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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MC9328MX1VM15	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MPC852TZT80A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	220	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e0
MPC852TVR80A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	245	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MPC850DECZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN LEAD		BOTTOM		2.54 mm		23 mm			YES		32		40	260	23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC852TCZT66A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	220	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC852TZT66A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	220	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC870VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e1
MPC875CZT133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e0
MPC850DECVR66BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		40	260	23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC852TCVR80A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	245	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MPC850SRVR80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		40	260	23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MPC853TVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V						BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32				23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	66 rpm	YES
MC9328MXLVM15	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.8 V						.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES	e1
MC9328MX1DVM15	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		-30 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MPC852TVR50A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	245	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC852TVR66A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	245	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC852TZT100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	220	23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e0
MPC853TZT100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm			YES		32		30	220	23 mm		CMOS		1.8 V						1.27 mm	FIXED POINT	S-PBGA-B256	3		100 rpm	YES	e0
MPC853TZT80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V						BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32				23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
MPC850ZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN LEAD SILVER		BOTTOM		2.54 mm		23 mm			YES		32		40	260	23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MC9328MX1VM20R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.9 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES
MPC850SRZQ80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN LEAD		BOTTOM		2.54 mm		23 mm			YES		32				23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e0
MPC875ZT80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e0
MC9328MX1CVM15	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MPC853TVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V						1.27 mm	FIXED POINT	S-PBGA-B256	3		100 rpm	YES	e1
MC9328MXLVM20	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V		25		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.9 V						.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES	e1
MPC870ZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC853TVR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V						BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32				23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
MPC850CVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		40	260	23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC850DECZQ66BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN LEAD		BOTTOM		2.54 mm		23 mm			YES		32				23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
KMPC870ZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN LEAD		BOTTOM		2.54 mm		23 mm			YES		32				23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	66 rpm	YES	e0
MPC850DSLZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN LEAD		BOTTOM		2.54 mm		23 mm			YES		32		40	260	23 mm		CMOS		3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MPC870CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e1
MPC853TZT66A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm			YES		32		30	220	23 mm		CMOS		1.8 V						1.27 mm	FIXED POINT	S-PBGA-B256	3		66.67 rpm	YES	e0
MPC875VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
KMPC875ZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN LEAD		BOTTOM		2.54 mm		23 mm			YES		32				23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	66 rpm	YES	e0
MPC870ZT133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS		1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e0
MPC853TVR100	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V						BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32				23 mm		CMOS		1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	100 rpm	YES
MC9328MX1DVM15R2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		-30 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
XPC823ECZT66BA	Nexperia	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32		GRID ARRAY		3 V	85 Cel		-40 Cel			BOTTOM		2.35 mm		23 mm			YES		32	5 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm		CMOS		3.3 V						1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
TMPR4925XB	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32		64	1.5,3.3	GRID ARRAY	BGA256,20X20,50	1.4 V	70 Cel		0 Cel			BOTTOM		2.52 mm		27 mm			YES		32	20 MHz	30	260	27 mm		CMOS		1.5 V				Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	200 rpm	YES
HD6417750SBP200V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.07 V		26		32		GRID ARRAY		1.8 V	75 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		2.1 mm		27 mm			YES		64	34 MHz			27 mm		CMOS		1.95 V						1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES	e1
R7S721000VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,21X21,20	1.1 V	85 Cel	8	-40 Cel		YES	BOTTOM	YES	1.4 mm	10485760	11 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			11 mm	10485760	CMOS	8-Ch 12-Bit	1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.5 mm	FLOATING POINT	S-PBGA-B256			400 rpm	YES		137
79RC32H434266BC	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		32		32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.1 V	70 Cel		0 Cel	TIN LEAD		BOTTOM		1.7 mm		17 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	125 MHz	20	225	17 mm		CMOS		1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	266 rpm	NO	e0
70RC32T365-150BC	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32		32		GRID ARRAY, LOW PROFILE		2.375 V	70 Cel		0 Cel	TIN LEAD		BOTTOM		1.7 mm		17 mm			YES		32	75 MHz			17 mm		CMOS		2.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	75 rpm	NO	e0
HD6417751RBP240	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26		32		GRID ARRAY		1.4 V	75 Cel		-20 Cel	TIN LEAD		BOTTOM		2.1 mm		27 mm			YES		32	34 MHz			27 mm		CMOS		1.5 V						1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	240 rpm	YES	e0
79RC32H434350BCI	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		32		32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.1 V	85 Cel		-40 Cel	TIN LEAD		BOTTOM		1.7 mm		17 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	125 MHz	20	225	17 mm		CMOS		1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	350 rpm	NO	e0
HD6417751BP167V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V		26		32		GRID ARRAY		1.6 V	75 Cel		-20 Cel			BOTTOM		2.5 mm		27 mm			YES		32	56 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm		CMOS		1.8 V						1.27 mm	FLOATING POINT	S-PBGA-B256			167 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.