256 Microprocessors 226

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1707BZKBD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	17 mm		YES	16	20 MHz	30	260	17 mm	CMOS	1.2 V	Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
AM1707BZKB4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	17 mm		YES	16	20 MHz	30	260	17 mm	CMOS	1.2 V	Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
XPC850DEZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
XPC850CZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	-40 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC823ZC66A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC823ZT66A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC850ZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel	0 Cel		BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
SCF5235F4CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B256	3		150 rpm	YES	e1
XPC850SRZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850ZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
XPC850SEZT40	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel	0 Cel		BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	40 rpm
XPC823ZT81A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS	2.5 V			FIXED POINT	S-PBGA-B256			81 rpm	YES
XPC850SRZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC823ZT75A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS	2.5 V			FIXED POINT	S-PBGA-B256			75 rpm	YES
XPC850ZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC823EZT75B2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,23X23,50	3 V		0 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.35 mm	23 mm		YES	32	5 MHz	30	220	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	75 rpm	YES	e0
XPC801ZP40	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		26	32		GRID ARRAY			70 Cel	0 Cel		BOTTOM	3.16 mm	21 mm		YES	32	40 MHz			21 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	40 rpm	YES
XPC850DECZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	-40 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850CZT80B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V				BOTTOM	2.35 mm	23 mm		YES	32	80 MHz			23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
XPC823ZT50Z3	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850SRCZT80B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V				BOTTOM	2.35 mm	23 mm		YES	32	80 MHz			23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
XPC850SEZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel	0 Cel		BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
XPC850DEZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850ZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC823ZC81A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			81 rpm	YES
XPC850ZT40	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel	0 Cel		BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	40 rpm
XPC823ECZT66B2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,23X23,50	3 V		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.35 mm	23 mm		YES	32	5 MHz	30	220	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
XPC823ZT25Z3	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			25 rpm	YES
XPC850SRZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
XPC850DSLCZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	-40 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850DECZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V				BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC823CZT25Z3	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			85 Cel	-40 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			25 rpm	YES
XPC850CZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V				BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC823ZC75A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			70 Cel	0 Cel		BOTTOM				YES						CMOS				FIXED POINT	S-PBGA-B256			75 rpm	YES
XPC823EZT66B2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,23X23,50	3 V		0 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.35 mm	23 mm		YES	32	5 MHz	30	220	23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
XPC801ZP25	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		26	32		GRID ARRAY			70 Cel	0 Cel		BOTTOM	3.16 mm	21 mm		YES	32	25 MHz			21 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	25 rpm	YES
XPC850SRCZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	-40 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850DECZT80B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V				BOTTOM	2.35 mm	23 mm		YES	32	80 MHz			23 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
XPC850DEZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC850SRCZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V				BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
MCF5234CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF54450CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		YES	32	60 MHz	40	260	17 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCF5274CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF53014CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24	32		GRID ARRAY		1.08 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				YES	32	80 MHz	40	260		CMOS				FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54450VM180	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	UNSPECIFIED	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel	0 Cel		BOTTOM	1.6 mm	17 mm		YES	32	60 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS	1.5 V	Microprocessors	1 mm	FIXED POINT	S-XBGA-B256		Not Qualified	180 rpm	YES
MCF53014CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel	-40 Cel		BOTTOM				YES	32	48 MHz				CMOS				FIXED POINT	S-PBGA-B256			240 rpm	YES
MCF5234CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MCF54450AVM240	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES		14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		YES	16		40	260	17 mm	CMOS		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.