256 Microprocessors 226

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

R7S721000VCFP

Renesas Electronics

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

26

NO

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

1.1 V

85 Cel

8

-40 Cel

YES

QUAD

YES

1.7 mm

10485760

28 mm

0

YES

DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT

32

48 MHz

28 mm

10485760

CMOS

8-Ch 12-Bit

1.18 V

16

YES

8

CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)

.4 mm

FLOATING POINT

S-PQFP-G256

400 rpm

YES

137

HD6417751RBP200V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

GRID ARRAY

1.35 V

75 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

2.1 mm

27 mm

YES

32

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

200 rpm

YES

e1

79RC32T336180BC

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.625 V

32

32

2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

2.375 V

70 Cel

0 Cel

Tin/Lead (Sn63Pb37)

BOTTOM

1.7 mm

17 mm

YES

32

90 MHz

20

225

17 mm

CMOS

2.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

180 rpm

YES

e0

HD6417750RBP200

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

GRID ARRAY

1.35 V

75 Cel

-20 Cel

TIN LEAD

BOTTOM

2.1 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

200 rpm

YES

e0

HD6417751RBP200

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

1.5,3.3

GRID ARRAY

1.35 V

75 Cel

-20 Cel

TIN LEAD

BOTTOM

2.1 mm

27 mm

YES

32

34 MHz

27 mm

CMOS

1.5 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

200 rpm

YES

e0

HD6417750SBP200

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.07 V

26

32

2,3.3

GRID ARRAY

BGA256,20X20,50

1.8 V

75 Cel

-20 Cel

TIN LEAD

BOTTOM

2.1 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.95 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

200 rpm

YES

e0

79RC32H434266BCI

Renesas Electronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1.1 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.7 mm

17 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

125 MHz

20

225

17 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

266 rpm

NO

e0

79RC32H434350BC

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1.1 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.7 mm

17 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

125 MHz

20

225

17 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

350 rpm

NO

e0

D6417751RBA240HVU0

Renesas Electronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

32

32

GRID ARRAY

3 V

85 Cel

-40 Cel

BOTTOM

2.6 mm

27 mm

IT ALSO OPERATES AT 1.5 V

YES

32

.032768 MHz

27 mm

CMOS

3.3 V

1.27 mm

FLOATING POINT

S-PBGA-B256

3

240 rpm

YES

HD6417750RBP200V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

GRID ARRAY

1.35 V

75 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

2.1 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

200 rpm

YES

e1

HD6417750RBP240

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

GRID ARRAY

1.4 V

75 Cel

-20 Cel

TIN LEAD

BOTTOM

2.1 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

240 rpm

YES

e0

HD6417750BP200

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.07 V

26

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.8 V

75 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

2.1 mm

27 mm

YES

64

66.7 MHz

27 mm

CMOS

1.95 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

200 rpm

YES

e1

HD6417750BP200MV

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.07 V

26

32

GRID ARRAY

1.8 V

75 Cel

-20 Cel

BOTTOM

2.5 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.95 V

1.27 mm

FLOATING POINT

S-PBGA-B256

200 rpm

YES

79RC32T336180BCI

Renesas Electronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.625 V

32

32

2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

2.375 V

85 Cel

-40 Cel

Tin/Lead (Sn63Pb37)

BOTTOM

1.7 mm

17 mm

YES

32

90 MHz

20

225

17 mm

CMOS

2.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

180 rpm

YES

e0

HD6417751RBP240V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

GRID ARRAY

1.4 V

75 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

2.1 mm

27 mm

YES

32

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

240 rpm

YES

e1

HD6417750RBP240V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

GRID ARRAY

1.4 V

75 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

2.1 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

240 rpm

YES

e1

HD6417750RBA240HV

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.7 V

26

32

GRID ARRAY

1.4 V

75 Cel

-20 Cel

BOTTOM

2.5 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B256

240 rpm

YES

70RC32T365-150BCI

Renesas Electronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.625 V

32

32

GRID ARRAY, LOW PROFILE

2.375 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.7 mm

17 mm

YES

32

75 MHz

17 mm

CMOS

2.5 V

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

75 rpm

NO

e0

79RC32H434300BC

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1.1 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.7 mm

17 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

125 MHz

20

225

17 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

300 rpm

NO

e0

HD6417750SBA200V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.07 V

26

32

GRID ARRAY

1.8 V

75 Cel

-20 Cel

BOTTOM

2.5 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.95 V

1.27 mm

FLOATING POINT

S-PBGA-B256

200 rpm

YES

79RC32H434300BCI

Renesas Electronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1.1 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.7 mm

17 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

125 MHz

20

225

17 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

300 rpm

NO

e0

HD6417751F167V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

GULL WING

256

FQFP

SQUARE

PLASTIC/EPOXY

YES

YES

2 V

26

32

FLATPACK, FINE PITCH

1.6 V

75 Cel

-20 Cel

TIN BISMUTH

QUAD

3.95 mm

28 mm

YES

32

34 MHz

28 mm

CMOS

1.8 V

.4 mm

FLOATING POINT

S-PQFP-G256

3

Not Qualified

167 rpm

YES

e6

HD6417751RF200

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

GULL WING

256

FQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

FLATPACK, FINE PITCH

1.35 V

75 Cel

-20 Cel

TIN LEAD

QUAD

3.95 mm

28 mm

YES

32

34 MHz

28 mm

CMOS

1.5 V

.4 mm

FLOATING POINT

S-PQFP-G256

Not Qualified

200 rpm

YES

e0

HD6417750SBA200VU0

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.07 V

26

32

GRID ARRAY, HEAT SINK/SLUG

1.8 V

75 Cel

-20 Cel

BOTTOM

2.6 mm

27 mm

YES

64

67 MHz

27 mm

CMOS

1.95 V

1.27 mm

FLOATING POINT

S-PBGA-B256

3

200 rpm

YES

HD6417750BP200M

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.07 V

26

32

GRID ARRAY

1.8 V

75 Cel

-20 Cel

BOTTOM

2.5 mm

27 mm

YES

64

34 MHz

27 mm

CMOS

1.95 V

1.27 mm

FLOATING POINT

S-PBGA-B256

200 rpm

YES

HD6417751RF200V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

GULL WING

256

FQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

FLATPACK, FINE PITCH

1.35 V

75 Cel

-20 Cel

TIN BISMUTH

QUAD

3.95 mm

28 mm

YES

32

34 MHz

28 mm

CMOS

1.5 V

.4 mm

FLOATING POINT

S-PQFP-G256

3

Not Qualified

200 rpm

YES

e6

79RC32T365180BC

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.625 V

32

32

2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

2.375 V

70 Cel

0 Cel

Tin/Lead (Sn63Pb37)

BOTTOM

1.7 mm

17 mm

YES

32

90 MHz

20

225

17 mm

CMOS

2.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

180 rpm

YES

e0

HD6417751F167

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

GULL WING

256

FQFP

SQUARE

PLASTIC/EPOXY

YES

YES

2 V

26

32

FLATPACK, FINE PITCH

1.6 V

75 Cel

-20 Cel

TIN LEAD

QUAD

3.95 mm

28 mm

YES

32

34 MHz

28 mm

CMOS

1.8 V

.4 mm

FLOATING POINT

S-PQFP-G256

Not Qualified

167 rpm

YES

e0

HD6417751RF240

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

GULL WING

256

FQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

FLATPACK, FINE PITCH

1.4 V

75 Cel

-20 Cel

TIN LEAD

QUAD

3.95 mm

28 mm

YES

32

34 MHz

28 mm

CMOS

1.5 V

.4 mm

FLOATING POINT

S-PQFP-G256

Not Qualified

240 rpm

YES

e0

79RC32H434400BC

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1.1 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.7 mm

17 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

125 MHz

20

225

17 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

400 rpm

NO

e0

R4F70580SCK80FPV

Renesas Electronics

MICROCONTROLLER, RISC

GULL WING

256

LQFP

RECTANGULAR

YES

3.6 V

22

NO

32

FLATPACK, FINE PITCH

3 V

125 Cel

SH7000

-40 Cel

YES

QUAD

YES

1048576

28 mm

0

DMA(4), TIMER, WDT

16

40 mm

49152

3-Ch 10-Bit

3.3 V

YES

CAN(2), SCI(5)

FLASH

.5 mm

80 rpm

8

HD6417751RF240V

Renesas Electronics

MICROPROCESSOR, RISC

COMMERCIAL EXTENDED

GULL WING

256

FQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

26

32

FLATPACK, FINE PITCH

1.4 V

75 Cel

-20 Cel

TIN BISMUTH

QUAD

3.95 mm

28 mm

YES

32

34 MHz

28 mm

CMOS

1.5 V

.4 mm

FLOATING POINT

S-PQFP-G256

3

Not Qualified

240 rpm

YES

e6

AAEC-2000

Broadcom

MICROPROCESSOR

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2 V

0

32

GRID ARRAY

1.6 V

65 Cel

-20 Cel

BOTTOM

1.97 mm

NO

0

14.7456 MHz

CMOS

1.8 V

1 mm

FIXED POINT

S-PBGA-B256

Not Qualified

200 rpm

YES

L9A0212

Broadcom

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.63 V

0

32

GRID ARRAY

2.38 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.3 mm

27 mm

ALSO OPERATES AT 1.8V SUPPLY AT 50 MHZ

YES

0

85 MHz

30

225

27 mm

CMOS

2.5 V

1.27 mm

FIXED POINT

S-PBGA-B256

Not Qualified

85 rpm

YES

e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.