FBGA Microprocessors 830

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCIMX537CVP8C2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel		BOTTOM	1.85 mm	147456	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.1 V	32	52			.8 mm	FLOATING POINT	S-PBGA-B529	3		800 rpm	YES
MCIMX535DVP1C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8		26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel		-20 Cel		BOTTOM	1.85 mm	147456	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.25 V		5			.8 mm	FLOATING POINT	S-PBGA-B529	3		1000 rpm	YES
AM3894CCYGA120	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72		Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
MCIMX537CVV8CR2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16	32	1.1,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32	27 MHz	40	260	19 mm	CMOS		1.1 V			Graphics Processors		.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2
AM3894CCYG120	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72		Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
AM5728BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MCIMX537CVV8C	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	.9 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm	73728	19 mm	1.1V NOMIVAL AVAILABLE WITH 800MHZ	YES	32	27 MHz	40	260	19 mm	CMOS	1450 mA	.95 V		2		CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB	.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2	19
P1010NXE5KHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		1000 rpm	NO	e2
AM5728BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5728BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
P1010NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
P1010NXE5HFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
P1010NXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P1010NXE5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	1000 rpm	NO	e2
AM3894CCYG135	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72		Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
P1010NXE5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010NXE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P1010NXE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
MCIMX535DVP2C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8		26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.3 V	85 Cel		-20 Cel		BOTTOM	1.85 mm	147456	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.35 V		5			.8 mm	FLOATING POINT	S-PBGA-B529	3		1200 rpm	YES
P1010NXE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
P1010NXE5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS							.8 mm		S-PBGA-B624	3				e1
AT91SAM9X25-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	16 MHz			15 mm	CMOS		1 V	16		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AM6442BSDGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1
TDA4VM88TGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		26			.8 mm	FLOATING-POINT	S-PBGA-B827	3		2000 rpm	YES	e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS							.8 mm		S-PBGA-B624	3				e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY, FINE PITCH			105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		25 mm		NO			30	250	25 mm	CMOS							.8 mm	FIXED POINT	S-PBGA-B896	3		1800 rpm	NO	e1
XAM5718AABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5726BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
T1042NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
TDA4VM88TGBALFR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		26			.8 mm	FLOATING-POINT	S-PBGA-B827	3		2000 rpm	YES	e1
AM6442BSEFGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
AM3874CCYEA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	786432	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	64		Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	800 rpm	YES	e1
AM6411BSCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
P1014NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY, FINE PITCH		.95 V				TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	0	100 MHz	40	260	19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B425	3		800 rpm	YES	e2
AM5726BABCXAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM6411BKCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
AM5726BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
TMS320DM8148CCYEA0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.2 V	72		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5			.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
AM1707DZKBD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		13	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	172032	17 mm		YES	16	30 MHz	30	260	17 mm	CMOS		1.2 V	40		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
AM5729BABCXEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
LS1020AXN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.