Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
26 |
NO |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
1.1 V |
85 Cel |
8 |
-40 Cel |
YES |
QUAD |
YES |
1.7 mm |
10485760 |
28 mm |
0 |
YES |
DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT |
32 |
48 MHz |
28 mm |
10485760 |
CMOS |
8-Ch 12-Bit |
1.18 V |
16 |
YES |
8 |
CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2) |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
400 rpm |
YES |
137 |
|||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY |
1.35 V |
75 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.1 mm |
27 mm |
YES |
32 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
32 |
2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.375 V |
70 Cel |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
90 MHz |
20 |
225 |
17 mm |
CMOS |
2.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY |
1.35 V |
75 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
1.5,3.3 |
GRID ARRAY |
1.35 V |
75 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.1 mm |
27 mm |
YES |
32 |
34 MHz |
27 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
2,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
1.8 V |
75 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.95 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.1 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
125 MHz |
20 |
225 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
266 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.1 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
125 MHz |
20 |
225 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
350 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
32 |
32 |
GRID ARRAY |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
2.6 mm |
27 mm |
IT ALSO OPERATES AT 1.5 V |
YES |
32 |
.032768 MHz |
27 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
240 rpm |
YES |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY |
1.35 V |
75 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY |
1.4 V |
75 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
240 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
1.8 V |
75 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
66.7 MHz |
27 mm |
CMOS |
1.95 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
GRID ARRAY |
1.8 V |
75 Cel |
-20 Cel |
BOTTOM |
2.5 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.95 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
32 |
2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.375 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
90 MHz |
20 |
225 |
17 mm |
CMOS |
2.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY |
1.4 V |
75 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.1 mm |
27 mm |
YES |
32 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY |
1.4 V |
75 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.7 V |
26 |
32 |
GRID ARRAY |
1.4 V |
75 Cel |
-20 Cel |
BOTTOM |
2.5 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
240 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
32 |
GRID ARRAY, LOW PROFILE |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
75 MHz |
17 mm |
CMOS |
2.5 V |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
75 rpm |
NO |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.1 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
125 MHz |
20 |
225 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
300 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
GRID ARRAY |
1.8 V |
75 Cel |
-20 Cel |
BOTTOM |
2.5 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.95 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.1 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
125 MHz |
20 |
225 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
300 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
256 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.6 V |
75 Cel |
-20 Cel |
TIN BISMUTH |
QUAD |
3.95 mm |
28 mm |
YES |
32 |
34 MHz |
28 mm |
CMOS |
1.8 V |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
3 |
Not Qualified |
167 rpm |
YES |
e6 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
256 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.35 V |
75 Cel |
-20 Cel |
TIN LEAD |
QUAD |
3.95 mm |
28 mm |
YES |
32 |
34 MHz |
28 mm |
CMOS |
1.5 V |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.8 V |
75 Cel |
-20 Cel |
BOTTOM |
2.6 mm |
27 mm |
YES |
64 |
67 MHz |
27 mm |
CMOS |
1.95 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
GRID ARRAY |
1.8 V |
75 Cel |
-20 Cel |
BOTTOM |
2.5 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.95 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
256 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.35 V |
75 Cel |
-20 Cel |
TIN BISMUTH |
QUAD |
3.95 mm |
28 mm |
YES |
32 |
34 MHz |
28 mm |
CMOS |
1.5 V |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
3 |
Not Qualified |
200 rpm |
YES |
e6 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
32 |
2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.375 V |
70 Cel |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
90 MHz |
20 |
225 |
17 mm |
CMOS |
2.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
256 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.6 V |
75 Cel |
-20 Cel |
TIN LEAD |
QUAD |
3.95 mm |
28 mm |
YES |
32 |
34 MHz |
28 mm |
CMOS |
1.8 V |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
Not Qualified |
167 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
256 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.4 V |
75 Cel |
-20 Cel |
TIN LEAD |
QUAD |
3.95 mm |
28 mm |
YES |
32 |
34 MHz |
28 mm |
CMOS |
1.5 V |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
Not Qualified |
240 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.1 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
17 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
125 MHz |
20 |
225 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
400 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROCONTROLLER, RISC |
GULL WING |
256 |
LQFP |
RECTANGULAR |
YES |
3.6 V |
22 |
NO |
32 |
FLATPACK, FINE PITCH |
3 V |
125 Cel |
SH7000 |
-40 Cel |
YES |
QUAD |
YES |
1048576 |
28 mm |
0 |
DMA(4), TIMER, WDT |
16 |
40 mm |
49152 |
3-Ch 10-Bit |
3.3 V |
YES |
CAN(2), SCI(5) |
FLASH |
.5 mm |
80 rpm |
8 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
256 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.4 V |
75 Cel |
-20 Cel |
TIN BISMUTH |
QUAD |
3.95 mm |
28 mm |
YES |
32 |
34 MHz |
28 mm |
CMOS |
1.5 V |
.4 mm |
FLOATING POINT |
S-PQFP-G256 |
3 |
Not Qualified |
240 rpm |
YES |
e6 |
|||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
0 |
32 |
GRID ARRAY |
1.6 V |
65 Cel |
-20 Cel |
BOTTOM |
1.97 mm |
NO |
0 |
14.7456 MHz |
CMOS |
1.8 V |
1 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.63 V |
0 |
32 |
GRID ARRAY |
2.38 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.3 mm |
27 mm |
ALSO OPERATES AT 1.8V SUPPLY AT 50 MHZ |
YES |
0 |
85 MHz |
30 |
225 |
27 mm |
CMOS |
2.5 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
85 rpm |
YES |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.