	1.6 mm		12 mm	ALSO REQUIRES ANOTHER 5V SUPPLY	NO	0	28.6 MHz			SINGLE	12 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G80		Not Qualified	YES	NO	e3
935325415557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
935322566557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN SILVER COPPER									40	260														3				e1
MSC8154ESAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8101VT1500F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	332	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA332,19X19,32	1.55 V			TIN SILVER COPPER OVER NICKEL	BOTTOM	3.18 mm	262144	17 mm		YES	64	75 MHz	30	250	SINGLE	17 mm		CMOS		1.6 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified	YES	NO
MSC8254TAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES			30	245	SINGLE	29 mm		CMOS		1 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
935323918557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER
935309348557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
MSC8103M1100F	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	332	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		32	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA332,19X19,32	1.5 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.18 mm	262144	17 mm		YES	64	68.75 MHz	30	220	MULTIPLE	17 mm		CMOS		1.6 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B332	3	Not Qualified	YES	NO	e0
935272948518	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY		YES	3.45 V		0			FLATPACK		3.15 V	85 Cel	-40 Cel		QUAD	2.1 mm		10 mm		NO	0	24.576 MHz			MULTIPLE	10 mm		CMOS		3.3 V					.8 mm	FIXED POINT	S-PQFP-G44			YES	NO
935323055528	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	0	16		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	3 V	105 Cel	-40 Cel	TIN	QUAD	1.6 mm	4096	10 mm		YES	0	8 MHz	40	260	SINGLE	10 mm	5	CMOS		3.3 V		2		FLASH	.5 mm	FIXED POINT	S-PQFP-G64	3		YES	NO	e3	16
MSC8122MP4800	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY		YES				16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM													CMOS					Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
935320987557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
935313443557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
XCB56011BU95	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V		3			FLATPACK, LOW PROFILE, FINE PITCH		4.75 V				QUAD	1.7 mm		14 mm		NO	8	95 MHz			MULTIPLE	14 mm		HCMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified	YES	NO
PC56651GC	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.5 V		22			GRID ARRAY		2.3 V	85 Cel	-40 Cel		BOTTOM	1.75 mm		17 mm		YES	16	16.8 MHz			MULTIPLE	17 mm		CMOS		2.4 V					1 mm	FIXED POINT	S-PBGA-B196		Not Qualified	YES	YES
935309357557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
935310004557	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
MSC8122VT8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		32			GRID ARRAY, FINE PITCH		1.16 V			TIN SILVER	BOTTOM	3.3 mm		20 mm		YES	32	500 MHz	30	250	MULTIPLE	20 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e2
MSC8156VT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES					SINGLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8154TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES	0				MULTIPLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8122TMP6400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.3 mm		20 mm		YES	32	400 MHz	30	250	MULTIPLE	20 mm		CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e0
XCB56364PV100	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	112	LQFP	SQUARE	PLASTIC/EPOXY		YES	3.46 V		18	24	3.3	FLATPACK, LOW PROFILE	QFP112(UNSPEC)	3.14 V	105 Cel	0 Cel		QUAD	1.6 mm	2560	20 mm		YES	8	100 MHz			MULTIPLE	20 mm		CMOS	181 mA	3.3 V			Digital Signal Processors		.65 mm	FIXED POINT	S-PQFP-G112		Not Qualified	YES	YES
MSC8144ETVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm		YES		133 MHz	30	245	MULTIPLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
935320944528	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER																			TIN									40	260														3				e3
MSC8154EESVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm		YES					SINGLE	29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8112TVT2400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.13 V		32	16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,23X23,32	1.07 V				BOTTOM	3.3 mm	114688	20 mm		YES	64	100 MHz	30	250	MULTIPLE	20 mm		CMOS		1.1 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B431	3	Not Qualified	YES	NO	e2

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.