FBGA Microprocessors 830

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P1010CSN5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1014NXN5HFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V					BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425	3		800 rpm	YES	e2
P1014NXN5DHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			533 rpm	YES	e2
T1042NSE7WQA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
P1010NSN5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
T1022NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
P1010CSN5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
P1010CSE5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010CSE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
P1010CSN5HFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
P1010NSN5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	667 rpm	NO	e2
T1013NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
P1010NSE5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	1000 rpm	NO	e2
T2081NXN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
LS1020ASE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		800 rpm	YES	e1
P1014NSN5FFA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V					BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			667 rpm	YES
T1022NSE7MQA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780			1200 rpm	YES
T2081NSN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1533 rpm	YES	e1
P1014PXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
P1010NXE5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010CXE5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
T1022NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES
P1014PSE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			533 rpm	YES	e2
P1014PSN5DHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			533 rpm	YES	e2
P1014PSE5FHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			667 rpm	YES	e2
P1010CSE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
T1042NSE7MQA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780			1200 rpm	YES
P1010CSN5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1014PSE5FFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V				TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			667 rpm	YES	e2
T1013NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
P1010NSN5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
MCIMX6DP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS						.8 mm		S-PBGA-B624	3				e1
T1042NSN7WQA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
P1010NSE5DHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1010NSE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
T1022NSE7WQA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	23 mm		YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
P1010CXN5KFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
P1014CXE5DHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			533 rpm	YES	e2
P1014CXN5DHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			533 rpm	YES	e2
P1010CSN5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1010NXN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
MCIMX31LCVKN5DR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	457	FBGA	SQUARE	PLASTIC/EPOXY		YES				1.2/1.5,1.8/3.3	GRID ARRAY, FINE PITCH	BGA457,26X26,20		85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM							40	260							Microprocessors	.5 mm		S-PBGA-B457	3	Not Qualified			e1
P1010CXN5KHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
P1014NXE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V					BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425	3		533 rpm	YES	e2
P1010CXN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
MCIMX6QP4AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS						.8 mm		S-PBGA-B624	3				e1
P1010NSE5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1014PXN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425			667 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.