FBGA Microprocessors 830

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

S3C2400XX-YE

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA208,16X16,25

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.635 mm

S-PBGA-B208

Not Qualified

133 rpm

S3C24A0XX-YA

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

337

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2

GRID ARRAY, FINE PITCH

BGA337,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

1.2 V

Microprocessors

.5 mm

S-PBGA-B337

Not Qualified

40 rpm

S3C2412X26-YO80

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

20 rpm

S3C2413X26-YQ80

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

289

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA289,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B289

Not Qualified

266 rpm

S3C2460B01-YL8Z

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA400,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.5 mm

S-PBGA-B400

Not Qualified

40 rpm

S3C2460B01-YL7Z

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA400,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.5 mm

S-PBGA-B400

Not Qualified

40 rpm

S3C2410AXX-YO-20

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

200 rpm

S3C2440X01-YQ

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

289

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA289,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B289

Not Qualified

400 rpm

S3C2410AXX-YO

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

266 rpm

S3C2410AXX-YO-26

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

2,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

266 rpm

S3C2412X20-YO8N

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

20 rpm

S3C2410X-YO

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

203 rpm

S3C44B0XX-YD

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

160

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

2.5,3.3

GRID ARRAY, FINE PITCH

BGA160,14X14,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B160

Not Qualified

66 rpm

S3C2410XX-YO

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

203 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.