256 Microprocessors 226

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCF54450ACVM180	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES		14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		YES	16		40	260	17 mm	CMOS		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCF53016CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel	-40 Cel		BOTTOM				YES	32	48 MHz	40	260		CMOS				FIXED POINT	S-PBGA-B256	3		240 rpm	YES
MCF53015CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel	-40 Cel		BOTTOM				YES	32	48 MHz				CMOS				FIXED POINT	S-PBGA-B256			240 rpm	YES
MCF53017CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24	32		GRID ARRAY		1.08 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				YES	32	80 MHz	40	260		CMOS				FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF5233CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES
MCF53015CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24	32		GRID ARRAY		1.08 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				YES	32	80 MHz	40	260		CMOS				FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54451VM240	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		YES	32	60 MHz	40	260	17 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF53017CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel	-40 Cel		BOTTOM				YES	32	48 MHz				CMOS				FIXED POINT	S-PBGA-B256			240 rpm	YES
MCF5235CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MPC875CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e1
MPC850CVR66BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32				23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC875CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC870CZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC852TZT50A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	220	23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC875ZT133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e0
MPC850VR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.35 mm	23 mm		YES	32	50 MHz	40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC852TCZT100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V			TIN LEAD SILVER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	220	23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e0
MPC870CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC850DECVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC850SRCVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC852TCVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MC9328MX1DVM20R2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V	25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.8 V	70 Cel	-30 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS	1.9 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES
MC9328MX1VM15R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz			14 mm	CMOS	1.8 V		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES	e1
MPC850DEVR80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32				23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MPC852TCZT50A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	220	23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MC9328MX1DVM20	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V	25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.8 V	70 Cel	-30 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS	1.9 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES
MPC853TVR66A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS	1.8 V		1.27 mm	FIXED POINT	S-PBGA-B256	3		66 rpm	YES	e1
MPC875ZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC850SRVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC852TCVR66A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC875VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e1
MPC850DEZQ80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN LEAD	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e0
MPC870VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MPC850DEVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V			TIN SILVER COPPER	BOTTOM	2.35 mm	23 mm		YES	32	50 MHz	40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MC9328MX1VM20	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V	25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS	1.9 V		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES	e1
MPC870CZT133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e0
MPC850CZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V			TIN LEAD	BOTTOM	2.35 mm	23 mm		YES	32	50 MHz	40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC850DSLVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC852TCVR50A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC850SRZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN LEAD	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC850DSLCVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC875CZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC850DSLCZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V			TIN LEAD	BOTTOM	2.35 mm	23 mm		YES	32	50 MHz	40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC870VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC850CZQ50BUR2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V			TIN LEAD	BOTTOM	2.35 mm	23 mm		YES	32	50 MHz	40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC850DEZQ50BUR2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN LEAD	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC850DEZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel	0 Cel	TIN LEAD	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC853TVR50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32				23 mm	CMOS	1.8 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	50 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.