Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
431 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.13 V |
32 |
16 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA431,23X23,32 |
1.07 V |
Tin/Lead/Silver (Sn/Pb/Ag) |
BOTTOM |
3.3 mm |
114688 |
20 mm |
YES |
64 |
100 MHz |
30 |
250 |
MULTIPLE |
20 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B431 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1.2,2.5,3.3 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
105 Cel |
0 Cel |
Tin/Silver (Sn/Ag) |
BOTTOM |
3.176 mm |
32768 |
29 mm |
YES |
133 MHz |
30 |
245 |
MULTIPLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
NO |
NO |
e2 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
0 |
FLATPACK |
3.15 V |
85 Cel |
-40 Cel |
QUAD |
2.1 mm |
10 mm |
NO |
0 |
24.576 MHz |
MULTIPLE |
10 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
S-PQFP-G44 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
332 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.7 V |
32 |
16 |
1.6,3.3 |
GRID ARRAY, FINE PITCH |
BGA357,19X19,50 |
1.55 V |
Tin/Lead/Silver (Sn/Pb/Ag) |
BOTTOM |
3.18 mm |
262144 |
17 mm |
YES |
64 |
75 MHz |
30 |
220 |
SINGLE |
17 mm |
CMOS |
1.6 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B332 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.46 V |
18 |
24 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3.14 V |
105 Cel |
0 Cel |
QUAD |
1.7 mm |
2560 |
14 mm |
YES |
8 |
100 MHz |
MULTIPLE |
14 mm |
CMOS |
181 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1,1.5/1.8,2.5 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
105 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.94 mm |
8192 |
29 mm |
YES |
30 |
245 |
SINGLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
CMOS |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
.97 V |
BOTTOM |
3.94 mm |
29 mm |
YES |
SINGLE |
29 mm |
CMOS |
1 V |
1 mm |
FIXED POINT |
S-PBGA-B783 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
431 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.13 V |
32 |
GRID ARRAY, FINE PITCH |
1.07 V |
105 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
3.3 mm |
20 mm |
YES |
32 |
300 MHz |
30 |
250 |
MULTIPLE |
20 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B431 |
3 |
YES |
NO |
e2 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK |
3 V |
85 Cel |
-40 Cel |
QUAD |
3.2 mm |
14 mm |
NO |
.4 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK |
3 V |
85 Cel |
-40 Cel |
QUAD |
3.2 mm |
14 mm |
NO |
.4 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
0 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
3 V |
105 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
2048 |
10 mm |
YES |
0 |
8 MHz |
40 |
260 |
SINGLE |
10 mm |
5 |
CMOS |
3.3 V |
2 |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
3 |
YES |
NO |
e3 |
16 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN SILVER COPPER |
30 |
245 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1.2,2.5,3.3 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
90 Cel |
0 Cel |
BOTTOM |
3.176 mm |
32768 |
29 mm |
YES |
133 MHz |
30 |
245 |
MULTIPLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
NO |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
332 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.7 V |
32 |
16 |
1.6,3.3 |
GRID ARRAY, FINE PITCH |
BGA332,19X19,32 |
1.5 V |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
3.18 mm |
262144 |
17 mm |
YES |
64 |
62.5 MHz |
30 |
250 |
SINGLE |
17 mm |
CMOS |
1.6 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B332 |
3 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
0 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
2.7 V |
125 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
24K |
10 mm |
YES |
0 |
100 MHz |
40 |
260 |
MULTIPLE |
10 mm |
4 |
CMOS |
101 mA |
3.3 V |
4 |
2 |
FLASH |
.5 mm |
FLOATING POINT |
S-PQFP-G80 |
3 |
YES |
YES |
e3 |
8 |
|||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1,1.5/1.8,2.5 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
TIN SILVER COPPER |
BOTTOM |
3.94 mm |
8192 |
29 mm |
YES |
30 |
245 |
SINGLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
.97 V |
Tin/Silver (Sn/Ag) |
BOTTOM |
3.176 mm |
29 mm |
YES |
133 MHz |
30 |
245 |
MULTIPLE |
29 mm |
CMOS |
1 V |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
NO |
NO |
e2 |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN SILVER COPPER |
30 |
245 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1,1.5/1.8,2.5 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
TIN SILVER COPPER |
BOTTOM |
3.94 mm |
8192 |
29 mm |
YES |
30 |
245 |
SINGLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
.97 V |
Tin/Silver (Sn/Ag) |
BOTTOM |
3.176 mm |
29 mm |
YES |
133 MHz |
30 |
245 |
MULTIPLE |
29 mm |
CMOS |
1 V |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
NO |
NO |
e2 |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
431 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
GRID ARRAY, FINE PITCH |
1.14 V |
105 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
3.3 mm |
20 mm |
YES |
32 |
400 MHz |
30 |
250 |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B431 |
3 |
YES |
NO |
e2 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
4.75 V |
QUAD |
1.7 mm |
14 mm |
NO |
8 |
95 MHz |
MULTIPLE |
14 mm |
HCMOS |
5 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK |
3 V |
85 Cel |
-40 Cel |
QUAD |
3.2 mm |
14 mm |
NO |
.4 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK |
3 V |
85 Cel |
-40 Cel |
QUAD |
3.2 mm |
14 mm |
NO |
.4 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL EXTENDED |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
75 Cel |
0 Cel |
QUAD |
1.6 mm |
12 mm |
NO |
0 |
28.6 MHz |
SINGLE |
12 mm |
CMOS |
5 V |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1.2,2.5,3.3 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
105 Cel |
0 Cel |
Tin/Silver (Sn/Ag) |
BOTTOM |
3.176 mm |
32768 |
29 mm |
YES |
133 MHz |
30 |
245 |
MULTIPLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
NO |
NO |
e2 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
32 |
1,2.5 |
GRID ARRAY |
BGA783,28X28,40 |
.97 V |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.94 mm |
8192 |
29 mm |
YES |
30 |
245 |
SINGLE |
29 mm |
CMOS |
1 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B783 |
3 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN SILVER COPPER |
30 |
245 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL EXTENDED |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
75 Cel |
0 Cel |
QUAD |
1.6 mm |
12 mm |
NO |
0 |
28.6 MHz |
SINGLE |
12 mm |
CMOS |
5 V |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
0 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
3 V |
105 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
2048 |
10 mm |
YES |
0 |
8 MHz |
40 |
260 |
SINGLE |
10 mm |
5 |
CMOS |
3.3 V |
2 |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
3 |
YES |
NO |
e3 |
16 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.