256 Microprocessors 226

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MC9328MX1CVM15R2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS			1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5329CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
OSD3358-512M-ISM	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES							GRID ARRAY			85 Cel		-40 Cel			BOTTOM		3.08 mm		21 mm		GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE	YES					245	21 mm		CMOS									1.27 mm		S-PBGA-B256	4		1000 rpm
OSD3358-512M-BSM	Octavo Systems	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	NO	YES							GRID ARRAY	BGA256, 16X16,50		85 Cel		0 Cel			BOTTOM		3.08 mm		21 mm		GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE	YES					245	21 mm		CMOS		2000 mA	1.1 V						1.27 mm	FIXED POINT	S-PBGA-B256	4		1000 rpm	NO
MCF54415CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0		32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel	TIN SILVER		BOTTOM							YES		0	100 MHz	40	260			CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES	e2
MCF5329CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM											40	260										Microprocessors		1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MCF54418CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0		32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel			BOTTOM							YES		0	100 MHz	40	260			CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MCF5328CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54417CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0		32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel			BOTTOM							YES		0	100 MHz	40	260			CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MCF5373LCVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54416CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0		32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel			BOTTOM							YES		0	100 MHz	40	260			CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC852TVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	245	23 mm		CMOS			1.8 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MCF5328CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
MCF54451CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32		32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	60 MHz	40	260	17 mm		CMOS			1.5 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
AM1707DZKBD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm	172032	17 mm			YES		16	30 MHz	30	260	17 mm		CMOS			1.2 V	40			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
MCF53281CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM											40	260										Microprocessors		1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MCF5275CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	83 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32		GRID ARRAY		1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	30	245	23 mm		CMOS			1.8 V						1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MCF53281CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MPC875VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS			1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
R7S721010VCFP	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	1.1 V	85 Cel	8	-40 Cel		YES	QUAD	YES	1.7 mm	5242880	28 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			28 mm	5242880	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.4 mm	FLOATING POINT	S-PQFP-G256			400 rpm	YES		137
MCF5274VM166	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	83 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF54450VM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14		32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		17 mm			YES		16		40	260	17 mm		CMOS							Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
MCF5233CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		17 mm		LOW POWER MODE TAKEN FROM LOW POWER MODE	YES		32	75 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5235CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		17 mm		LOW POWER MODE TAKEN FROM LOW POWER MODE	YES		32	75 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
LUPXA255A0C400	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.43 V		26		32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		2 mm		17 mm			YES		32	3.6864 MHz	40	250	17 mm		CMOS			1.3 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
LUPXA255A0C200	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		26		32	1,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	.95 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2 mm		17 mm			YES		32	3.6864 MHz			17 mm		CMOS			1 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	200 rpm	YES	e1
MC9328MXLVH15	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		0 Cel			BOTTOM		1.6 mm		14 mm			YES		32	16 MHz			14 mm		CMOS			1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256		Not Qualified	150 rpm	YES
XPC850DSLZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26		32		GRID ARRAY		3.135 V	95 Cel		0 Cel			BOTTOM		2.35 mm		23 mm			YES		32				23 mm		CMOS			3.3 V						1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
GDS1110BD	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel		0 Cel			BOTTOM															CMOS							Microprocessors		1 mm		S-PBGA-B256		Not Qualified	206 rpm
LUPXA255A0E400	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.64 V		26		32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		2 mm		17 mm			YES		32	3.6864 MHz	40	250	17 mm		CMOS			1.3 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MCF53016CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24				GRID ARRAY		1.08 V	85 Cel		-40 Cel			BOTTOM							YES		32	48 MHz					CMOS										FIXED POINT	S-PBGA-B256			240 rpm	YES
XPC823ZT66B2	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel			BOTTOM																		3.3 V				Microprocessors		1.27 mm		S-PBGA-B256		Not Qualified	66 rpm
D6417750RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26		32		GRID ARRAY, HEAT SINK/SLUG		1.35 V	85 Cel		-40 Cel			BOTTOM		2.6 mm		27 mm			YES		64	34 MHz			27 mm		CMOS			1.5 V						1.27 mm	FLOATING POINT	S-PBGA-B256	3		240 rpm	YES
MCF54450VM240	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32		32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	60 MHz	40	260	17 mm		CMOS			1.5 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
AM1707DZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13		32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm	172032	17 mm			YES		16	30 MHz	30	260	17 mm		CMOS			1.2 V	40			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707CZKBA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		13		32	1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		32	50 MHz	30	260	17 mm		CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707BZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16		32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		16	20 MHz	30	260	17 mm		CMOS			1.2 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707DZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		13		32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	125 Cel		-40 Cel			BOTTOM		2.05 mm		17 mm			YES		16	30 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS			1.2 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256		Not Qualified	375 rpm	YES
AM1707CZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		13		32	1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		32	50 MHz	30	260	17 mm		CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707DZKB4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm	172032	17 mm			YES		16	30 MHz	30	260	17 mm		CMOS			1.2 V	40			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
AM1707CZKBD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		13		32	1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		32	50 MHz	30	260	17 mm		CMOS			1.3 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
AM1707BZKBA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16		32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		16	20 MHz	30	260	17 mm		CMOS			1.2 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707CZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		13		32	1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		32	50 MHz	30	260	17 mm		CMOS			1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707CZKB4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		13		32	1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		32	50 MHz	30	260	17 mm		CMOS			1.3 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
XAM1707BZKB4	Texas Instruments	MICROPROCESSOR, RISC		BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16		32	1.3,1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V						BOTTOM		2.05 mm		17 mm			YES		16	20 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS		.3 mA	1.2 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256		Not Qualified	456 rpm	YES
AM1707DZKBA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13		32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm	172032	17 mm			YES		16	30 MHz	30	260	17 mm		CMOS			1.2 V	40			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707BZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16		32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		17 mm			YES		16	20 MHz	30	260	17 mm		CMOS			1.2 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.