FBGA Microprocessors 830

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

T1013NSE7MQA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

P1010NXN5HHA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

800 rpm

NO

e2

P1010CSN5HHA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

800 rpm

NO

P1014NSN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

3

667 rpm

YES

e2

P1014NXE5FHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

T1022NSE7PQA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

32

GRID ARRAY, FINE PITCH

.97 V

BOTTOM

2.07 mm

23 mm

YES

64

133.3 MHz

NOT SPECIFIED

NOT SPECIFIED

23 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B780

1400 rpm

YES

P1010CXN5KHA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

1000 rpm

NO

P1014NXE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

3

667 rpm

YES

e2

P1014PXE5FHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

P1010CSN5FFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

667 rpm

NO

P1014CSN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

P1014PSN5FFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

P1010CXE5DFB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

533 rpm

NO

MCIMX6DP6AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

26

32

GRID ARRAY, FINE PITCH

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

YES

64

40

260

21 mm

CMOS

.8 mm

FLOATING POINT

S-PBGA-B624

3

1000 rpm

YES

e1

P1010NSN5DFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

1

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B425

3

Not Qualified

533 rpm

NO

e2

P1010CXE5DHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

533 rpm

NO

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

533 rpm

NO

e2

P1010NSN5HFB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

3

800 rpm

NO

e2

P1010NSN5KHA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

1000 rpm

NO

P1010CSE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

667 rpm

NO

MCIMX6QP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

P1014CSN5HFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

800 rpm

YES

e2

P1014NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

3

667 rpm

YES

e2

T2081NSE8TTB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY, FINE PITCH

.995 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.61 mm

23 mm

YES

64

30

250

23 mm

CMOS

1.025 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1800 rpm

YES

e1

P1014PSE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

T1022NSN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

32

GRID ARRAY, FINE PITCH

.97 V

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

133.3 MHz

30

250

23 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1200 rpm

YES

e1

P1014CXN5FHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

P1014PSN5FHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

MCIMX6QP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

26

32

GRID ARRAY, FINE PITCH

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

YES

64

40

260

21 mm

CMOS

.8 mm

FLOATING POINT

S-PBGA-B624

3

1000 rpm

YES

e1

P1014NXE5FHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

667 rpm

YES

e2

T1023NSN7KQA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

T1042NXN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

32

GRID ARRAY, FINE PITCH

.97 V

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

133.3 MHz

30

250

23 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1500 rpm

YES

e1

LS1043AXE7QQB

NXP Semiconductors

SoC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

.93 V

16

64

GRID ARRAY, FINE PITCH

.87 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

21 mm

ALSO OPERATES AT 1V NOMINAL SUPPLY

YES

32

30

250

21 mm

CMOS

.9 V

.8 mm

FIXED POINT

S-PBGA-B621

3

1600 rpm

YES

e1

P1010NXE5KFA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

1000 rpm

NO

T1022NXE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

32

GRID ARRAY, FINE PITCH

.97 V

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

133.3 MHz

30

250

23 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1500 rpm

YES

e1

P1014CSE5HFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

800 rpm

YES

e2

P1014PSN5HFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

800 rpm

YES

e2

T1022NSE7MQB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

32

GRID ARRAY, FINE PITCH

.97 V

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

133.3 MHz

30

250

23 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1200 rpm

YES

e1

P1010NSE5HFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

1

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B425

3

Not Qualified

800 rpm

NO

e2

LS1043ASE7QQB

NXP Semiconductors

SoC

OTHER

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

.93 V

16

64

GRID ARRAY, FINE PITCH

.87 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

21 mm

ALSO OPERATES AT 1V NOMINAL SUPPLY

YES

32

30

250

21 mm

CMOS

.9 V

.8 mm

FIXED POINT

S-PBGA-B621

3

1600 rpm

YES

e1

P1014PSE5HHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

800 rpm

YES

e2

P1014CSN5DHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

533 rpm

YES

e2

P1010CXE5HFA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

-40 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

800 rpm

NO

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

P1014PSE5HHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY, FINE PITCH

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.9 mm

19 mm

YES

0

100 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B425

800 rpm

YES

e2

T1023NSE7KNA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

0 Cel

BOTTOM

2.07 mm

19 mm

YES

32

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

1000 rpm

YES

T2081NSN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY, FINE PITCH

.995 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.61 mm

23 mm

YES

64

30

250

23 mm

CMOS

1.025 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1800 rpm

YES

e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.